PolarHVTM HiPerFET IXFH 140N10P
IXFT 140N10P
Power MOSFETs
VDSS
ID25
RDS(on)
trr
N-Channel Enhancement Mode
Fast Intrinsic Diode
Avalanche Rated
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25° C to 175° C
TJ = 25° C to 175° C; RGS = 1 MΩ
100
100
V
V
VGS
VGSM
Continuous
Transient
±20
±30
V
V
ID25
TC = 25° C
ID(RMS)
External lead current limit
IDM
TC = 25° C, pulse width limited by TJM
IAR
140
A
75
A
300
A
TC = 25° C
60
A
EAR
TC = 25° C
80
mJ
EAS
TC = 25° C
2.5
J
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS,
TJ ≤150° C, RG = 4 Ω
10
V/ns
PD
TC = 25° C
600
W
-55 ... +175
175
-55 ... +150
°C
°C
°C
300
260
°C
°C
TJ
TJM
Tstg
TL
TSOLD
1.6 mm (0.062 in.) from case for 10 s
Plastic body for 10s
Md
Mounting torque
Weight
TO-247
TO-268
(TO-247)
1.13/10 Nm/lb.in.
6.0
5.0
= 100 V
= 140 A
≤
Ω
11 mΩ
≤ 150 ns
g
g
TO-247 (IXFH)
G
D
D (TAB)
S
TO-268 (IXFT)
G
G = Gate
S = Source
S
D (TAB)
D = Drain
TAB = Drain
Features
l
l
l
International standard packages
Unclamped Inductive Switching (UIS)
rated
Low package inductance
- easy to drive and to protect
Advantages
Symbol
Test Conditions
(TJ = 25° C, unless otherwise specified)
Characteristic Values
Min. Typ.
Max.
BVDSS
VGS = 0 V, ID = 250 µA
100
VGS(th)
VDS = VGS, ID = 4.0 mA
3.0
IGSS
VGS = ±20 VDC, VDS = 0
IDSS
VDS = VDSS
VGS = 0 V
RDS(on)
VGS = 10 V, ID = 0.5 ID25
VGS = 15 V, ID = 300 A
Note 1
© 2006 IXYS All rights reserved
V
TJ = 175° C
9
5.0
V
±100
nA
25
500
µA
µA
11
mΩ
mΩ
l
l
l
Easy to mount
Space savings
High power density
DS99213E(01/06)
IXFH 140N10P
IXFT 140N10P
Symbol
Test Conditions
Characteristic Values
(TJ = 25° C, unless otherwise specified)
Min.
Typ.
Max.
gfs
VDS= 10 V; ID = 0.5 ID25, Note 1
45
Ciss
Coss
VGS = 0 V, VDS = 25 V, f = 1 MHz
65
S
4700
pF
1850
pF
600
pF
Crss
td(on)
35
ns
tr
VGS = 10 V, VDS = 0.5 VDSS, ID = 60 A
50
ns
td(off)
RG = 4 Ω (External)
85
ns
26
ns
155
nC
33
nC
85
nC
tf
Qg(on)
Qgs
VGS= 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25
Qgd
1
(TO-247)
Source-Drain Diode
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
A2
2.2
2.6
b
1.0
1.4
1.65
2.13
b1
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
∅P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
Characteristic Values
(TJ = 25° C, unless otherwise specified)
Min.
Typ.
Max.
Symbol
Test Conditions
IS
VGS = 0 V
140
A
ISM
Repetitive
300
A
VSD
IF = IS, VGS = 0 V,
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
1.5
V
trr
QRM
IRM
IF = 25 A, -di/dt = 100 A/µs
VR = 50 V, VGS = 0 V
150
0.8
6
3
Dim.
