Preliminary Technical Information
IXTP230N04T4M
TrenchT4TM
Power MOSFET
VDSS
ID25
RDS(on)
(Electrically Isolated Tab)
N-Channel Enhancement Mode
Avalanche Rated
= 40V
= 230A
2.9m
OVERMOLDED
TO-220
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 175C
40
V
VDGR
TJ = 25C to 175C, RGS = 1M
40
V
VGSM
Transient
15
V
ID25
ILRMS
IDM
TC = 25C, Limited by TJM
Lead Current Limit, RMS
TC = 25C, Pulse Width Limited by TJM
230
120
700
A
A
A
IA
EAS
TC = 25C
TC = 25C
100
600
A
mJ
PD
TC = 25C
40
W
-55 ... +175
175
-55 ... +175
C
C
C
300
260
°C
°C
2500
V~
1.13 / 10
Nm/lb.in
2.5
g
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
VISOL
50/60 Hz, 1 Minute
Md
Mounting Torque
Weight
G
DS
G = Gate
S = Source
Isolated Tab
D = Drain
Features
Plastic Overmolded Tab
International Standard Package
175°C Operating Temperature
High Current Handling Capability
Avalanche Rated
2500V~ Electrical Isolation
Low RDS(on)
Advantages
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min. Typ.
Max.
BVDSS
VGS = 0V, ID = 250A
40
VGS(th)
VDS = VGS, ID = 250A
2.0
IGSS
VGS = 15V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
V
200 nA
5
TJ = 150C
RDS(on)
Applications
V
4.0
VGS = 10V, ID = 0.5 • ID25, Notes 1,2
© 2018 IXYS CORPORATION, All Rights Reserved
Easy to Mount
Space Savings
High Power Density
A
250 A
2.9 m
• Synchronous Buck Converters
• High Current Switching Power
Supplies
• Battery Powered Electric Motors
• Resonant-Mode Power Supplies
• Electronics Ballast Application
• Class D Audio Amplifiers
DS100812B(11/18)
IXTP230N04T4M
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
gfs
VDS = 10V, ID = 60A, Note 1
RGi
Gate Input Resistance
Characteristic Values
Min. Typ.
Max.
100
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 10 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
RthJC
RthCS
170
S
1.2
7400
pF
1115
pF
760
pF
40
ns
143
ns
85
ns
82
ns
140
nC
35
nC
53
nC
0.50
3.75 C/W
C/W
OVERMOLDED TO-220
(IXTP...M)
oP
1
2
3
Terminals:
1 - Gate
2 - Drain
3 - Source
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min. Typ.
Max.
IS
VGS = 0V
230
A
ISM
Repetitive, Pulse width limited by TJM
920
A
VSD
IF = 100A, VGS = 0V, Note 1
1.4
V
trr
IF = 115A, VGS = 0V
IRM
QRM
-di/dt = 100A/s
VR = 30V
32
ns
1.6
A
25.6
nC
Notes: 1. Pulse test, t 300s, duty cycle, d 2%.
2. On through-hole packages, RDS(on) Kelvin test contact location must be 5mm
or less from the package body.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are
derived from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a "considered reflection" of the anticipated result. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves The Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or moreof the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTP230N04T4M
o
o
Fig. 1. Output Characteristics @ TJ = 25 C
Fig. 2. Extended Output Characteristics @ TJ = 25 C
400
240
VGS = 15V
10V
9V
200
I D - Amperes
I D - Amperes
120
7V
80
9V
300
8V
160
VGS = 10V
350
8V
250
200
150
7V
100
40
50
6V
6V
0
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0
0.8
1
2
3
4
2.0
240
VGS = 15V
10V
9V
7
8
9
10
VGS = 10V
8V
1.8
RDS(on) - Normalized
I D - Amperes
6
Fig. 4. Normalized RDS(on) to ID = 115A Value vs.
