HiPerFETTM
Power MOSFETs
IXFH23N80Q
IXFT23N80Q
VDSS
= 800 V
=
23 A
ID25
RDS(on) = 0.42 Ω
Q-Class
trr ≤ 250 ns
N-Channel Enhancement Mode
Avalanche Rated,
Low Qg, High dv/dt
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MΩ
800
800
V
V
VGS
VGSM
Continuous
Transient
±30
±40
V
V
ID25
IDM
IAR
TC = 25°C
TC = 25°C, pulse width limited by TJM
TC = 25°C
23
92
23
A
A
A
EAR
EAS
TC = 25°C
TC = 25°C
45
1.5
mJ
J
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS,
TJ ≤ 150°C, RG = 2 Ω
5
V/ns
PD
TC = 25°C
TJ
TJM
Tstg
500
W
-55 ... +150
150
-55 ... +150
°C
°C
°C
300
°C
TL
1.6 mm (0.063 in) from case for 10 s
Md
Mounting torque
TO-247
1.13/10 Nm/lb.in.
FC
Mounting Force
TO-268
20...120/4.5...27 N/lb
TO-247
TO-268
6
4
TO-247 AD (IXFH)
(TAB)
TO-268 (D3) ( IXFT)
G
S
G = Gate
S = Source
Features
z
z
z
z
Weight
g
g
z
z
z
Test Conditions
VDSS
VGS = 0 V, ID = 250 µA
VGS(th)
VDS = VGS, ID = 3 mA
IGSS
VGS = ±30 VDC, VDS = 0
IDSS
VDS = VDSS
VGS = 0 V
RDS(on)
VGS = 10 V, ID = 0.5 • ID25
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
© 2004 IXYS All rights reserved
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
800
2.5
TJ = 25°C
TJ = 125°C
IXYS advanced low Qg process
International standard packages
Epoxy meets UL 94 V-0 flammability
classification
Low RDS (on) low Qg
Avalanche energy and current rated
Fast intrinsic rectifier
Advantages
z
Symbol
TAB = Drain
z
Easy to mount
Space savings
High power density
V
4.5
V
±100
nA
25
1
µA
mA
0.42
Ω
DS99060A(02/04)
IXFH23N80Q
IXFT23N80Q
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
gfs
VDS = 10 V; ID = 0.5 • ID25, pulse test
18
26
S
4900
pF
500
pF
130
pF
TO-247 AD (IXFH) Outline
1
Ciss
Coss
VGS = 0 V, VDS = 25 V, f = 1 MHz
C rss
td(on)
28
ns
tr
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
27
ns
td(off)
RG = 1.5 Ω (External),
74
ns
14
ns
130
nC
26
nC
55
nC
tf
Qg(on)
Qgs
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
RthJC
RthCK
0.25
TO-247
Source-Drain Diode
0.25
Dim.
K/W
K/W
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min.
typ. max.
Symbol
Test Conditions
IS
VGS = 0 V
23
A
ISM
Repetitive; pulse width limited by TJM
92
A
VSD
IF = IS, VGS = 0 V,
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
1.5
V
250
ns
µC
A
t rr
QRM
IRM
IF = IS -di/dt = 100 A/µs, VR = 100 V
1
9
2
3
Terminals:
1 - Gate
2 - Drain
3 - Source
Tab - Drain
Millimeter
Min.
Max.
Inches
Min.
Max.
A
A1
A2
4.7
2.2
2.2
5.3
2.54
2.6
.185
.087
.059
.209
.102
.098
b
b1
b2
1.0
1.65
2.87
1.4
2.13
3.12
.040
.065
.113
.055
.084
.123
C
D
E
.4
20.80
15.75
.8
21.46
16.26
.016
.819
.610
.031
.845
.640
e
L
L1
5.20
19.81
5.72
20.32
4.50
0.205
.780
0.225
.800
.177
∅P
Q
3.55
5.89
3.65
6.40
.140
0.232
.144
0.252
R
S
4.32
6.15
5.49
BSC
.170
242
.216
BSC
TO-268 (IXFT) Outline
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more
of the following U.S. patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665
6,534,343
Fig. 1. Output Characteristics
@ 25ºC
Fig. 2. Extended Output Characteristics
@ 25ºC
22
45
VGS = 10V
7V
6V
18
I D - Amperes
16
40
14
12
10
8
VGS = 10V
35
I D - Amperes
20
5V
6
6V
30
25
5.5V
20
15
5V
10
4
5
4.5V
2
4.5V
0
0
0
1
2
3
4
5
6
7
8
9
0
10
3
6
9
15
18
21
24
27
30
V D S - Volts
V D S - Volts
Fig. 3. Output Characteristics
@ 125ºC
Fig. 4. RDS(on) Norm alize d to 0.5 ID25
Value vs. Junction Te m perature
2.8
22
VGS = 10V
6V
18
16
5V
14
12
10
8
6
VGS = 10V
2.5
R D S ( o n ) - Normalized
20
I D - Amperes
12
4.5V
2.2
1.9
I D = 23A
1.6
I D = 11.5A
1.3
1
4
0.7
2
0.4
0
0
2
4
6
8
10
12
14
16
18
20
-50
22
-25
Fig. 5. RDS(on) Norm alize d to
0.5 ID25 Value vs. ID
2.8
25
50
75
100
125
150
Fig. 6. Drain Curre nt vs . Cas e
Tem pe rature
27
24
VGS = 10V
2.4
TJ = 125ºC
21
2.2
I D - Amperes
R D S ( o n ) - Normalized
2.6
0
TJ - Degrees Centigrade
V D S - Volts
2
1.8
1.6
1.4
18
15
12
9
6
1.2
TJ = 25ºC
1
3
0.8
0
0
5
10
15
20
25
30
I D - Amperes
© 2004 IXYS All rights reserved
35
40
45
50
-50
-25
0
25
50
75
100
TC - Degrees Centigrade
125
150
Fig. 8. Transconductance
Fig. 7. Input Adm ittance
35
60
30
50
g f s - Siemens
I D - Amperes
25
20
15
TJ = 125ºC
25ºC
-40ºC
10
TJ = -40ºC
25ºC
125ºC
40
30
20
10
5
0
0
3.5
4
4.5
5
5.5
0
6
5
10
15
V G S - Volts
Fig. 9. Source Current vs.
Source-To-Drain Voltage
25
30
35
40
Fig. 10. Gate Charge
10
70
9
60
VDS = 400V
I D = 11.5A
8
50
I G = 10mA
7
VG S - Volts
I S - Amperes
20
I D - Amperes
40
30
TJ = 125ºC
6
5
4
3
20
TJ = 25ºC
2
10
1
0
0
0.4
0.5
0.6
0.7
0.8
0.9
V S D - Volts
1
1.1
1.2
0
20
40
60
80
100
120
140
Q G - nanoCoulombs
Fig. 11. Capacitance
Capacitance - picoFarads
10000
C iss
1000
C oss
100
C rss
f = 1MHz
10
0
5
10
15
20
25
V D S - Volts
30
35
40
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more
of the following U.S. patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665
6,534,343
F ig . 1 2 . M a x im u m T r a n s ie n t T h e r m a l R e s is t a n c e
R( t h ) J C - ºC / W
1.00
0.10
0.01
1
10
100
Pu ls e W id th - m illis e c o n d s
© 2004 IXYS All rights reserved
1000
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