IXTA230N075T2
IXTP230N075T2
TrenchT2TM
Power MOSFET
VDSS
ID25
=
=
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
75V
230A
4.2m
TO-263 (IXTA)
G
S
D (Tab)
TO-220 (IXTP)
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 175C
75
V
VDGR
TJ = 25C to 175C, RGS = 1M
75
V
VGSM
Transient
20
V
ID25
IL(RMS)
IDM
TC = 25C
External Lead Current Limit
TC = 25C, Pulse Width Limited by TJM
230
120
700
A
A
A
IA
TC = 25C
115
A
EAS
TC = 25C
850
mJ
PD
TC = 25C
480
W
-55 ... +175
C
TJM
175
C
Tstg
-55 ... +175
C
TJ
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
300
260
°C
°C
FC
Md
Mounting Force (TO-263)
Mounting Torque (TO-220)
10..65 / 2.2..14.6
1.13 / 10
N/lb
Nm/lb.in
Weight
TO-263
TO-220
2.5
3.0
g
g
G
D
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features
International Standard Packages
Avalanche Rated
Low Package Inductance
Fast Intrinsic Rectifier
175°C Operating Temperature
High Current Handling Capability
ROHS Compliant
High Performance Trench
Technology for extremely low RDS(on)
Advantages
High Power Density
Easy to Mount
Space Savings
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min. Typ.
Max.
BVDSS
VGS = 0V, ID = 250A
75
VGS(th)
VDS = VGS, ID = 250A
2.0
IGSS
VGS = 20V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
V
Applications
4.0
V
200
nA
5 A
TJ = 150C
RDS(on)
VGS = 10V, ID = 50A, Notes 1 & 2
150 A
4.2 m
Automotive Engine Control
Synchronous Buck Converter
(for Notebook SystemPower &
General Purpose Point & Load)
DC/DC Converters
High Current Switching Applications
Power Train Management
Distributed Power Architecture
© 2018 IXYS CORPORATION, All Rights Reserved
DS100042A(7/18)
IXTA230N075T2
IXTP230N075T2
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
50
VDS = 10V, ID = 60A, Note 1
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 115A
RG = 2 (External)
Qg(on)
Qgs
VGS= 10V, VDS = 0.5 • VDSS, ID = 115A
Qgd
E
85
S
10.5
nF
1165
pF
125
pF
23
ns
18
ns
33
ns
15
ns
178
nC
53
nC
41
nC
C2
A
E1
L1
D1
D
1
2
L2
3
A1
b
b2
4
H
L3
e
c
0.43 [11.0]
e
0
0.34 [8.7]
0.66 [16.6]
A2
1 - Gate
2,4 - Drain
3 - Source
0.20 [5.0]
60.12 [3.0]
0.10 [2.5]
0.06 [1.6]
0.31 C/W
RthJC
RthCS
TO-263 Outline
TO-220
C/W
0.50
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
230
A
ISM
Repetitive, Pulse Width Limited by TJM
900
A
VSD
trr
IRM
QRM
IF = 100A, VGS = 0V, Note 1
1.3
IF = 115A, VGS = 0V,
-di/dt = 100A/s, VR = 37V
TO-220 Outline
E
A
oP
A1
V
60
ns
4.4
A
145
nC
H1
Q
D2
D
D1
E1
A2
EJECTOR
PIN
L1
L
ee
Notes: 1. Pulse test, t 300s; duty cycle, d 2%.
3X b
c
e1
e1
3X b2
1 - Gate
2,4 - Drain
3 - Source
2. On through-hole packages, RDS(on) Kelvin test contact
location must be 5mm or less from the package body.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXTA230N075T2
IXTP230N075T2
o
o
Fig. 1. Output Characteristics @ TJ = 25 C
Fig. 2. Extended Output Characteristics @ TJ = 25 C
240
320
VGS = 15V
10V
9V
200
VGS = 15V
10V
9V
280
8V
8V
240
7V
I D - Amperes
I D - Amperes
160
120
6V
80
200
7V
160
120
6V
80
40
40
5V
0
5V
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0.0
0.5
1.0
1.5
2.5
3.0
3.5
4.0
4.5
Fig. 4. RDS(on) Normalized to ID = 115A Value vs.
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 150 C
2.6
240
VGS = 15V
10V
9V
8V
2.4
VGS = 10V
2.2
RDS(on) - Normalized
200
160
I D - Amperes
2.0
VDS - Volts
VDS - Volts
7V
120
6V
80
2.0
1.8
I D = 230A
1.6
I D = 115A
1.4
1.2
1.0
0.8
40
0.6
5V
0
0.4
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50
-25
0
VDS - Volts
50
75
100
125
150
175
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 115A Value vs.