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 150 C
200
5
VDS - Volts
VDS - Volts
160
7V
120
80
6V
40
1.6
ID = 230A
1.4
ID = 115A
1.2
1.0
0.8
5V
0
0.6
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-50
-25
0
25
VDS - Volts
Fig. 5. Normalized RDS(on) to ID = 115A
vs. Drain Current
2.2
VGS = 10V
15V
2.0
75
100
125
150
175
Fig. 6. Input Admittance
180
VDS = 10V
160
o
TJ = 175 C
140
1.8
120
1.6
I D - Amperes
RDS(on) - Normalized
50
TJ - Degrees Centigrade
1.4
1.2
100
80
o
TJ = 150 C
o
60
o
TJ = 25 C
1.0
40
0.8
20
25 C
o
- 40 C
0
0.6
0
50
100
150
200
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
250
300
350
4.0
4.5
5.0
5.5
6.0
VGS - Volts
6.5
7.0
7.5
IXTP230N04T4M
Fig. 7. Transconductance
Fig.8. Forward Voltage Drop of Intrinsic Diode
500
300
450
o
TJ = - 40 C
VDS = 10V
250
400
200
o
25 C
300
250
I S - Amperes
g f s - Siemens
350
o
150 C
200
150
o
TJ = 150 C
100
150
o
TJ = 25 C
100
50
50
0
0
20
40
60
80
100
120
140
160
180
0
200
0.3
0.4
0.5
0.6
0.7
0.8
I D - Amperes
1.0
1.1
1.2
1.3
1.4
1.5
Fig. 10. Capacitance
Fig. 9. Gate Charge
10,000
10
VDS = 20V
9
Ciss
Capacitance - PicoFarads
I D = 115A
8
I G = 10mA
7
V GS - Volts
0.9
VSD - Volts
6
Coss
1,000
5
4
3
Crss
2
f = 1 MHz
1
0
100
0
20
40
60
80
100
120
140
0
5
10
QG - NanoCoulombs
15
20
25
30
35
40
VDS - Volts
Fig. 12. Maximum Transient Thermal Impedance
Fig. 11. Forward-Bias Safe Operating Area
10
1,000
RDS(on) Limit
25μs
1
Z(th)JC - K / W
I D - Amperes
100
100μs
External Lead
Current Limit
0.1
10
0.01
o
TJ = 175 C
1ms
o
TC = 25 C
Single Pulse
10ms
DC
1
1
10
100ms
100
VDS - Volts
IXYS Reserves The Right to Change Limits, Test Conditions, and Dimensions.
0.001
0.00001
0.0001
0.001
0.01
0.1
Pulse Width - Seconds
1
10
100
IXTP230N04T4M
Fig. 13. Resistive Turn-on Rise Time
vs. Junction Temperature
200
Fig. 14. Resistive Turn-on Rise Time
vs. Drain Current
200
RG = 10Ω , VGS = 10V
VDS = 20V
180
t r - Nanoseconds
180
t r - Nanoseconds
RG = 10Ω , VGS = 10V
VDS = 20V
I D = 230A
160
140
I D = 115A
o
160
TJ = 25 C
140
120
o
TJ = 150 C
120
100
100
25
50
75
100
125
150
110
130
150
170
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on Switching Times
vs. Gate Resistance
1000
tr
900
300
td(on)
270
600
180
I D = 115A
150
400
120
I D = 230A
300
230
90
200
60
100
30
130
td(off)
120
RG = 10Ω, VGS = 10V
VDS = 20V
100
110
I D = 115A
80
100
60
90
40
80
I D = 230A
20
0
110
20
30
40
50
60
70
25
80
50
75
100
125
RG - Ohms
TJ - Degrees Centigrade
Fig. 17. Resistive Turn-off Switching Times
vs. Drain Current
Fig. 18. Resistive Turn-off Switching Times
vs. Gate Resistance
tf
105
td(off)
140
600
tf
130
500
RG = 10Ω, VGS = 10V
100
85
90
80
t f - Nanoseconds
o
TJ = 150 C
90
td(off)
550
o
VDS = 20V
t d(off) - Nanoseconds
110
650
TJ = 150 C, VGS = 10V
120
95
60
150
400
450
I D = 230A
I D = 115A
300
350
200
250
100
150
t d(off) - Nanoseconds
VDS = 20V
100
t f - Nanoseconds
70
0
0
10
t d(off) - Nanoseconds
210
t f - Nanoseconds
VDS = 20V
t d(on) - Nanoseconds
t r - Nanoseconds
tf
120
240
700
500
210
Fig. 16. Resistive Turn-off Switching Times
vs. Junction Temperature
140
o
TJ = 150 C, VGS = 10V
800
190
I D - Amperes
80
o
TJ = 25 C
75
70
70
110
130
150
170
190
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
210
60
230
0
50
10
20
30
40
50
60
RG - Ohms
IXYS REF: T_230N04T4 (T4-M04) 3-13-17-A
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.