Preliminary Technical Information
High Voltage IGBTs
For Capacitor Discharge
Applications
IXGK75N250
IXGX75N250
VCES = 2500V
IC110 = 75A
VCE(sat) ≤ 2.7V
TO-264 (IXGK)
Symbol
Test Conditions
Maximum Ratings
VCES
TJ = 25°C to 150°C
2500
V
VCGR
TJ = 25°C to 150°C, RGE = 1MΩ
2500
V
VGES
Continuous
±20
V
VGEM
Transient
±30
V
IC25
IC110
ILRMS
TC = 25°C ( Chip Capability )
TC = 110°C
TC = 25°C (Lead RMS Limit)
170
75
160
A
A
A
ICM
TC = 25°C, VGE = 20V, 1ms
530
A
SSOA
(RBSOA)
VGE = 15V, TVJ = 125°C, RG = 1Ω
Clamped Inductive Load
ICM = 200
@ 0.8 • VCES
A
PC
TC = 25°C
780
W
-55 ... +150
°C
TJ
TJM
150
°C
Tstg
-55 ... +150
°C
300
260
°C
°C
1.13/10
20..120/4.5..27
Nm/lb.in.
N/lb.
10
6
g
g
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062 in.) from Case for 10
Md
FC
Mounting Torque ( IXGK )
Mounting Force ( IXGX )
Weight
TO-264
PLUS247
G
C
E
Tab
PLUS247TM (IXGX)
G
C
G = Gate
C = Collector
Tab
E
E
= Emitter
Tab = Collector
Features
Very High Peak Current Capability
Low Saturation Voltage
MOS Gate Turn-On
Rugged NPT Structure
Molding Epoxies meet UL 94V-0
Flammability Classification
Advantages
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVCES
IC
= 1mA, VCE = 0V
2500
VGE(th)
IC
= 4mA, VCE = VGE
3.0
ICES
VCE = VCES, VGE = 0V
TJ = 125°C
V
5.0
V
50 μA
5 mA
IGES
VCE = 0V, VGE = ±20V
VCE(sat)
IC
= 75A, VGE = 15V, Note 1
2.7
V
IC
= 150A
3.6
V
© 2010 IXYS CORPORATION, All Rights Reserved
Easy to Mount
Space Savings
High Power Density
Applications
Capacitor Discharge
Pulser Circuits
±200 nA
DS99826B(07/10)
IXGK75N250
IXGX75N250
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
35
IC = 60A, VCE = 10V, Note 1
Cies
Coes
58
pF
345
pF
110
pF
Qg
tr
td(off)
tf
410
nC
63
nC
175
nC
IC = 75A, VGE = 15V, VCE = 0.5 • VCES
Qgc
td(on)
Resistive Switching Times
IC = 150A, VGE = 15V
VCE = 1250V, RG = 1Ω
55
ns
225
ns
270
ns
455
ns
RthJC
0.16 °C/W
RthCK
Note
S
9000
VCE = 25V, VGE = 0V, f = 1MHz
Cres
Qge
TO-264 AA ( IXGK) Outline
0.15
°C/W
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
*Additional provision for lead-to-lead voltage isolation are required at VCE >1200V.
Terminals:
Back Side
Dim.
A
A1
A2
b
b1
b2
c
D
E
e
J
K
L
L1
P
Q
Q1
R
R1
S
T
Millimeter
Min.
Max.
4.82
5.13
2.54
2.89
2.00
2.10
1.12
1.42
2.39
2.69
2.90
3.09
0.53
0.83
25.91 26.16
19.81 19.96
5.46 BSC
0.00
0.25
0.00
0.25
20.32 20.83
2.29
2.59
3.17
3.66
6.07
6.27
8.38
8.69
3.81
4.32
1.78
2.29
6.04
6.30
1.57
1.83
1 = Gate
2,4 = Collector
3 = Emitter
Inches
Min.
Max.
.190
.202
.100
.114
.079
.083
.044
.056
.094
.106
.114
.122
.021
.033
1.020
1.030
.780
.786
.215 BSC
.000
.010
.000
.010
.800
.820
.090
.102
.125
.144
.239
.247
.330
.342
.150
.170
.070
.090
.238
.248
.062
.072
PLUS247TM (IXGX) Outline
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
Dim.
6,404,065 B1
6,534,343
6,583,505
1 - Gate
2 - Collector
3 - Emitter
Millimeter
Min. Max.
Inches
Min. Max.
