IXTH16N50D2
IXTT16N50D2
Depletion Mode
MOSFET
VDSX
ID(on)
RDS(on)
D
=
>
500V
16A
300m
N-Channel
TO-247 (IXTH)
G
S
G
Symbol
Test Conditions
Maximum Ratings
VDSX
TJ = 25C to 150C
500
V
VDGX
TJ = 25C to 150C, RGS = 1M
500
V
VGSX
Continuous
20
V
VGSM
Transient
30
V
PD
TC = 25C
695
W
- 55 ... +150
150
- 55 ... +150
C
C
C
300
260
°C
°C
1.13 / 10
Nm/lb.in.
6
4
g
g
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque (TO-247)
Weight
TO-247
TO-268
D
D (Tab)
S
TO-268 (IXTT)
G
S
D (Tab)
G = Gate
S = Source
D
= Drain
Tab = Drain
Features
• Normally ON Mode
• International Standard Packages
• Molding Epoxies Meet UL 94 V-0
Flammability Classification
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSX
VGS = - 5V, ID = 250A
500
VGS(off)
VDS = 25V, ID = 4mA
IGSX
VGS = 20V, VDS = 0V
IDSX(off)
VDS = VDSX, VGS = - 5V
RDS(on)
VGS = 0V, ID = 8A, Note 1
ID(on)
VGS = 0V, VDS = 25V, Note 1
- 2.0
Advantages
V
- 4.0
V
100 nA
10 A
150 A
TJ = 125C
© 2017 IXYS CORPORATION, All Rights Reserved
300 m
16
A
• Easy to Mount
• Space Savings
• High Power Density
Applications
•
•
•
•
•
•
Audio Amplifiers
Start-up Circuits
Protection Circuits
Ramp Generators
Current Regulators
Active Loads
DS100261C(4/17)
IXTH16N50D2
IXTT16N50D2
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
gfs
Characteristic Values
Min.
Typ.
Max.
VDS = 30V, ID = 8A, Note 1
7
Ciss
Coss
12
S
5250
pF
515
pF
130
pF
VGS = -10V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = + 5V, VDS = 250V, ID = 8A
RG = 3.3 (External)
Qg(on)
Qgs
VGS = + 5V, VDS = 250V, ID = 8A
Qgd
RthJC
RthCS
TO-247 Outline
TO-247
50
ns
173
ns
203
ns
220
ns
199
nC
18
nC
100
nC
0.21
0.18 C/W
C/W
Safe-Operating-Area Specification
Characteristic Values
Min.
Typ.
Max.
Symbol
Test Conditions
SOA
VDS = 500V, ID = 0.5A, TC = 75C, tp = 5s
250
W
Source-Drain Diode
1
2
P
3
e
Terminals: 1 - Gate
3 - Source
Dim.
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
A2
2.2
2.6
b
1.0
1.4
b1
1.65
2.13
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
2 - Drain
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
TO-268 Outline
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
VSD
IF = 16A, VGS = -10V, Note 1
trr
IRM
QRM
IF = 8A, -di/dt = 100A/s
VR = 100V, VGS = -10V
Characteristic Values
Min.
Typ.
Max.
