High Voltage IGBT
IXGF25N300
VCES = 3000V
= 27A
IC25
VCE(sat) ≤ 3.0V
For Capacitor Discharge
Applications
( Electrically Isolated Tab)
ISOPLUS i4-PakTM
Symbol
Test Conditions
VCES
TJ = 25°C to 150°C
3000
V
VCGR
TJ = 25°C to 150°C, RGE = 1MΩ
3000
V
VGES
Continuous
± 20
V
VGEM
Transient
± 30
V
IC25
TC = 25°C
27
A
IC90
TC = 90°C
ICM
TC = 25°C, VGE = 20V, 1ms
SSOA
VGE = 20V, TVJ = 125°C, RG = 5Ω
(RBSOA)
Clamped Inductive Load
PC
TC = 25°C
Maximum Ratings
16
A
140
A
ICM = 160
A
W
-55 ... +150
°C
TJM
150
°C
Tstg
-55 ... +150
°C
300
260
°C
°C
20..120/4.5..27
Nm/lb-in.
4000
V~
5
g
TJ
1.6 mm (0.062 in.) from Case for 10s
Plastic Body for 10s
FC
Mounting Force
VISOL
50/60Hz, 1 Minute
2
Isolated Tab
5
1 = Gate
2 = Emitter
5 = Collector
VCE ≤ 0.8 • VCES
114
TL
TSOLD
1
Weight
Features
Silicon Chip on Direct-Copper Bond
(DCB) Substrate
Isolated Mounting Surface
4000V Electrical Isolation
High Peak Current Capability
Low Saturation Voltage
Molding Epoxies Meet UL 94 V-0
Flammability Classification
Applications
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
BVCES
IC
= 1mA, VGE = 0V
VGE(th)
IC
= 250μA, VCE = VGE
ICES
VCE = 0.8 • VCES, VGE = 0V
Note 2 ,TJ = 125°C
IGES
VCE = 0V, VGE = ±20V
VCE(sat)
IC
IC
= 25A, VGE = 15V, Note 1
= 75A
© 2009 IXYS CORPORATION, All Rights Reserved
Capacitor Discharge
Pulser Circuits
Characteristic Values
Min.
Typ.
Max.
3000
3.0
V
5.0
V
50 μA
1 mA
±100
nA
3.0
5.5
V
V
Advantages
High Power Density
Easy to Mount
DS99995B(11/09)
IXGF25N300
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
IC = 50A, VCE = 10V, Note 1
16
IC(ON)
VGE = 15V, VCE = 20V, Note 1
ISOPLUS i4-PakTM (HV) Outline
26
S
240
A
2970
pF
98
pF
Cres
36
pF
Qg(on)
75
nC
15
nC
30
nC
70
ns
240
ns
220
ns
500
ns
0.15
30
1.10 °C/W
°C/W
°C/W
Cies
Coes
Qge
VCE = 15V, VGE = 20V, f = 1MHz
IC = 50A, VGE = 15V, VCE = 0.5 • VCES
Qgc
td(on)
tr
td(off)
tf
Resistive Switching Times
IC = 25A, VGE = 15V
VCE = 1500V, RG = 5Ω
RthJC
RthCS
RthJA
Pin 1 = Gate
Pin 2 = Emitter
Pin 3 = Collector
Tab 4 = Isolated
Notes:
1. Pulse test, t < 300μs, duty cycle, d < 2%.
2. Device must be heatsunk for high-temperature leakage current
measurements to avoid thermal runaway.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
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