PolarTM Power MOSFET
HiPerFETTM
IXFL44N100P
VDSS
ID25
RDS(on)
trr
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
=
=
≤
≤
1000V
22A
Ω
240mΩ
300ns
ISOPLUS i5-PakTM (HV)
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25°C to 150°C
1000
V
VDGR
TJ = 25°C to 150°C, RGS = 1MΩ
1000
V
VGSS
Continuous
± 30
V
VGSM
Transient
± 40
V
ID25
TC = 25°C
IDM
TC = 25°C, pulse width limited by TJM
IAR
22
A
110
A
TC = 25°C
22
A
EAS
TC = 25°C
2
J
dV/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
15
V/ns
PD
TC = 25°C
357
W
-55 ... +150
°C
Features
TJM
150
°C
• Silicon chip on Direct-Copper-Bond
Tstg
-55 ... +150
°C
TJ
G
S
D
G = Gate
S = Source
TL
Maximum lead temperature for soldering
300
°C
TSOLD
Plastic body for 10s
260
°C
VISOL
50/60 Hz, RMS, 1 minute
2500
V~
•
•
•
IISOL ≤ 1mA
3000
V~
•
40..120/4.5..27
N/lb.
8
g
FC
t = 1s
Mounting force
Weight
Characteristic Values
Min.
Typ. Max.
BVDSS
VGS = 0V, ID = 3mA
1000
VGS(th)
VDS = VGS, ID = 1mA
3.5
IGSS
VGS = ± 30V, VDS = 0V
IDSS
VDS = VDSS
VGS = 0V
RDS(on)
VGS = 10V, ID = 22A, Note 1
TJ = 125°C
© 2008 IXYS CORPORATION, All rights reserved
V
6.5
V
± 200
nA
50 μA
3 mA
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
Low drain to tab capacitance(
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