IXTA3N100D2HV
High Voltage
Depletion Mode
Power MOSFET
VDSX
ID(on)
RDS(on)
D
= 1000V
> 3A
6
N-Channel
G
TO-263HV
(IXTA..HV)
S
G
S
Symbol
Test Conditions
VDSX
TJ = 25C to 150C
VGSX
D (Tab)
Maximum Ratings
1000
V
Continuous
20
V
VGSM
Transient
30
V
PD
TC = 25C
125
W
- 55 ... +150
150
- 55 ... +150
C
C
C
300
260
°C
°C
10..65 / 2.2..14.6
N/lb
2.5
g
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Force
Weight
G = Gate
S = Source
D
= Drain
Tab = Drain
Features
• High Blocking Voltage
• Normally ON Mode
• High Voltage package
Advantages
• Easy to Mount
• Space Savings
• High Power Density
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSX
VGS = - 5V, ID = 250A
1000
VGS(off)
VDS = 25V, ID = 250A
IGSX
VGS = 20V, VDS = 0V
IDSX(off)
VDS = VDSX, VGS = - 5V
RDS(on)
VGS = 0V, ID = 1.5A, Note 1
ID(on)
VGS = 0V, VDS = 50V, Note 1
- 2.5
Applications
V
- 4.5
V
100 nA
5 A
50 A
TJ = 125C
© 2019 IXYS CORPORATION, All Rights Reserved
6
3
•
•
•
•
•
•
Audio Amplifiers
Start-Up Circuits
Protection Circuits
Ramp Generators
Current Regulators
Active Loads
A
DS100507C(11/19)
IXTA3N100D2HV
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
1.2
VDS = 30V, ID = 1.5A, Note 1
Ciss
Coss
2.0
S
1020
pF
68
pF
17
pF
VGS = -10V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
ns
ns
34
ns
40
ns
37.5
nC
4.4
nC
21.2
nC
VGS = 5V, VDS = 500V, ID = 1.5A
RG = 3.3 (External)
Qg(on)
Qgs
27
67
Resistive Switching Times
VGS = 5V, VDS = 500V, ID = 1.5A
Qgd
1.0 C/W
RthJC
Safe-Operating-Area Specification
Characteristic Values
Min.
Typ.
Max.
Symbol
Test Conditions
SOA
VDS = 800V, ID = 94mA, TC = 75C, Tp = 5s
75
W
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
VSD
IF = 3A, VGS = -10V, Note 1
trr
IRM
QRM
IF = 3A, -di/dt = 100A/s
VR = 100V, VGS = -10V
Characteristic Values
Min.
Typ.
Max.
0.8
970
12.7
6.16
1.3
V
ns
A
μC
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or moreof the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTA3N100D2HV
2.5
VGS = 5V
2V
1V
2.0
0V
7
VGS = 5V
2V
1V
6
5
1.5
I D - Amperes
I D - Amperes
Fig. 2. Extended Output Characteristics @ TJ = 25oC
Fig. 1. Output Characteristics @ TJ = 25oC
3.0
-1V
0V
4
3
-1V
1.0
2
- 2V
0.5
1
- 2V
- 3V
0.0
0
0
2
4
6
8
10
12
14
0
10
20
VDS - Volts
Fig. 3. Output Characteristics @ TJ = 125oC
40
1.E+00
VGS = - 3.00V
VGS = 5V
1V
0V
2.5
1.E-01
- 3.25V
- 3.50V
1.E-02
I D - Amperes
2.0
-1V
1.5
1.0
- 2V
- 3.75V
1.E-03
- 4.00V
1.E-04
- 4.25V
1.E-05
0.5
1.E-06
- 4.50V
- 3V
0.0
1.E-07
0
5
10
15
20
25
30
0
100
200
300
400
VDS - Volts
500
600
700
800
900 1000 1100 1200
VDS - Volts
Fig. 5. Drain Current @ TJ = 100oC
Fig. 6. Dynamic Resistance vs. Gate Voltage
1.E+10
1.E+00
∆ VDS = 700V - 100V
VGS = - 3.25V
1.E+09
1.E-01
- 3.50V
1.E-02
- 3.75V
- 4.00V
1.E-03
1.E+08
RO - Ohms
I D - Amperes
50
Fig. 4. Drain Current @ TJ = 25oC
3.0
I D - Amperes
30
VDS - Volts
