HiPerFETTM Power MOSFETs
Single DieMOSFET
IXFN 34N80
N-Channel Enhancement Mode
Avalanche Rated, High dv/dt, Low trr
VDSS = 800 V
ID25 = 34 A
RDS(on) = 0.24 W
D
trr £ 250 ns
Preliminary data sheet
S
Symbol
Test Conditions
Maximum Ratings
VDSS
T J = 25°C to 150°C
800
V
VDGR
T J = 25°C to 150°C; RGS = 1 MW
800
V
VGS
VGSM
Continuous
Transient
±20
±30
V
V
ID25
IDM
IAR
TC = 25°C
TC = 25°C, pulse width limited by TJM
34
136
34
A
A
A
EAR
EAS
TC = 25°C
TC = 25°C
64
3
mJ
J
dv/dt
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS,
5
V/ns
600
W
-55 ... +150
°C
TJM
150
°C
Tstg
-55 ... +150
°C
300
°C
2500
3000
V~
V~
miniBLOC, SOT-227 B
E153432
S
G
S
D
G = Gate
S = Source
D = Drain
Either Source terminal of miniBLOC can be used
as Main or Kelvin Source
TJ £ 150°C, RG = 2 W
PD
TC = 25°C
TJ
TL
1.6 mm (0.063 in) from case for 10 s
VISOL
50/60 Hz, RMS
IISOL£ 1 mA
Md
Mounting torque
Terminal connection torque
t = 1 min
t=1s
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
Weight
Symbol
VDSS
VGS(th)
30
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min.
typ.
max.
VGS = 0 V, ID = 3 mA
VDSS temperature coefficient
800
VGS = ±20 VDC, VDS = 0
IDSS
VDS = VDSS
VGS = 0 V
RDS(on)
VGS = 10 V, ID = 0.5 • ID25
Pulse test, t £ 300 ms,
duty cycle d £ 2 %
3.0
5.0
V
%/K
±200
nA
100
2
mA
mA
0.24
W
-0.214
TJ = 25°C
TJ = 125°C
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
V
%/K
0.096
VDS = VGS, ID = 8 mA
VGS(th) temperature coefficient
IGSS
g
Features
· International standard packages
· miniBLOC, with Aluminium nitride
isolation
· Low RDS (on) HDMOSTM process
· Rugged polysilicon gate cell structure
· Unclamped Inductive Switching (UIS)
rated
· Low package inductance
· Fast intrinsic Rectifier
Applications
· DC-DC converters
· Battery chargers
· Switched-mode and resonant-mode
power supplies
· DC choppers
· Temperature and lighting controls
Advantages
· Easy to mount
· Space savings
· High power density
98529D (6/99)
1-4
IXFN 34N80
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
gfs
VDS = 10 V; ID = 0.5 • ID25, pulse test
C iss
Coss
VGS = 0 V, VDS = 25 V, f = 1 MHz
C rss
td(on)
tr
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
td(off)
RG = 1 W (External)
tf
Qg(on)
Qgs
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
20
35
S
7500
pF
920
pF
220
pF
45
ns
45
ns
M4 screws (4x) supplied
100
ns
Dim.
40
ns
270
31.88
8.20
1.240
0.307
1.255
0.323
nC
C
D
4.09
4.09
4.29
4.29
0.161
0.161
0.169
0.169
60
nC
E
F
4.09
14.91
4.29
15.11
0.161
0.587
0.169
0.595
140
nC
G
H
30.12
38.00
30.30
38.23
1.186
1.496
1.193
1.505
K/W
J
K
11.68
8.92
12.22
9.60
0.460
0.351
0.481
0.378
K/W
L
M
0.76
12.60
0.84
12.85
0.030
0.496
0.033
0.506
K/W
N
O
25.15
1.98
25.42
2.13
0.990
0.078
1.001
0.084
K/W
P
Q
4.95
26.54
5.97
26.90
0.195
1.045
0.235
1.059
R
S
3.94
4.72
4.42
4.85
0.155
0.186
0.174
0.191
T
U
24.59
-0.05
25.07
0.1
0.968
-0.002
0.987
0.004
0.15
RthJC
0.21
0.05
Source-Drain Diode
Symbol
Test Conditions
IS
VGS = 0 V
ISM
VSD
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
34
A
Repetitive;
pulse width limited by TJM
136
A
IF = IS, VGS = 0 V,
Pulse test, t £ 300 ms, duty cycle d £ 2 %
1.5
V
250
400
ns
ns
mC
A
trr
IF = IS, -di/dt = 100 A/ms, VR = 100 V
QRM
IRM
© 2000 IXYS All rights reserved
Inches
Min.
Max.
31.50
7.80
0.22
RthCK
Millimeter
Min.
Max.
A
B
RthJC
RthCK
miniBLOC, SOT-227 B
T J = 25°C
TJ = 125°C
T J = 25°C
1.4
10
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592
4,881,106
5,017,508
5,049,961
5,187,117
5,486,715
4,850,072
4,931,844
5,034,796
5,063,307
5,237,481
5,381,025
2-4
IXFN 34N80
40
40
ID - Amperes
32
VGS = 9V
8V
7V
6V
TJ = 125OC
5V
32
ID - Amperes
TJ =
25OC
24
16
4V
8
0
2
4
6
8
16
4V
8
10
0
4
8
Figure 1. Output Characteristics at 25OC
RDS(ON) - Normalized
RDS(ON) - Normalized
2.0
TJ = 125OC
1.8
1.6
1.4
1.2
TJ = 25OC
1.0
10
20
30
40
VGS = 10V
2.0
1.8
ID = 34A
1.6
ID =17A
1.4
1.2
1.0
25
50
50
ID - Amperes
Figure 4.
RDS(on) normalized to 0.5 ID25 value
vs. ID
40
40
32
32
24
16
8
-50
75
100
0
25
50
75
100 125 150
T C - Degrees C
Figure 5. Drain Current vs. Case Temperature
© 2000 IXYS All rights reserved
150
RDS(on) normalized to 0.5 ID25
value vs. TJ
24
TJ = 125oC
16
TJ = 25oC
8
-25
125
T J - Degrees C
ID - Amperes
ID - Amperes
Figure 3.
0
20
2.2
VGS = 10V
0
16
Figure 2. Output Characteristics at
125OC
2.4
0.8
12
VDS - Volts
VDS - Volts
2.2
5V
24
0
0
VGS = 9V
8V
7V
6V
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VGS - Volts
Figure 6. Admittance Curves
3-4
IXFN 34N80
12
10000
8
Capacitance - pF
10
VGS - Volts
C ISS
V DS = 400V
ID = 17A
IG = 10mA
6
4
f = 1MHz
C OSS
1000
C RSS
2
0
0
50
100
100 150 200 250 300 350 400
0
5
10
Gate Charge - nC
15
20
25
30
35
40
V DS - Volts
Figure 8. Capacitance Curves
Figure 7. Gate Charge
80
100
0.
40
ID - Amperes
ID - Amperes
60
TJ = 125 OC
20
10
1
10
25OOC
C
TTJJ == 25
1
D
TJ = 25OC
0
0.2
0.4
0.6
0.8
1.0
1.2
0.1
1.4
10
V SD - Volts
1 00
1 000
V DS - Volts
Figure 8. Forward Voltage Drop of the Intrinsic Diode
R(th)JC - K/W
1.000
0.100
0.010
Single Pulse
0.001
10 -4
10 -3
10 -2
10 -1
10 0
Pulse Width - Seconds
Figure 9. Transient Thermal Resistance
© 2000 IXYS All rights reserved
4-4
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.