Drain Current
2.6
25
Fig. 6. Drain Current vs. Case Temperature
140
2.4
120
External Lead Current Limit
2.2
2.0
100
I D - Amperes
RDS(on) - Normalized
o
TJ = 175 C
1.8
VGS = 10V
15V
1.6
1.4
1.2
80
60
40
1.0
20
o
TJ = 25 C
0.8
0
0.6
0
50
100
150
200
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
250
300
-50
-25
0
25
50
75
100
TC - Degrees Centigrade
125
150
175
IXTA230N075T2
IXTP230N075T2
Fig. 8. Transconductance
Fig. 7. Input Admittance
160
140
140
120
o
TJ = - 40 C
120
100
o
25 C
o
- 40 C
80
60
o
100
25 C
80
150 C
g f s - Siemens
I D - Amperes
o
TJ = 150 C
o
60
40
40
20
20
0
0
3.5
4.0
4.5
5.0
5.5
6.0
0
6.5
20
40
60
100
120
140
160
Fig. 10. Gate Charge
Fig. 9. Forward Voltage Drop of Intrinsic Diode
300
10
270
9
240
8
210
7
180
6
V GS - Volts
I S - Amperes
80
I D - Amperes
VGS - Volts
150
120
VDS = 38V
I D = 115A
I G = 10mA
5
4
o
TJ = 150 C
90
3
60
2
o
TJ = 25 C
30
1
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0
20
40
Fig. 11. Capacitance
80
100
120
140
160
180
Fig. 12. Forward-Bias Safe Operating Area
100,000
1000
RDS(on) Limit
f = 1 MHz
C iss
25μs
10,000
100
100μs
I D - Amperes
Capacitance - PicoFarads
60
QG - NanoCoulombs
VSD - Volts
C oss
1,000
Lead Current Limit
1ms
10
10ms
Crss
DC
100
1
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
VDS - Volts
100ms
100
IXTA230N075T2
IXTP230N075T2
Fig. 14. Resistive Turn-on Rise Time vs.
Drain Current
Fig. 13. Resistive Turn-on Rise Time vs.
Junction Temperature
22
26
RG = 2Ω , VGS = 10V
RG = 2Ω , VGS = 10V
24
VDS = 38V
20
VDS = 38V
20
t r - Nanoseconds
t r - Nanoseconds
22
I D = 230A
18
16
I D = 115A
18
o
TJ = 25 C
16
14
14
o
TJ = 125 C
12
12
10
10
25
35
45
55
65
75
85
95
105
115
110
125
120
130
140
150
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on Switching Times vs.
Gate Resistance
tr
td(on)
o
TJ = 125 C, VGS = 10V
40
tf
26
RG = 2Ω, VGS = 10V
30
20
25
15
20
10
15
12
5
10
10
12
14
t f - Nanoseconds
25
10
I D = 115A
20
40
18
35
16
30
20
25
60
280
55
240
35
45
55
o
TJ = 125 C
45
18
40
16
35
14
30
o
TJ = 25 C
12
10
140
150
160
170
180
190
200
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
210
220
25
20
230
t f - Nanoseconds
20
130
65
75
85
95
105
115
15
125
280
tf
td(off)
240
o
TJ = 125 C, VGS = 10V
VDS = 38V
200
200
I D = 115A
160
160
120
120
80
80
40
40
I D = 230A
0
0
2
4
6
8
10
RG - Ohms
12
14
16
t d(off) - Nanoseconds
50
t d(off) - Nanoseconds
t f - Nanoseconds
td(off)
VDS = 38V
120
25
I D = 230A
Fig. 18. Resistive Turn-off Switching Times vs.
Gate Resistance
RG = 2Ω, VGS = 10V
110
50
TJ - Degrees Centigrade
26
22
55
45
Fig. 17. Resistive Turn-off Switching Times vs.
Drain Current
24
230
60
22
14
16
td(off)
VDS = 38V
RG - Ohms
tf
220
65
24
35
8
210
t d(off) - Nanoseconds
t d(on) - Nanoseconds
t r - Nanoseconds
28
30
6
200
50
40
4
190
30
35
2
180
55
45
I D = 230A, 115A
VDS = 38V
170
Fig. 16. Resistive Turn-off Switching Times vs.
Junction Temperature
50
45
160
I D - Amperes
IXTA230N075T2
IXTP230N075T2
Fig. 19. Maximum Transient Thermal Impedance
1
Z (th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: T_230N075T2 (V6) 7-10-18-D
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