Preliminary Technical Information
IXTF02N450
High Voltage
Power MOSFET
VDSS
ID25
= 4500V
= 200mA
625
RDS(on)
(Electrically Isolated Tab)
ISOPLUS i4-PakTM
N-Channel Enhancement Mode
Symbol
Test Conditions
VDSS
TJ = 25C to 150C
Maximum Ratings
4500
V
VDGR
TJ = 25C to 150C, RGS = 1M
4500
V
VGSS
Continuous
20
V
VGSM
Transient
30
V
ID25
TC = 25C
200
mA
IDM
TC = 25C, Pulse Width Limited by TJM
600
mA
PD
TC = 25C
78
W
- 55 ... +150
150
- 55 ... +150
C
C
C
300
260
°C
°C
20..120 / 4.5..27
N/lb.
4500
V~
6
g
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
Plastic Body for 10s
FC
Mounting Force
VISOL
50/60Hz, 1 Minute
Weight
1
5
1 = Gate
2 = Source
VGS(th)
VDS = VGS, ID = 250A
IGSS
VGS = 20V, VDS = 0V
100 nA
IDSS
VDS = 3.6kV, VGS = 0V
VDS = 4.5kV
VDS = 3.6kV
5 A
10 μA
μA
RDS(on)
4.0
Note 2, TJ = 125C
VGS = 10V, ID = 10mA, Note 1
© 2013 IXYS CORPORATION, All Rights Reserved
6.5
15
625
V
5 = Drain
Silicon Chip on Direct-Copper Bond
(DCB) Substrate
Isolated Mounting Surface
4500V~ Electrical Isolation
Molding Epoxies meet UL 94 V-0
Flammability Classification
Advantages
Characteristic Values
Min.
Typ. Max.
Isolated Tab
Features
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
2
High Voltage Package
Easy to Mount
Space Savings
High Power Density
Applications
High Voltage Power Supplies
Capacitor Discharge Applications
Pulse Circuits
Laser and X-Ray Generation Systems
DS100499A(10/13)
IXTF02N450
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
gfs
Characteristic Values
Min.
Typ.
Max.
VDS = 50V, ID = 50mA, Note 1
90
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
ISOPLUS i4-PakTM (HV) Outline
150
mS
246
pF
19
pF
5.8
pF
76
td(on)
Resistive Switching Times
17
ns
48
ns
28
ns
tf
VGS = 10V, VDS = 500V, ID = 0.5 • ID25
RG = 10 (External)
Qg(on)
Qgs
D
143
ns
10.6
nC
3.3
nC
5.5
nC
VGS = 10V, VDS = 1kV, ID = 0.5 • ID25
Qgd
S
U
A2
T
R
4
L1
2
3
Gate Input Resistance
td(off)
A
Q
1
RGi
tr
E
L
c
e
b1
A1
b
e1
Pin
Pin
Pin
Pin
1
2
3
4
=
=
=
=
Gate
Soure
Drain
Isolated
1.6 C/W
RthJC
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
200 mA
ISM
Repetitive, Pulse Width Limited by TJM
800 mA
VSD
IF = IS, VGS = 0V, Note 1
trr
IF = 200mA, -di/dt = 50A/μs, VR = 100V
Notes:
1.5
1.6
V
μs
1. Pulse test, t 300s, duty cycle, d 2%.
2. Part must be heatsunk for high-temp IDSS measurement.
PRELIMANARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are
derived from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a "considered reflection" of the anticipated result. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or moreof the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTF02N450
Fig. 1. Output Characteristics @ TJ = 25ºC
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
200
400
VGS = 10V
180
8V
VGS = 10V
350
160
300
8V
7V
I D - MilliAmperes
I D - MilliAmperes
140
120
100
80
60
6.5V
250
200
7V
150
100
40
6.5V
50
20
6V
6V
0
0
0
20
40
60
80
100
120
0
140
50
100
150
200
250
300
350
400
VDS - Volts
VDS - Volts
Fig. 4. RDS(on) Normalized to ID = 100mA Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125ºC
200
3.0
180
VGS = 10V
VGS = 10V
2.6
160
RDS(on) - Normalized
I D - MilliAmperes
7V
140
120
100
80
6V
60
2.2
I D = 200mA
1.8
I D = 100mA
1.4
1.0
40
0.6
20
5V
0.2
0
0
50
100
150
200
-50
250
-25
0
25
Fig. 5. RDS(on) Normalized to ID = 100mA Value vs.
Drain Current
2.6
75
100
125
150
Fig. 6. Maximum Drain Current vs.
Case Temperature
220
200
VGS = 10V
2.4
50
TJ - Degrees Centigrade
VDS - Volts
180
160
2.0
I D - MilliAmperes
RDS(on) - Normalized
2.2
TJ = 125ºC
1.8
1.6
1.4
TJ = 25ºC
140
120
100
80
60
1.2
40
1.0
20
0.8
0
0
50
100
150
200
250
I D - MilliAmperes
© 2013 IXYS CORPORATION, All Rights Reserved
300
350
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
125
150
IXTF02N450
Fig. 8. Transconductance
Fig. 7. Input Admittance
550
400
500
TJ = - 40ºC
350
450
400
g f s - MilliSiemens
I D - MilliAmperes
300
250
200
TJ = 125ºC
25ºC
150
- 40ºC
350
25ºC
300
125ºC
250
200
150
100
100
50
50
0
0
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
0
8.0
50
100
150
VGS - Volts
200
250
300
350
400
I D - MilliAmperes
Fig. 9. Forward Voltage Drop of Intrinsic Diode
Fig. 10. Gate Charge
10
600
VDS = 1000V
9
500
I D = 100mA
8
400
VGS - Volts
I S - MilliAmperes
I G = 1mA
7
300
TJ = 125ºC
200
6
5
4
3
TJ = 25ºC
2
100
1
0
0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0
1
1
2
3
4
5
6
7
8
9
10
11
QG - NanoCoulombs
VSD - Volts
Fig. 12. Maximum Transient Thermal Impedance
Fig. 11. Capacitance
1,000
10
1
Ciss
100
Z(th)JC - ºC / W
Capacitance - PicoFarads
f = 1 MHz
Coss
10
0.1
0.01
Crss
1
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.001
0.0001
0.001
0.01
0.1
Pulse Width - Seconds
1
10
IXTF02N450
Fig. 13. Forward-Bias Safe Operating Area
Fig. 14. Forward-Bias Safe Operating Area
@ TC = 25ºC
@ TC = 75ºC
1,000
1,000
RDS(on) Limit
RDS(on) Limit
1ms
I D - MilliAmperes
I D - MilliAmperes
1ms
100
100
10ms
TJ = 150ºC
10ms
TJ = 150ºC
TC = 25ºC
Single Pulse
DC
100ms
TC = 75ºC
Single Pulse
100ms
DC
10
10
100
1,000
VDS - Volts
© 2013 IXYS CORPORATION, All Rights Reserved
10,000
100
1,000
10,000
VDS - Volts
IXYS REF: T_02N450(H5-P640)10-15-13
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.