IXFT60N65X2HV
X2-Class HiPerFETTM
Power MOSFET
VDSS
ID25
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
= 650V
= 60A
52m
TO-268HV (IXFT)
G
S
D (Tab)
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 150C
650
V
VDGR
TJ = 25C to 150C, RGS = 1M
650
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C
60
A
IDM
TC = 25C, Pulse Width Limited by TJM
120
A
IA
TC = 25C
15
A
EAS
TC = 25C
2.5
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
50
V/ns
PD
780
W
-55 ... +150
C
TJM
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
4
g
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Weight
D
= Drain
Tab = Drain
Features
TC = 25C
TJ
G = Gate
S = Source
High Voltage Package
Low RDS(ON) and QG
Avalanche Rated
Low Package Inductance
Advantages
High Power Density
Easy to Mount
Space Savings
Applications
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 1mA
650
VGS(th)
VDS = VGS, ID = 4mA
3.5
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
V
5.0
V
100 nA
TJ = 125C
© 2016 IXYS CORPORATION, All Rights Reserved
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
25 A
2.5 mA
52 m
DS100693A(03/16)
IXFT60N65X2HV
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 10V, ID = 0.5 • ID25, Note 1
23
RGi
Gate Input Resistance
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
38
S
0.8
6300
pF
3540
pF
1.7
pF
207
855
pF
pF
30
ns
23
ns
63
ns
12
ns
108
nC
40
nC
34
nC
Crss
Effective Output Capacitance
Co(er)
Co(tr)
Energy related
td(on)
Resistive Switching Times
tr
td(off)
tf
Time related
VGS = 0V
VDS = 0.8 • VDSS
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 3 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
0.16 C/W
RthJC
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max
60
A
Repetitive, pulse Width Limited by TJM
240
A
VSD
IF = IS, VGS = 0V, Note 1
1.4
V
trr
QRM
IRM
IF = 30A, -di/dt = 100A/μs
180
1.4
16.0
ns
μC
A
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
VR = 100V
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXFT60N65X2HV
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
Fig. 1. Output Characteristics @ TJ = 25ºC
160
60
VGS = 10V
9V
VGS = 10V
140
50
9V
8V
120
I D - Amperes
I D - Amperes
40
7V
30
100
8V
80
60
20
40
6V
7V
10
20
5V
0
6V
0
0
0.5
1
1.5
2
2.5
3
0
3.5
5
10
15
VDS - Volts
20
25
30
VDS - Volts
Fig. 4. RDS(on) Normalized to ID = 30A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125ºC
60
3.4
VGS = 10V
8V
VGS = 10V
3.0
50
I D - Amperes
RDS(on) - Normalized
2.6
40
7V
30
6V
20
I D = 60A
2.2
1.8
I D = 30A
1.4
1.0
10
0.6
5V
0
0.2
0
1
2
3
4
5
6
7
8
-50
-25
0
25
VDS - Volts
Fig. 5. RDS(on) Normalized to ID = 30A Value vs.
Drain Current
4.5
75
100
125
150
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
1.3
VGS = 10V
1.2
BVDSS / VGS(th) - Normalized
4.0
3.5
R DS(on) - Normalized
50
TJ - Degrees Centigrade
T J = 125ºC
3.0
2.5
2.0
T J = 25ºC
1.5
1.0
BVDSS
1.1
1.0
0.9
0.8
VGS(th)
0.7
0.6
0.5
0.5
0
20
40
60
80
100
I D - Amperes
© 2016 IXYS CORPORATION, All Rights Reserved
120
140
160
-60
-40
-20
0
20
40
60
80
TJ - Degrees Centigrade
100
120
140
160
IXFT60N65X2HV
Fig. 8. Input Admittance
Fig. 7. Maxing Drain Current vs. Case Temperature
70
90
80
60
70
50
- Amperes
40
TJ = 125ºC
25ºC
- 40ºC
50
40
I
I
D
30
D
- Amperes
60
30
20
20
10
10
0
0
-50
-25
0
25
50
75
100
125
150
3.5
4
4.5
5
5.5
TC - Degrees Centigrade
6
6.5
7
7.5
8
VGS - Volts
Fig. 9. Transconductance
Fig. 10. Forward Voltage Drop of Intrinsic Diode
70
200
TJ = - 40ºC
180
60
160
25ºC
- Amperes
40
140
125ºC
S
30
120
100
80
I
g f s - Siemens
50
TJ = 125ºC
60
20
40
TJ = 25ºC
10
20
0
0
0
10
20
30
40
I
50
60
70
80
0.3
90
0.4
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
V SD - Volts
Fig. 12. Capacitance
Fig. 11. Gate Charge
100,000
10
VDS = 325V
9
Capacitance - PicoFarads
I D = 30A
8
I G = 10mA
7
V GS - Volts
0.5
D - Amperes
6
5
4
3
Ciss
10,000
1,000
Coss
100
10
2
f = 1 MHz
1
Crss
1
0
0
10
20
30
40
50
60
70
80
90
100
110
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1000
IXFT60N65X2HV
Fig. 13. Output Capacitance Stored Energy
Fig. 14. Forward-Bias Safe Operating Area
45
1000
40
RDS(on) Limit
100
25µs
30
I D - Amperes
EOSS - MicroJoules
35
25
20
100µs
10
15
1
10
TJ = 150ºC
TC = 25ºC
Single Pulse
5
0
0
100
200
1
300
400
1ms
Fig. 15. Maximum Transient0.1Thermal Impedance
500
600
10
100
VDS - Volts
1,000
VDS - Volts
Fig. 15. Maximum Transient Thermal Impedance
aaaaa
0.3
Z (th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2016 IXYS CORPORATION, All Rights Reserved
IXYS REF: F_60N65X2(X7-S602) 11-19-15
IXFT60N65X2HV
TO-268HV Outline
PINS:
1 - Gate 2 - Source
3 - Drain
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.