1.E+07
o
TJ = 25 C
1.E+06
- 4.25V
1.E-04
o
TJ = 100 C
1.E+05
- 4.50V
1.E-05
1.E+04
0
100
200
300
400
500
600
700
800
VDS - Volts
© 2019 IXYS CORPORATION, All Rights Reserved
900 1000 1100 1200
-4.6
-4.4
-4.2
-4.0
-3.8
-3.6
VGS - Volts
-3.4
-3.2
-3.0
-2.8
IXTA3N100D2HV
Fig. 8. RDS(on) Normalized to ID = 1.5A Value
vs. Drain Current
Fig. 7. Normalized RDS(on) vs. Junction Temperature
2.6
2.4
VGS = 0V
2.2
2.0
RDS(on) - Normalized
RDS(on) - Normalized
VGS = 0V
5V
2.4
I D = 1.5A
1.6
1.2
2.0
o
TJ = 125 C
1.8
1.6
1.4
1.2
o
TJ = 25 C
1.0
0.8
0.8
0.4
0.6
-50
-25
0
25
50
75
100
125
150
0.0
0.5
1.0
1.5
TJ - Degrees Centigrade
Fig. 9. Input Admittance
3.0
3.5
4.0
4.5
5.0
4.0
VDS = 30V
4.0
VDS = 30V
3.5
3.5
o
TJ = - 40 C
3.0
2.5
g f s - Siemens
3.0
I D - Amperes
2.5
Fig. 10. Transconductance
4.5
o
TJ = 125 C
o
25 C
2.0
o
- 40 C
1.5
o
2.5
25 C
2.0
125 C
o
1.5
1.0
1.0
0.5
0.5
0.0
0.0
-4.0
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0.0
0.0
0.5
1.0
1.5
VGS - Volts
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
I D - Amperes
Fig. 11. Breakdown and Threshold Voltages
vs. Junction Temperature
Fig. 12. Forward Voltage Drop of Intrinsic Diode
10
1.3
VGS = -10V
9
8
1.2
VGS(off) @ VDS = 25V
7
I S - Amperes
BV / VGS(off) - Normalized
2.0
I D - Amperes
1.1
BVDSX @ VGS = - 5V
1.0
6
5
4
o
TJ = 125 C
o
TJ = 25 C
3
0.9
2
1
0.8
0
-50
-25
0
25
50
75
100
125
150
TJ - Degrees Centigrade
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.3
0.4
0.5
0.6
VSD - Volts
0.7
0.8
0.9
1.0
IXTA3N100D2HV
Fig. 13. Capacitance
Fig. 14. Gate Charge
10,000
5
VDS = 500V
4
I D = 1.5A
3
Ciss
Coss
100
I G = 10mA
2
1,000
VGS - Volts
Capacitance - PicoFarads
f = 1 MHz
1
0
-1
-2
-3
Crss
-4
-5
10
0
5
10
15
20
25
30
35
0
40
5
10
VDS - Volts
20
25
30
35
40
QG - NanoCoulombs
Fig. 16. Forward-Bias Safe Operating Area
Fig. 15. Forward-Bias Safe Operating Area
o
o
@ TC = 25 C
10.00
15
@ TC = 75 C
10
RDS(on) Limit
RDS(on) Limit
25μs
25μs
100μs
1.00
100μs
1
I D - Amperes
I D - Amperes
1ms
10ms
100ms
DC
0.10
1ms
10ms
0.1
100ms
DC
o
TJ = 150 C
o
TJ = 150 C
o
TC = 75 C
Single Pulse
o
TC = 25 C
Single Pulse
0.01
10.0010
0.01
Fig. 17. Maximum
Transient 10
Thermal Impedance
1,000
100
VDS - Volts
100
1,000
VDS - Volts
Fig. 17. Maximum Transient Thermal Impedance
.
2.00
Z (th)JC - K / W
1.00
0.10
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2019 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_3N100D2(3C) 7-15-14-B
IXTA3N100D2HV
TO-263HV Outline
E
A
L1
C2
D1
D
1
D2
H
3
E1
A1
2
L4
b2
L3
GAUGE
PLANE
b
e1
0.43 [11.0]
c
0o 8o
A2
e2
1 = Gate
2 = Source
3 = Drain
0.34 [8.7]
0.20 [5.0]
0.66 [16.7]
0.12 [3.0]
0.10 [2.5]
0.06 [1.6]
MINIMUM PCB FOOT PRINT LAYOUT
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXTA3N100D2HV
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
© 2019 IXYS CORPORATION, All Rights Reserved