PolarHVTM
Power MOSFET
VDSS = 600
V
ID25 = 26
A
Ω
RDS(on) ≤ 270 mΩ
≤ 200 ns
trr
IXFH26N60P
IXFT26N60P
IXFV26N60P
IXFV26N60PS
N-Channel Enhancement Mode
Fast Recovery Diode
Avalanche Rated
Symbol
Test Conditions
VDSS
TJ = 25°C to 150°C
600
V
VDGR
TJ = 25°C to 150°C; RGS = 1 MΩ
600
V
VGSS
Continuous
±30
V
VGSM
Transient
±40
V
ID25
TC = 25°C
26
A
IDM
TC = 25°C, pulse width limited by TJM
65
A
IAR
TC = 25°C
13
A
EAR
TC = 25°C
40
mJ
EAS
TC = 25°C
1.2
J
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/μs, VDD ≤ VDSS
TJ ≤ 150°C, RG = 5 Ω
10
V/ns
PD
Maximum Ratings
TJ
TJM
Tstg
1.6 mm (0.062 in.) from case for 10 s
Plastic body for 10 s
Md
Mounting torque (TO-3P&TO-247)
FC
Mounting force (PLUS220)
Weight
TO-247
TO-268
PLUS220 & PLUS220SMD
G
460
W
-55 ... +150
150
-55 ... +150
°C
°C
°C
300
260
°C
°C
G
11..65/2.5..15
N/lb
6.0
5.0
4.0
g
g
g
BVDSS
VGS = 0 V, ID = 250 μA
600
VGS(th)
VDS = VGS, ID = 4 mA
2.5
IGSS
VGS = ±30 V, VDS = 0 V
IDSS
VDS = VDSS
VGS = 0 V
RDS(on)
VGS = 10 V, ID = 0.5 ID25
Pulse test, t ≤ 300 μs, duty cycle d ≤ 2 %
© 2006 IXYS All rights reserved
S
D (TAB)
G
D
D (TAB)
S
PLUS220SMD (IXFV...S)
1.13/10 Nm/lb.in.
Characteristic Values
Min. Typ.
Max.
TJ = 125°C
S
TO-268 (IXFT)
G
S
G = Gate
S = Source
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
D
PLUS220 (IXFV)
TC = 25°C
TL
TSOLD
TO-247 (IXFH)
V
5.0
V
±100
nA
25
250
μA
μA
270
mΩ
D (TAB)
D = Drain
TAB = Drain
Features
z
Fast Recovery diode
z
Unclamped Inductive Switching (UIS)
rated
z
International standard packages
z
Low package inductance
- easy to drive and to protect
Advantages
z
Easy to mount
z
Space savings
z
High power density
DS99435E(12/06)
IXFH 26N60P IXFT 26N60P
IXFV 26N60P IXFV 26N60PS
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min. Typ. Max.
gfs
VDS = 20 V; ID = 0.5 ID25, pulse test
16
26
S
4150
pF
400
pF
Crss
27
pF
td(on)
25
ns
Ciss
Coss
VGS = 0 V, VDS = 25 V, f = 1 MHz
tr
VGS = 10 V, VDS = 0.5 ID25
27
ns
td(off)
RG = 5 Ω (External)
75
ns
tf
21
ns
Qg(on)
72
nC
27
nC
24
nC
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25
Qgs
Qgd
0.27 °C/W
RthJC
RthCs
(PLUS220 & TO-247)
°C/W
0.21
Source-Drain Diode
Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min. Typ. Max.
Symbol
Test Conditions
IS
VGS = 0 V
26
A
ISM
Repetitive
78
A
VSD
IF = IS, VGS = 0 V, pulse test
1.5
V
trr
IF = 25A, -di/dt = 100 A/μs
200
ns
IRM
VR = 100V; VGS = 0 V
150
QRM
7
A
0.7
μC
Characteristic Curves
Fig. 1. Output Characteristics
Fig. 2. Extended Output Characteristics
@ 25ºC
@ 25ºC
60
VGS = 10V
24
VGS = 10V
54
7V
7V
48
20
I D - Amperes
I D - Amperes
42
16
6V
12
8
6V
36
30
24
18
12
4
5V
6
5V
0
0
0
1
2
3
4
5
6
7
0
3
6
V D S - Volts
9
12
15
18
21
V D S - Volts
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by 4,835,592
one or moreof the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6,771,478 B2
24
27
30
IXFH 26N60P IXFT 26N60P
IXFV 26N60P IXFV 26N60PS
Fig. 3. Output Characteristics
Fig. 4. RDS(on) Norm alized to 0.5 ID25
Value vs. Junction Tem perature
@ 125ºC
3.2
24
VGS = 10V
R D S ( o n ) - Normalized
I D - Amperes
20
16
VGS = 10V
2.8
7V
6V
12
8
2.4
2
I D = 26A
1.6
I D = 13A
1.2
5V
4
0.8
0
0.4
0
2
4
6
8
10
12
14
-50
16
-25
0
V D S - Volts
50
75
100
125
150
TJ - Degrees Centigrade
Fig. 6. Drain Current vs. Case
Tem perature
Fig. 5. RDS(on) Norm alized to
0.5 ID25 Value vs. ID
30
3.2
VGS = 10V
27
TJ = 125º C
2.8
R D S ( o n ) - Normalized
25
24
21
I D - Amperes
2.4
2
1.6
18
15
12
9
6
TJ = 25º C
1.2
3
0
0.8
0
10
20
30
40
50
-50
60
-25
0
I D - Amperes
50
45
45
40
40
35
35
g f s - Siemens
I D - Amperes
50
30
25
TJ = 125º C
25º C
15
50
75
100
125
150
Fig. 8. Transconductance
Fig. 7. Input Adm ittance
20
25
TC - Degrees Centigrade
-40º C
TJ = -40º C
25º C
125º C
30
25
20
15
10
10
5
5
0
0
4
4.5
5
5.5
6
V G S - Volts
© 2006 IXYS All rights reserved
6.5
7
7.5
0
5
10
15
20
25
30
I D - Amperes
35
40
45
50
IXFH 26N60P IXFT 26N60P
IXFV 26N60P IXFV 26N60PS
Fig. 9. Source Current vs.
Source-To-Drain Voltage
Fig. 10. Gate Charge
10
80
70
9
VDS = 300V
8
I D = 13A
7
I G = 10mA
50
VG S - Volts
I S - Amperes
60
40
30
TJ = 125º C
6
5
4
3
20
TJ = 25º C
2
10
1
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
0
10
20
V S D - Volts
30
40
50
60
Q G - nanoCoulombs
Fig. 11. Capacitance
10000
Capacitance - picoFarads
f = 1MHz
C iss
1000
C oss
100
C rss
10
0
5
10
15
20
25
30
35
40
V D S - Volts
Fig. 12. Maxim um Transient Therm al Resistance
R ( t h ) J C - ºC / W
1.00
0.10
0.01
0.00001
0.0001
0.001
0.01
Pulse Width - Seconds
IXYS reserves the right to change limits, test conditions, and dimensions.
0.1
1
10
70
80
IXFH 26N60P IXFT 26N60P
IXFV 26N60P IXFV 26N60PS
TO-247 AD (IXFH) Outline
1
Dim.
2
3
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
A2
2.2
2.6
b
1.0
1.4
1.65
2.13
b1
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
∅P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
PLUS220SMD (IXFV_S) Outline
© 2006 IXYS All rights reserved
TO-268 (IXFT) Outline
PLUS220 (IXFV) Outline
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