HiPerFASTTM IGBT
VCES
IC25
VCE(sat)
tfi typ
IXGP 30N60C2
C2- Class High Speed IGBTs
Symbol
Test Conditions
Maximum Ratings
VCES
TJ = 25°C to 150°C
600
V
VCGR
TJ = 25°C to 150°C; RGE = 1 MΩ
600
V
VGES
Continuous
±20
V
VGEM
Transient
±30
V
IC25
TC = 25°C (limited by leads)
70
A
IC110
TC = 110°C
30
A
ICM
TC = 25°C, 1 ms
150
A
SSOA
(RBSOA)
PC
VGE = 15 V, TVJ = 125°C, RG = 10 Ω
Clamped inductive load @ ≤ 600 V
TC = 25°C
ICM = 60
A
190
W
-55 ... +150
°C
TJM
150
°C
Tstg
-55 ... +150
°C
300
°C
TJ
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
TO-220 (IXGP)
G
G = Gate,
E = Emitter,
1.13/10Nm/lb.in.
Weight
4
z
z
z
z
z
g
z
z
z
z
VGE(th)
Test Conditions
ICES
VCE = VCES
VGE = 0 V
IGES
VCE = 0 V, VGE = ±20 V
VCE(sat)
IC
= 24 A, VGE = 15 V
© 2005 IXYS All rights reserved
C = Collector,
TAB = Collector
Very high frequency IGBT
Square RBSOA
High current handling capability
MOS Gate turn-on
- drive simplicity
PFC circuits
Uninterruptible power supplies (UPS)
Switched-mode and resonant-mode
power supplies
AC motor speed control
DC servo and robot drives
DC choppers
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
= 250 µA, VCE = VGE
IC
C (TAB)
Features
z
Symbol
C E
Applications
Mounting torque
Md
= 600 V
= 70 A
= 2.7 V
= 32 ns
2.5
TJ = 25°C
TJ = 150°C
TJ = 25°C
5.0
V
50
1
µA
mA
±100
nA
2.7
V
DS99170A(01/05)
IXGP 30N60C2
Symbol
gfs
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
IC = 24 A; VCE = 10 V,
Pulse test, t ≤ 300 µs, duty cycle ≤ 2 %
18
Cies
Coes
VCE = 25 V, VGE = 0 V, f = 1 MHz
Cres
Qg
Qge
IC = 24 A, VGE = 15 V, VCE = 300 V
Qgc
td(on)
28
S
1430
pF
110
pF
40
pF
70
nC
10
nC
23
nC
13
ns
tri
Inductive load, TJ = 25°°C
15
ns
td(off)
IC = 24 A, VGE = 15 V
VCE = 400 V, RG = 5 Ω
70
tfi
Eoff
td(on)
tri
Eon
td(off)
tfi
Inductive load, TJ = 125°°C
IC = 24 A, VGE = 15 V
VCE = 400 V, RG = 5 Ω
Eoff
140
Pins: 1 - Gate
3 - Source
ns
60
ns
0.19
0.30 mJ
13
ns
17
ns
0.22
mJ
120
ns
130
ns
0.59
mJ
RthJC
TO-220 Outline
0.65 K/W
RthCH
0.25
K/W
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by
one or moreof the following U.S. patents:
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6771478 B2
2 - Drain
4 - Drain
IXGP 30N60C2
Fig. 1. Output Characteristics
@ 25 Deg. C
Fig. 2. Extended Output Characteristics
@ 25 deg. C
270
50
VGE = 15V
13V
11V
45
40
9V
13V
210
30
I C - Amperes
35
I C - Amperes
VGE = 15V
240
7V
25
20
15
11V
180
150
9V
120
90
7V
60
10
30
5V
5
5V
0
0
0.5
1
1.5
2
2.5
3
3.5
0
2
4
6
Fig. 3. Output Characteristics
@ 125 Deg. C
12
14
16
18
1.2
VGE = 15V
13V
11V
40
V GE = 15V
9V
1.1
V C E (sat)- Normalized
45
I C - Amperes