0.8
695
20
7
1.3
V
ns
A
μC
Terminals: 1 - Gate
3 - Source
2 - Drain
Tab - Drain
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTH16N50D2
IXTT16N50D2
o
Fig. 2. Extended Output Characteristics @ TJ = 25 C
80
VGS = 5V
2V
1V
14
VGS = 5V
3V
70
12
10
- 0.5V
8
-1.0V
6
4
1.5V
50
1V
40
0.5V
30
0V
20
-1.5V
2
- 0.5V
-1V
10
- 2.0V
- 2.5V
0
0.0
0.5
1.0
1.5
2.0
- 2V
0
2.5
3.0
3.5
0
5
10
24
I D - Amperes
-1.0V
8
-1.5V
6
- 0.4V
20
16
- 0.8V
12
- 1.2V
8
4
- 2.0V
2
- 1.6V
4
- 2.5V
- 3.0V
0
2
3
4
5
- 2.0V
- 2.4V
0
6
7
0
10
20
VDS - Volts
30
40
50
VDS - Volts
o
Fig. 6. Dynamic Resistance vs. Gate Voltage
Fig. 5. Drain Current @ TJ = 100 C
32
35
VGS = 0V
28
10
1
30
Fig. 4. Drain Current @ TJ = 25 C
- 0.5V
0
25
32
VGS = 5.0V
1.0V
0.5V
0V
12
20
o
o
Fig. 3. Output Characteristics @ TJ = 125 C
16
14
15
VDS - Volts
VDS - Volts
I D - Amperes
2V
60
- 0V
I D - Amperes
I D - Amperes
o
Fig. 1. Output Characteristics @ TJ = 25 C
16
1.E+10
VGS = 0V
∆ VDS = 50V - 25V
1.E+09
28
1.E+08
- 0.4V
1.E+07
20
RO - Ohms
I D - Amperes
24
- 0.8V
16
12
1.E+06
o
TJ = 25 C
1.E+05
o
TJ = 100 C
1.E+04
- 1.2V
1.E+03
8
4
0
0
10
- 1.6V
1.E+02
- 2.0V
- 2.4V
1.E+01
20
1.E+00
30
VDS - Volts
© 2017 IXYS CORPORATION, All Rights Reserved
40
50
-5
-4
-3
-2
VGS - Volts
-1
0
IXTH16N50D2
IXTT16N50D2
Fig. 8. RDS(on) Normalized to ID = 8A Value
vs. Drain Current
Fig. 7. Normalized RDS(on) vs. Junction Temperature
2.5
4
VGS = 0V
2.0
3
RDS(on) - Normalized
RDS(on) - Normalized
VGS = 0V
5V
3.5
I D = 8A
1.5
1.0
2.5
o
TJ = 125 C
2
1.5
1
o
TJ = 25 C
0.5
0.5
0
-50
-25
0
25
50
75
100
125
150
0
5
10
15
Fig. 9. Input Admittance
25
30
35
40
45
50
40
45
50
Fig. 10. Transconductance
50
30
VDS = 30V
o
VDS = 30V
o
o
TJ = - 40 C, 25 C, 125 C
25
g f s - Siemens
40
I D - Amperes
20
I D - Amperes
TJ - Degrees Centigrade
30
o
TJ = 125 C
o
25 C
o
- 40 C
20
10
20
15
10
5
0
0
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0.0
0.5
0
1.0
5
10
15
Fig. 11. Breakdown and Threshold Voltages
vs. Junction Temperature
1.3
20
25
30
35
I D - Amperes
VGS - Volts
Fig. 12. Forward Voltage Drop of Intrinsic Diode
30
VGS = -10V
25
VGS(off) @ VDS = 25V
20
I S - Amperes
BV / VGS(off) - Normalized
1.2
1.1
BVDSX @ VGS = - 5V
1.0
15
o
TJ = 125 C
10
o
TJ = 25 C
0.9
5
0
0.8
-50
-25
0
25
50
75
100
125
150
TJ - Degrees Centigrade
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.3
0.4
0.5
0.6
VSD - Volts
0.7
0.8
0.9
IXTH16N50D2
IXTT16N50D2
Fig. 13. Capacitance
Fig. 14. Gate Charge
100,000
5
VDS = 250V
4
I D = 8A
3
10,000
Ciss
1,000
I G = 10mA
2
VGS - Volts
Capacitance - PicoFarads
f = 1 MHz
Coss
1
0
-1
-2
100
-3
Crss
-4
-5
10
0
5
10
15
20
25
30
35
0
40
20
40
60
100
120
140
160
180
200
Fig. 16. Forward-Bias Safe Operating Area
Fig. 15. Forward-Bias Safe Operating Area
@ TC = 75oC
o
@ TC = 25 C
100
80
QG - NanoCoulombs
VDS - Volts
100
RDS(on) Limit
RDS(on) Limit
25μs
25μs
100μs
10
1ms
10ms
1
10.000
Fig.
100μs
I D - Amperes
I D - Amperes
10
100ms
DCMaximum
17.
1ms
10ms
1
Transient Thermal Impedance
DC
o
TC = 75 C
Single Pulse
o
TC = 25 C
Single Pulse
0.1
10
1.000
100ms
o
TJ = 150 C
o
TJ = 150 C
0.1
100
1,000
10
100
VDS - Volts
1,000
VDS - Volts
Fig. 17. Maximum Transient Thermal Impedance
hvjv
0.300
Z (th)JC - K / W
0.100
0.010
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2017 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_16N50D2(8C)4-08-10
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.