IXFN520N075T2
TrenchT2TM
GigaMOSTM HiperFETTM
Power MOSFET
VDSS
ID25
75V
480A
1.9m
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
miniBLOC, SOT-227
E153432
S
Symbol
Test Conditions
VDSS
TJ = 25C to 175C
75
V
VDGR
TJ = 25C to 175C, RGS = 1M
75
V
VGSS
VGSM
Continuous
Transient
20
30
V
V
ID25
TC = 25C (Chip Capability)
IL(RMS)
=
=
Maximum Ratings
480
External Lead Current Limit
G
S
D
A
200
A
1500
A
TC = 25C
TC = 25C
200
3
A
J
TC = 25C
940
W
Either Source Terminal S can be used as
the Source Terminal or the Kelvin Source
( Gate Return ) Terminal.
-55 ... +175
175
-55 ... +175
C
C
C
Features
2500
3000
V~
V~
1.5/13
1.3/11.5
Nm/lb.in.
Nm/lb.in.
30
g
IDM
TC = 25C, Pulse Width Limited by TJM
IA
EAS
PD
TJ
TJM
Tstg
VISOL
50/60 Hz, RMS
IISOL 1mA
t = 1 minute
t = 1 second
Md
Mounting Torque
Terminal Connection Torque
Weight
G = Gate
S = Source
D = Drain
International Standard Package
miniBLOC, with Aluminium Nitride
Isolation
175°C Operating Temperature
Isolation Voltage 2500 V~
High Current Handling Capability
Fast Intrinsic Diode
Avalanche Rated
Low RDS(on)
Advantages
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 3mA
75
VGS(th)
VDS = VGS, ID = 8mA
2.5
IGSS
VGS = 20V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
© 2018 IXYS CORPORATION, All Rights Reserved
V
5.0
V
200
nA
TJ = 150C
VGS = 10V, ID = 100A, Note 1
1.5
Easy to Mount
Space Savings
High Power Density
Applications
25 A
2 mA
1.9 m
DC-DC Converters and Off-Line UPS
Primary-Side Switch
High Speed Power Switching
Applications
DS100193B(4/18)
IXFN520N075T2
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
65
VDS = 10V, ID = 60A, Note 1
105
S
41
nF
4150
pF
530
pF
1.36
48
ns
36
ns
80
ns
35
ns
545
nC
177
nC
135
nC
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
RGi
td(on)
tr
td(off)
tf
Gate Input Resistance
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 200A
RG = 1 (External)
Qg(on)
Qgs
SOT-227B (IXFN) Outline
VGS = 10V, VDS = 0.5 • VDSS, ID = 260A
Qgd
(M4 screws (4x) supplied)
0.16 C/W
RthJC
RthCS
0.05
C/W
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min. Typ.
Max.
IS
VGS = 0V
ISM
Repetitive, Pulse Width Limited by TJM
VSD
IF = 100A, VGS = 0V, Note 1
trr
IRM
IF = 150A, VGS = 0V
QRM
-di/dt = 100A/s
VR = 37.5V
520
A
1600
A
1.25
V
7
150 ns
A
357
nC
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFN520N075T2
o
o
Fig. 2. Extended Output Characteristics @ TJ = 25 C
Fig. 1. Output Characteristics @ TJ = 25 C
350
350
VGS = 15V
VGS = 15V
10V
9V
300
250
250
8V
I D - Amperes
I D - Amperes
10V
9V
8V
300
200
7V
150
100
7V
200
150
6V
100
6V
50
50
5V
5V
0
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.0
0.7
0.5
1.0
350
2.2
VGS = 15V
10V
9V
2.5
3.0
VGS = 10V
2.0
1.8
250
8V
200
RDS(on) - Normalized
I D - Amperes
2.0
Fig. 4. RDS(on) Normalized to ID = 150A Value vs.
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 150 C
300
1.5
VDS - Volts
VDS - Volts
7V
150
100
6V
ID = 300A
1.6
ID = 150A
1.4
1.2
1.0
50
0.8
5V
0
0.0
2.2
0.2
0.4
0.6
0.8
0.6
1.0
1.2
1.4
-50
-25
0
25
50
75
100
125
150
VDS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 150A Value vs.
