IXTH62N65X2
X2-Class
Power MOSFET
VDSS
ID25
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
= 650V
= 62A
50m
TO-247
G
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 150C
650
V
VDGR
TJ = 25C to 150C, RGS = 1M
650
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C
62
A
IDM
TC = 25C, Pulse Width Limited by TJM
124
A
IA
TC = 25C
10
A
TC = 25C
2
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
15
V/ns
PD
TC = 25C
780
W
-55 ... +150
C
TJM
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
1.13 / 10
Nm/lb.in
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque
Weight
6
g
S
G = Gate
S = Source
EAS
TJ
D
D (Tab)
D
= Drain
Tab = Drain
Features
International Standard Package
Low RDS(ON) and QG
Avalanche Rated
Low Package Inductance
Advantages
High Power Density
Easy to Mount
Space Savings
Applications
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 1mA
650
VGS(th)
VDS = VGS, ID = 250μA
2.7
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
V
5.0
V
100 nA
TJ = 125C
© 2018 IXYS CORPORATION, All Rights Reserved
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
25 A
300 A
50 m
DS100679B(4/18)
IXTH62N65X2
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 10V, ID = 0.5 • ID25, Note 1
25
RGi
Gate Input Resistance
56
S
0.9
D
A
A2
A2
+
R
5800
pF
4260
pF
2.3
pF
210
890
pF
pF
28
ns
11
ns
56
ns
5
ns
100
nC
28
nC
35
nC
Crss
S
D2
+
D1
D
VGS = 0V, VDS = 25V, f = 1MHz
A
+ 0K M D B M
0P O
B
E
Q
Ciss
Coss
TO-247 (IXTH) Outline
0P1
1
2
3
4
ixys option
L1
C
E1
L
Effective Output Capacitance
Co(er)
Co(tr)
Energy related
td(on)
Resistive Switching Times
tr
td(off)
tf
Time related
VGS = 0V
VDS = 0.8 • VDSS
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 2 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
A1
c
b
b2
b4
e
+ J M C AM
O
PINS: 1 - Gate
2, 4 - Drain
3 - Source
0.16 C/W
RthJC
RthCS
C/W
0.21
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max
62
A
Repetitive, Pulse Width Limited by TJM
248
A
VSD
IF = IS, VGS = 0V, Note 1
1.4
V
trr
QRM
IRM
IF = 31A, -di/dt = 100A/μs
445
8.2
36.7
ns
μC
A
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
VR = 100V
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXTH62N65X2
o
o
Fig. 2. Extended Output Characteristics @ TJ = 25 C
Fig. 1. Output Characteristics @ TJ = 25 C
180
VGS = 10V
8V
60
VGS = 10V
160
7V
50
140
8V
30
I D - Amperes
I D - Amperes
120
40
6V
7V
100
80
60
20
6V
40
10
20
5V
5V
0
0
0
0.5
1
1.5
2
2.5
3
3.5
0
5
10
15
VDS - Volts
3.8
VGS = 10V
7V
30
VGS = 10V
3.4
3.0
50
RDS(on) - Normalized
6V
I D - Amperes
25
Fig. 4. RDS(on) Normalized to ID = 31A Value vs.
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 125 C
60
20
VDS - Volts
40
30
20
5V
2.6
I D = 62A
2.2
I D = 31A
1.8
1.4
1.0
10
0.6
4V
0.2
0
0
4.0
1
2
3
4
5
6
7
8
-50
9
0
25
50
75
100
125
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 31A Value vs.
Drain Current
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
150
1.2
VGS = 10V
3.5
1.1
o
BVDSS / VGS(th) - Normalized
TJ = 125 C
RDS(on) - Normalized
-25
VDS - Volts
3.0
2.5
2.0
o
TJ = 25 C
1.5
BVDSS
1.0
0.9
0.8
VGS(th)
0.7
1.0
0.5
0.6
0
20
40
60
80
100
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
120
140
160
-60
-40
-20
0
20
40
60
80
TJ - Degrees Centigrade
100
120
140
160
IXTH62N65X2
Fig. 7. Maximum Drain Current vs. Case Temperature
Fig. 8. Input Admittance
70
90
80
60
70
50
I D - Amperes
I D - Amperes
60
40
30
20
o
TJ = 125 C
50
o
25 C
o
- 40 C
40
30
20
10
10
0
0
-50
-25
0
25
50
75
100
125
150
3.5
4.0
4.5
5.0
TC - Degrees Centigrade
5.5
6.0
6.5
7.0
VGS - Volts
Fig. 9. Transconductance
Fig. 10. Forward Voltage Drop of Intrinsic Diode
100
200
o
TJ = - 40 C
90
180
80
160
140
25 C
I S - Amperes
g f s - Siemens
70
o
60
o
125 C
50
40
120
100
80
60
20
40
10
20
0
o
TJ = 125 C
30
o
TJ = 25 C
0
0
10
20
30
40
50
60
70
80
90
0.3
0.4
0.5
0.6
I D - Amperes
0.7
0.8
0.9
1.0
1.1
1.2
VSD - Volts
Fig. 12. Capacitance
Fig. 11. Gate Charge
100,000
10
VDS = 325V
I D = 31A
10,000
Capacitance - PicoFarads
V GS - Volts
8
I G = 10mA
6
4
2
Ciss
1,000
Coss
100
10
f = 1 MHz
0
Crss
1
0
10
20
30
40
50
60
70
80
90
100
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1000
IXTH62N65X2
Fig. 13. Output Capacitance Stored Energy
Fig. 14. Forward-Bias Safe Operating Area
45
1000
40
RDS(on) Limit
100
25μs
30
I D - Amperes
EOSS - MicroJoules
35
25
20
100μs
10
1ms
15
1
10
o
TJ = 150 C
10ms
o
TC = 25 C
Single Pulse
5
0
0.1
0
100
200
300
400
VDS - Volts
500
600
10
Fig. 15. Maximum Transient Thermal Impedance
100
1,000
VDS - Volts
1
Fig. 15. Maximum Transient Thermal Impedance
aaaa
0.4
Z(th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2018 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_62N65X2(X7-S602) 10-08-15
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.