A
A1
A2
4.83
2.29
1.91
5.21
2.54
2.16
.190
.090
.075
.205
.100
.085
b
b1
b2
1.14
1.91
2.92
1.40
2.13
3.12
.045
.075
.115
.055
.084
.123
C
D
E
e
L
L1
Q
R
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
Terminals:
0.61
0.80
20.80 21.34
15.75 16.13
5.45 BSC
19.81 20.32
3.81
4.32
5.59
6.20
4.32
4.83
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 0.244
.170 .190
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXGK75N250
IXGX75N250
Fig. 2. Output Characteristics @ T J = 125ºC
Fig. 1. Output Characteristics @ T J = 25ºC
300
VGE = 25V
20V
300
15V
VGE = 25V
20V
15V
250
15V
200
10V
200
IC - Amperes
IC - Amperes
250
150
10V
150
100
100
50
50
5V
5V
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
1.5
2
VCE - Volts
Fig. 3. Dependence of VCE(sat) on
Junction Temperature
3.5
4
4.5
5
5.5
6
8
TJ = 25ºC
VGE = 15V
7
I
1.8
C
= 300A
6
1.6
VCE - Volts
VCE(sat) - Normalized
3
Fig. 4. Collector-to-Emitter Voltage
vs. Gate-to-Emitter Voltage
2.2
2.0
2.5
VCE - Volts
1.4
I
C
= 150A
1.2
5
I
C
= 300A
4
150A
1.0
3
0.8
I
C
= 75A
2
0.6
75A
1
0.4
-50
-25
0
25
50
75
100
125
6
150
8
10
TJ - Degrees Centigrade
12
14
16
18
20
22
24
26
VGE - Volts
Fig. 6. Transconductance
Fig. 5. Input Admittance
250
120
TJ = - 40ºC
100
g f s - Siemens
IC - Amperes
200
150
100
TJ = 125ºC
25ºC
- 40ºC
50
25ºC
80
125ºC
60
40
20
0
0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
VGE - Volts
© 2010 IXYS CORPORATION, All Rights Reserved
7.5
8.0
8.5
9.0
0
50
100
IC - Amperes
150
200
250
IXGK75N250
IXGX75N250
Fig. 7. Gate Charge
Fig. 8. Capacitance
100,000
16
I C = 75A
Capacitance - PicoFarads
I G = 10 mA
12
VGE - Volts
f = 1MHz
VCE = 1000V
14
10
8
6
4
10,000
Cies
1,000
Coes
100
Cres
2
0
10
0
50
100
150
200
250
300
350
400
450
0
5
10
15
QG - NanoCoulombs
20
25
30
35
40
VCE - Volts
Fig. 10. Maximum Transient Thermal Impedance
Fig. 9. Reverse-Bias Safe Operating Area
225
1.000
200
150
Z(th)JC - ºC / W
IC - Amperes
175
125
100
75
50
TJ = 125ºC
25
RG = 1Ω
dv / dt < 10V / ns
0
250
500
750
1000
1250
1500
1750
2000
2250
2500
VCE - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.100
0.010
0.001
0.00001
0.0001
0.001
0.01
0.1
Pulse Width - Seconds
1
10
IXGK75N250
IXGX75N250
Fig. 12. Resistive Turn-on Rise Time
vs. Collector Current
Fig. 11. Resistive Turn-on Rise Time
vs. Junction Temperature
600
700
VCE = 1250V
500
VCE = 1250V
I
500
C
TJ = 125ºC
= 300A
t r - Nanoseconds
t r - Nanoseconds
RG = 1Ω , VGE = 15V
RG = 1Ω , VGE = 15V
600
400
300
I
200
C
= 150A
400
300
TJ = 25ºC
200
100
100
0
0
25
35
45
55
65
75
85
95
105
115
75
125
100
125
150
175
TJ - Degrees Centigrade
Fig. 13. Resistive Turn-on Switching Times
vs. Gate Resistance
80
800
td(on) - - - -
75
500
60
I C = 150A
55
t f - Nanoseconds
65
I C = 300A
t d(on) - Nanoseconds
t r - Nanoseconds
70
600
700
600
VCE = 1250V
200
40
0
5
6
7
8
9
300
I C = 150A
300
100
4
I C = 300A
200
10
150
100
25
35
45
55
2000
tf
1600
RG = 1Ω, VGE = 15V
td(off) - - - -
480
380
440
360
400
1200
320
1000
280
800
240
t f - Nanoseconds
360
TJ = 125ºC, 25ºC
200
400
160
200
120
0
125
150
175
85
95
105
115
50
125
200
225
IC - Amperes
© 2010 IXYS CORPORATION, All Rights Reserved
250
275
80
300
750
tf
td(off) - - - -
675
TJ = 125ºC, VGE = 15V
340
600
VCE = 1250V
320
525
I
300
C
= 150A, 300A
450
280
375
260
300
240
225
220
150
200
t d(off) - Nanoseconds
t d(off) - Nanoseconds
VCE = 1250V
1400
t f - Nanoseconds
1800
100
75
Fig. 16. Resistive Turn-off Switching Times
vs. Gate Resistance
Fig. 15. Resistive Turn-off Switching Times
vs. Collector Current
75
65
TJ - Degrees Centigrade
RG - Ohms
600
350
250
45
3
400
400
200
100
td(off) - - - -
RG = 1Ω, VGE = 15V
500
50
2
300
450
tf
300
1
275
t d(off ) - Nanoseconds
VCE = 1250V
400
250
800
TJ = 125ºC, VGE = 15V
700
225
Fig. 14. Resistive Turn-off Switching Times
vs. Junction Temperature
900
tr
200
IC - Amperes
75
1
2
3
4
5
6
7
8
9
10
RG - Ohms
IXYS REF: IXG_75N250(9P)87-10-10
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