IXTH80N65X2
X2-Class
Power MOSFET
VDSS
ID25
RDS(on)
= 650V
= 80A
38m
N-Channel Enhancement Mode
Avalanche Rated
TO-247
G
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 150C
650
V
VDGR
TJ = 25C to 150C, RGS = 1M
650
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C
80
A
IDM
TC = 25C, Pulse Width Limited by TJM
160
A
IA
TC = 25C
10
A
EAS
TC = 25C
3
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
15
V/ns
PD
TC = 25C
TJ
890
W
-55 ... +150
C
TJM
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque
1.13 / 10
Nm/lb.in
6
g
Weight
D
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features
International Standard Package
Low RDS(ON) and QG
Avalanche Rated
Low Package Inductance
Advantages
High Power Density
Easy to Mount
Space Savings
Applications
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 1mA
650
VGS(th)
VDS = VGS, ID = 250μA
2.7
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
V
5.0
V
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
100 nA
TJ = 125C
© 2018 IXYS CORPORATION, All Rights Reserved
25 A
400 μA
38 m
DS100674B(4/18)
IXTH80N65X2
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 10V, ID = 0.5 • ID25, Note 1
36
RGi
Gate Input Resistance
72
S
0.7
D
A
A2
A2
+
R
7800
pF
5600
pF
10
pF
267
1160
pF
pF
36
ns
11
ns
72
ns
7
ns
137
nC
37
nC
46
nC
Crss
S
D2
+
D1
D
VGS = 0V, VDS = 25V, f = 1MHz
A
+ 0K M D B M
0P O
B
E
Q
Ciss
Coss
TO-247 (IXTH) Outline
0P1
1
2
3
4
ixys option
L1
C
E1
L
Effective Output Capacitance
Co(er)
Co(tr)
Energy related
td(on)
Resistive Switching Times
tr
td(off)
tf
Time related
VGS = 0V
VDS = 0.8 • VDSS
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 2 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
A1
c
b
b2
b4
e
+ J M C AM
O
PINS: 1 - Gate
2, 4 - Drain
3 - Source
0.14 C/W
RthJC
RthCS
C/W
0.21
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max
80
A
Repetitive, pulse Width Limited by TJM
320
A
VSD
IF = IS, VGS = 0V, Note 1
1.4
V
trr
QRM
IRM
IF = 40A, -di/dt = 100A/μs
465
10
43
VR = 100V
ns
μC
A
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXTH80N65X2
o
o
Fig. 2. Extended Output Characteristics @ TJ = 25 C
Fig. 1. Output Characteristics @ TJ = 25 C
250
80
VGS = 10V
8V
70
VGS = 10V
9V
50
40
I D - Amperes
I D - Amperes
200
7V
60
6V
30
8V
150
7V
100
20
6V
50
10
5V
5V
0
0
0
0.5
1
1.5
2
2.5
0
3
5
10
VDS - Volts
80
3.4
VGS = 10V
7V
60
25
2.6
6V
50
40
30
2.2
I D = 80A
1.8
I D = 40A
1.4
1.0
5V
20
VGS = 10V
3.0
RDS(on) - Normalized
I D - Amperes
20
Fig. 4. RDS(on) Normalized to ID = 40A Value vs.
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 125 C
70
15
VDS - Volts
0.6
10
4V
0.2
0
0
4.5
1
2
3
4
5
6
7
-25
0
25
50
75
100
125
VDS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 40A Value vs.
Drain Current
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
1.3
VGS = 10V
4.0
150
1.2
o
BVDSS / VGS(th) - Normalized
TJ = 125 C
3.5
RDS(on) - Normalized
-50
8
3.0
2.5
2.0
o
TJ = 25 C
1.5
1.0
BVDSS
1.1
1.0
0.9
0.8
VGS(th)
0.7
0.6
0.5
0.5
0
20
40
60
80
100
120
140
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
160
180
200
220
-60
-40
-20
0
20
40
60
80
TJ - Degrees Centigrade
100
120
140
160
IXTH80N65X2
Fig. 7. Maximum Drain Current vs. Case Temperature
Fig. 8. Input Admittance
90
140
80
120
70
100
I D - Amperes
I D - Amperes
60
50
40
30
o
TJ = 125 C
80
o
25 C
o
- 40 C
60
40
20
20
10
0
0
-50
-25
0
25
50
75
100
125
150
3.5
4.0
4.5
5.0
TC - Degrees Centigrade
5.5
6.0
6.5
7.0
VGS - Volts
Fig. 9. Transconductance
Fig. 10. Forward Voltage Drop of Intrinsic Diode
140
200
o
180
TJ = - 40 C
120
160
140
o
25 C
80
I S - Amperes
g f s - Siemens
100
o
125 C
60
120
100
80
o
TJ = 125 C
60
40
o
TJ = 25 C
40
20
20
0
0
0
20
40
60
80
100
120
0.3
140
0.4
0.5
0.6
I D - Amperes
0.7
0.8
0.9
1.0
1.1
1.2
VSD - Volts
Fig. 12. Capacitance
Fig. 11. Gate Charge
100,000
10
VDS = 325V
V GS - Volts
Capacitance - PicoFarads
I D = 40A
8
I G = 10mA
6
4
2
10,000
Ciss
1,000
Coss
100
10
Crss
f = 1 MHz
0
1
0
20
40
60
80
100
120
140
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1000
IXTH80N65X2
Fig. 13. Output Capacitance Stored Energy
Fig. 14. Forward-Bias Safe Operating Area
1000
55
50
RDS(on) Limit
40
35
I D - Amperes
EOSS - MicroJoules
45
30
25
20
15
100
25μs
10
100μs
1
o
TJ = 150 C
10
TC = 25 C
Single Pulse
5
Fig. 15. Maximum Transient0.1Thermal Impedance
0
1 0
1ms
o
100
200
300
400
500
600
10
100
VDS - Volts
1,000
VDS - Volts
Fig. 15. Maximum Transient Thermal Impedance
aaaaa
0.3
Z(th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2018 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_80N65X2 (Z8-S602) 10-09-15
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.