10
Fig. 4. Dependence of V CE(sat ) on
Tem perature
50
35
7V
30
25
20
15
5V
10
I C = 48A
1.0
0.9
I C = 24A
0.8
0.7
0.6
5
I C = 12A
0.5
0
0.5
1
1.5
2
2.5
3
25
3.5
50
75
100
125
150
TJ - Degrees Centigrade
V CE - Volts
Fig. 5. Collector-to-Em itter Voltage
vs. Gate-to-Em itter voltage
Fig. 6. Input Adm ittance
200
4.5
TJ = 25ºC
I C = 48A
24A
12A
180
160
I C - Amperes
4
VC E - Volts
8
V C E - Volts
V C E - Volts
3.5
3
140
120
100
80
60
2.5
TJ = 25ºC
125ºC
40
20
2
0
5
6
7
8
9
10 11
12 13 14 15 16 17
V G E - Volts
© 2005 IXYS All rights reserved
3
4
5
6
7
8
V G E - Volts
9
10
11
12
IXGP 30N60C2
Fig. 8. Dependence of Turn-Off
Energy on RG
Fig. 7. Transconductance
35
2000
TJ = 125ºC
VGE = 15V
VCE = 400V
1800
30
1600
E off - microJoules
g f s - Siemens
25
TJ = 25ºC
125ºC
20
15
10
I C = 48A
1400
1200
1000
I C = 24A
800
600
400
5
200
0
I C = 12A
0
0
20
40
60
80
100 120 140 160 180 200
5
10
15
20
I C - Amperes
1000
E off - microJoules
E off - microJoules
R G = 5Ω
VGE = 15V
VCE = 400V
1200
800
TJ = 125ºC
600
400
TJ = 25ºC
200
35
40
45
50
1400
R G = 5Ω
VGE = 15V
VCE = 400V
1200
30
Fig. 10. Dependence of Turn-Off
Energy on Tem perature
Fig. 9. Dependence of Turn-Off
Energy on IC
1400
25
R G - Ohms
I C = 48A
1000
800
600
I C = 24A
400
200
I C = 12A
0
0
10
15
20
25
30
35
40
45
50
25
35
I C - Amperes
55
65
75
85
95
105 115 125
TJ - Degrees Centigrade
Fig. 11. Dependence of Turn-Off
Sw itching Tim e on RG
Fig. 12. Dependence of Turn-Off
Sw itching Tim e on IC
200
td(off)
tfi - - - - - -
400
TJ = 125ºC
VGE = 15V
VCE = 400V
350
300
250
200
I C = 12A
I C = 24A
I C = 48A
150
100
Switching Time - nanosecond
450
Switching Time - nanosecond
45
td(off)
tfi - - - - - -
180
R G = 5Ω
VGE = 15V
VCE = 400V
160
140
TJ = 125ºC
120
100
80
60
TJ = 25ºC
40
5
10
15
20
25
30
R G - Ohms
35
40
45
50
10
15
20
25
30
35
I C - Amperes
40
45
50
IXGP 30N60C2
Fig. 13. Dependence of Turn-Off
Sw itching Tim e on Tem perature
Fig. 14. Gate Charge
15
td(off)
tfi - - - - - -
160
140
120
VCE = 300V
I C = 24A
I G = 10mA
12
I C = 48A
24A
12A
R G = 5Ω
VGE = 15V
VCE = 400V
VG E - Volts
Switching Time - nanosecond
180
100
80
I C = 12A
24A
48A
60
9
6
3
40
0
25
35
45
55
65
75
85
95
105 115 125
0
10
20
TJ - Degrees Centigrade
30
40
50
60
70
Q G - nanoCoulombs
Fig. 15. Capacitance
10000
Capacitance - p F
f = 1 MHz
C ies
1000
C oes
100
C res
10
0
5
10
15
20
25
30
35
40
V C E - Volts
Fig. 16. Maxim um Transient Therm al Resistance
R (th) J C - (ºC/W)
1.0
0.5
0.1
1
© 2005 IXYS All rights reserved
10
Pulse Width - milliseconds
100
1000
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