IXFT80N65X2HV
X2-Class HiPerFETTM
Power MOSFET
VDSS
ID25
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
= 650V
= 80A
38m
TO-268HV (IXFT)
G
S
Symbol
Test Conditions
VDSS
TJ = 25C to 150C
Maximum Ratings
650
V
VDGR
TJ = 25C to 150C, RGS = 1M
650
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C
80
A
IDM
TC = 25C, Pulse Width Limited by TJM
160
A
D (Tab)
IA
TC = 25C
20
A
EAS
TC = 25C
3
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
50
V/ns
PD
TC = 25C
890
W
-55 ... +150
C
TJ
TJM
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Weight
4
g
G = Gate
S = Source
D
= Drain
Tab = Drain
Features
High Voltage Package
Low RDS(ON) and QG
Avalanche Rated
Low Package Inductance
Advantages
High Power Density
Easy to Mount
Space Savings
Applications
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 1mA
650
VGS(th)
VDS = VGS, ID = 4mA
3.5
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
V
5.0
V
100 nA
TJ = 125C
© 2016 IXYS CORPORATION, All Rights Reserved
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
50 A
3 mA
38 m
DS100694A(03/16)
IXFT80N65X2HV
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 10V, ID = 0.5 • ID25, Note 1
33
RGi
Gate Input Resistance
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
55
S
0.6
8300
pF
5010
pF
1.6
pF
280
1160
pF
pF
32
ns
24
ns
70
ns
11
ns
140
nC
50
nC
40
nC
Crss
Effective Output Capacitance
Co(er)
Co(tr)
Energy related
td(on)
Resistive Switching Times
tr
td(off)
tf
Time related
VGS = 0V
VDS = 0.8 • VDSS
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 3 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
0.14 C/W
RthJC
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max
80
A
Repetitive, pulse Width Limited by TJM
320
A
VSD
IF = IS, VGS = 0V, Note 1
1.4
V
trr
QRM
IRM
IF = 40A, -di/dt = 100A/μs
200
1.7
16.7
ns
μC
A
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
VR = 100V
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXFT80N65X2HV
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
Fig. 1. Output Characteristics @ TJ = 25ºC
200
80
VGS = 10V
VGS = 10V
9V
70
180
160
8V
60
9V
I D - Amperes
I D - Amperes
140
50
7V
40
30
8V
120
100
7V
80
60
20
6V
40
10
6V
20
5V
5V
0
0
0
0.5
1
1.5
2
2.5
3
3.5
0
5
10
VDS - Volts
20
25
Fig. 4. RDS(on) Normalized to ID = 40A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125ºC
80
3.8
VGS = 10V
8V
70
VGS = 10V
3.4
3.0
RDS(on) - Normalized
60
I D - Amperes
15
VDS - Volts
7V
50
40
6V
30
20
2.6
I D = 80A
2.2
1.8
I D = 40A
1.4
1.0
5V
10
0.6
4V
0.2
0
0
1
2
3
4
5
6
7
-50
8
0
25
50
75
100
125
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 40A Value vs.
Drain Current
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
4.5
150
1.3
VGS = 10V
1.2
BV DSS / V GS(th) - Normalized
4.0
3.5
R DS(on) - Normalized
-25
VDS - Volts
TJ = 125ºC
3.0
2.5
2.0
TJ = 25ºC
1.5
1.0
BVDSS
1.1
1.0
0.9
0.8
VGS(th)
0.7
0.6
0.5
0.5
0
20
40
60
80
100
120
I D - Amperes
© 2016 IXYS CORPORATION, All Rights Reserved
140
160
180
200
-60
-40
-20
0
20
40
60
80
TJ - Degrees Centigrade
100
120
140
160
IXFT80N65X2HV
Fig. 7. Maximum Drain Current vs.
Case Temperature
Fig. 8. Input Admittance
90
100
80
90
70
80
70
I D - Amperes
I D - Amperes
60
50
40
TJ = 125ºC
25ºC
- 40ºC
60
50
40
30
30
20
20
10
10
0
0
-50
-25
0
25
50
75
100
125
150
3.5
4.0
4.5
5.0
TC - Degrees Centigrade
Fig. 9. Transconductance
6.0
6.5
7.0
7.5
Fig. 10. Forward Voltage Drop of Intrinsic Diode
90
200
180
TJ = - 40ºC
80
160
70
140
25ºC
60
I S - Amperes
g f s - Siemens
5.5
VGS - Volts
50
125ºC
40
30
120
100
80
TJ = 125ºC
60
20
TJ = 25ºC
40
10
20
0
0
0
10
20
30
40
50
60
70
80
90
100
0.3
0.4
0.5
0.6
0.7
I D - Amperes
0.8
0.9
1.0
1.1
1.2
1.3
VSD - Volts
Fig. 12. Capacitance
Fig. 11. Gate Charge
100,000
10
VDS = 325V
Capacitance - PicoFarads
I D = 40A
8
V GS - Volts
I G = 10mA
6
4
2
Ciss
10,000
1,000
Coss
100
10
f = 1 MHz
0
Crss
1
0
20
40
60
80
100
120
140
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1000
IXFT80N65X2HV
Fig. 13. Output Capacitance Stored Energy
Fig. 14. Forward-Bias Safe Operating Area
60
1000
RDS(on) Limit
50
25µs
40
I D - Amperes
E OSS - MicroJoules
100
30
100µs
10
20
1
TJ = 150ºC
10
0
1 0
1ms
TC = 25ºC
Single Pulse
10ms
Fig. 15. Maximum Transient0.1Thermal Impedance
100
200
300
400
500
600
10
100
VDS - Volts
1,000
VDS - Volts
Fig. 15. Maximum Transient Thermal Impedance
aaaaa
0.3
Z(th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2016 IXYS CORPORATION, All Rights Reserved
IXYS REF: F_80N65X2(Z8-S602) 11-19-15
IXFT80N65X2HV
TO-268HV Outline
PINS:
1 - Gate 2 - Source
3 - Drain
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
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