Drain Current
Fig. 6. Drain Current vs. Case Temperature
175
200
2.0
External Lead Current Limit
o
160
1.8
1.6
I D - Amperes
RDS(on) - Normalized
TJ = 175 C
VGS = 10V
15V
1.4
120
80
1.2
o
TJ = 25 C
40
1.0
0
0.8
0
50
100
150
200
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
250
300
350
-50
-25
0
25
50
75
100
TC - Degrees Centigrade
125
150
175
IXFN520N075T2
Fig. 8. Transconductance
Fig. 7. Input Admittance
200
200
180
180
o
TJ = - 40 C
160
160
o
TJ = 150 C
o
- 40 C
120
o
25 C
140
o
25 C
g f s - Siemens
I D - Amperes
140
100
80
120
o
150 C
100
80
60
60
40
40
20
20
0
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
0
7.0
20
40
60
80
VGS - Volts
120
140
160
180
200
220
Fig. 10. Gate Charge
Fig. 9. Forward Voltage Drop of Intrinsic Diode
10
300
VDS = 37.5V
9
250
I D = 260A
8
I G = 10mA
7
VGS - Volts
200
I S - Amperes
100
I D - Amperes
150
6
5
4
o
TJ = 150 C
100
3
o
TJ = 25 C
2
50
1
0
0
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0
100
200
VSD - Volts
400
500
600
Fig. 12. Forward-Bias Safe Operating Area
Fig. 11. Capacitance
10,000
100
RDS(on) Limit
C iss
1,000
25μs
10
I D - Amperes
Capacitance - NanoFarads
300
QG - NanoCoulombs
C oss
100μs
External Lead Limit
100
1ms
1
10
10ms
o
TJ = 175 C
C rss
100ms
o
TC = 25 C
f = 1 MHz
DC
Single Pulse
0.1
1
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.1
1
10
VDS - Volts
100
IXFN520N075T2
Fig. 13. Resistive Turn-on Rise Time
vs. Junction Temperature
Fig. 14. Resistive Turn-on Rise Time
vs. Drain Current
180
180
RG = 1Ω , VGS = 10V
160
RG = 1Ω , VGS = 10V
160
VDS = 37.5V
140
140
120
120
VDS = 37.5V
t r - Nanoseconds
t r - Nanoseconds
o
I D = 200A
100
80
60
TJ = 125 C
100
80
60
I D = 100A
40
40
20
20
o
TJ = 25 C
0
0
25
35
45
55
65
75
85
95
105
115
40
125
60
80
100
TJ - Degrees Centigrade
600
tr
td(off)
o
120
I D = 100A
40
32
0
30
6
7
8
9
VDS = 37.5V
110
100
I D = 200A
34
45
55
65
75
85
95
105
115
TJ - Degrees Centigrade
Fig. 17. Resistive Turn-off Switching Times
vs. Drain Current
Fig. 18. Resistive Turn-off Switching Times
vs. Gate Resistance
600
tf
td(off)
160
RG = 1Ω, VGS = 10V
o
o
TJ = 125 C
100
36
80
34
60
32
60
80
100
120
140
160
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
180
40
200
t f - Nanoseconds
120
400
400
I D = 200A, 100A
300
300
200
200
100
100
0
0
1
2
3
4
5
6
RG - Ohms
7
8
9
10
t d(off) - Nanoseconds
40
t d(off) - Nanoseconds
140
o
500
VDS = 37.5V
42
TJ = 25 C
td(off)
TJ = 125 C, VGS = 10V
500
VDS = 37.5V
38
70
125
600
180
44
t f - Nanoseconds
35
RG - Ohms
tf
90
80
25
10
46
40
120
36
100
5
130
I D = 100A
80
4
td(off)
38
200
0
tf
RG = 1Ω, VGS = 10V
40
t f - Nanoseconds
t r - Nanoseconds
300
3
200
t d(off) - Nanoseconds
160
t d(on) - Nanoseconds
400
2
180
140
42
200
I D = 200A
VDS = 37.5V
1
160
44
240
TJ = 125 C, VGS = 10V
140
Fig. 16. Resistive Turn-off Switching Times
vs. Junction Temperature
Fig. 15. Resistive Turn-on Switching Times
vs. Gate Resistance
500
120
I D - Amperes
IXFN520N075T2
Fig. 19. Maximum Transient Thermal Impedance
1.000
Fig. 19. Maximum Transient Thermal Impedance
.sadgsfgsf
0.300
Z (th )JC - K / W
0.100
0.010
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: F_520N075T2 (V9)11-09-09
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.