° C/W
0.21
2
Terminals: 1 - Gate
3 - Source
0.25° C/W
RthJC
RthCS
TO-247 AD Outline
TO-268 Outline
200 ns
µC
A
Note 1: Pulse test, t ≤300 µs, duty cycle d ≤ 2 %
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by 4,835,592
one or moreof the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6,771,478 B2
2 - Drain
Tab - Drain
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
IXFH 140N10P
IXFT 140N10P
Fig. 1. Output Characteristics
@ 25ºC
Fig. 2. Extended Output Characteristics
@ 25ºC
300
140
VGS = 10V
9V
120
VGS = 10V
270
240
9V
210
80
I D - Amperes
I D - Amperes
100
8V
60
7V
40
180
150
8V
120
90
7V
60
20
6V
30
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
6V
0
1.6
0
V D S - Volts
Fig. 3. Output Characteristics
@ 150ºC
VGS = 10V
9V
I D - Amperes
100
8V
80
7V
60
6V
40
20
4 D S 5- Volts
6
V
7
8
9
10
2
1.8
I D = 140A
1.6
1.4
I D = 70A
1.2
1
0.8
5V
0
0.6
0
0.4
0.8
1.2
1.6
2
2.4
2.8
3.2
-50
V D S - Volts
Fig. 5. RDS(on) Norm alized to 0.5 ID25
Value vs. Drain Current
3
90
2.75
80
2.5
2
VGS = 10V
1.75
1.5
VGS = 15V
1.25
0
25
50
75
100
125
TJ - Degrees Centigrade
150
175
External Lead Current Limit
70
TJ = 175ºC
2.25
-25
Fig. 6. Drain Current vs. Case
Tem perature
I D - Amperes
R D S ( o n ) - Normalized
3
VGS = 10V
2.2
R D S ( o n ) - Normalized
120
2
Fig. 4. RDS(on) Norm alized to 0.5 ID25
Value vs. Junction Tem perature
2.4
140
1
60
50
40
30
20
TJ = 25ºC
10
1
0
0.75
0
50
100
150
200
I D - Amperes
© 2006 IXYS All rights reserved
250
300
350
-50
-25
0
25
50
75
100
125
TC - Degrees Centigrade
150
175
IXFH 140N10P
IXFT 140N10P
Fig. 8. Transconductance
Fig. 7. Input Adm ittance
250
90
225
80
200
70
g f s - Siemens
I D - Amperes
175
150
125
100
TJ = 150ºC
75
25ºC
50
50
TJ = -40ºC
25ºC
40
150ºC
30
20
-40ºC
25
60
10
0
0
4
4.5
5
5.5
6
6.5
7
7.5
8
8.5
9
0
9.5
40
80
120
V G S - Volts
Fig. 9. Source Current vs.
Source-To-Drain Voltage
200
240
280
320
120
140
160
Fig. 10. Gate Charge
10
300
VDS = 50V
9
250
I D = 70A
8
I G = 10mA
7
200
VG S - Volts
I S - Amperes
160
I D - Amperes
150
100
6
5
4
3
TJ = 150ºC
50
2
TJ = 25ºC
1
0
0
0.4
0.6
0.8
1
1.2
1.4
1.6
0
V S D - Volts
20
40
60
80
100
Q G - nanoCoulombs
Fig. 12. Forw ard-Bias
Safe Operating Area
Fig. 11. Capacitance
1000
10000
1000
TC = 25ºC
R DS(on) Limit
C iss
I D - Amperes
Capacitance - picoFarads
TJ = 175ºC
C oss
25µs
100µs
100
1ms
10ms
C rss
DC
f = 1MHz
100
10
0
5
10
15
20
25
V DS - Volts
30
35
40
IXYS reserves the right to change limits, test conditions, and dimensions.
1
10
V D S - Volts
100
1000
IXFH 140N10P
IXFT 140N10P
F ig . 1 3 . M a x im u m T r a n s ie n t T h e r m a l R e s is t a n c e
R( t h ) J C - ºC / W
1.00
0.10
0.01
0.1
1
10
Pu ls e W id th - m illis e c o n d s
© 2006 IXYS All rights reserved
100
1000
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