IXTY2R4N50P
IXTP2R4N50P
PolarTM
Power MOSFET
VDSS
ID25
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
= 500V
= 2.4A
3.75
TO-252 (IXTY)
G
S
D (Tab)
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 150C
500
V
VDGR
TJ = 25C to 150C, RGS = 1M
500
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C
2.4
A
IDM
TC = 25C, Pulse Width Limited by TJM
4.5
A
TO-220 (IXTP)
IA
TC = 25C
2.4
A
EAS
TC = 25C
100
mJ
dv/dt
IS IDM, VDD VDSS, TJ 150°C
10
V/ns
PD
TC = 25C
56
W
-55 ... +150
C
TJM
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
1.13 / 10
Nm/lb.in
0.35
3.00
g
g
TJ
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque (TO-220)
Weight
TO-252
TO-220
GD
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features
International Standard Packages
Low QG
Avalanche Rated
Low Package Inductance
Fast Intrinsic Rectifier
Advantages
High Power Density
Easy to Mount
Space Savings
Applications
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 250μA
500
VGS(th)
VDS = VGS, ID = 25μA
3.0
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
V
5.5
V
50 nA
TJ = 125C
© 2017 IXYS CORPORATION, All Rights Reserved
1 A
50 A
3.75
DC-DC Converters
Switch-Mode and Resonant-Mode
Power Supplies
AC and DC Motor Drives
Discharge Circiuts in Lasers, Spark
Igniters, RF Generators
High Voltage Pulse Power
Applications
DS99445F(6/17)
IXTY2R4N50P
IXTP2R4N50P
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
1.5
VDS = 20V, ID = 0.5 • ID25, Note 1
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 50 (External)
2.5
S
240
pF
31
pF
4
pF
6.1
nC
1.8
nC
2.9
nC
24
ns
29
ns
65
ns
28
ns
A
E
b3
4
c2
L3
A1
L4
1
2
A2
3
L1
L
b2
e
e1
e1
H
1 - Gate
2,4 - Drain
3 - Source
c
L2
0
5.55MIN
OPTIONAL
6.50MIN
4
6.40
2.85MIN
BOTTOM
VIEW
2.28
1.25MIN
LAND PATTERN RECOMMENDATION
2.25 C/W
RthJC
RthCS
TO-252 AA Outline
A
TO-220
C/W
0.50
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
IS
VGS = 0V
2.4
A
ISM
Repetitive, Pulse Width Limited by TJM
7.0
A
VSD
IF = IS, VGS = 0V, Note 1
1.5
V
trr
IF = 2.4A, -di/dt = 100A/μs, VR = 100V
TO-220 Outline
E
400
A
oP
A1
H1
Q
D2
D
ns
D1
E1
A2
EJECTOR
PIN
L1
L
Note 1. Pulse test, t 300s, duty cycle, d 2%.
e
3X b
c
e1
3X b2
1 - Gate
2,4 - Drain
3 - Source
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXTY2R4N50P
IXTP2R4N50P
o
o
Fig. 1. Output Characteristics @ TJ = 25 C
Fig. 2. Extended Output Characteristics @ TJ = 25 C
2.4
4.5
VGS = 10V
VGS = 10V
8V
4.0
2.0
7V
3.5
7V
3.0
I D - Amperes
I D - Amperes
1.6
1.2
6V
2.5
2.0
6V
1.5
0.8
1.0
0.4
0.5
5V
5V
0.0
0.0
0
1
2
3
4
5
6
7
8
9
0
10
5
10
15
25
30
Fig. 4. RDS(on) Normalized to ID = 1.2A Value vs.
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 125 C
2.4
3.4
VGS = 10V
7V
VGS = 10V
3.0
RDS(on) - Normalized
2.0
6V
1.6
I D - Amperes
20
VDS - Volts
VDS - Volts
1.2
0.8
2.6
I D = 2.4A
2.2
I D = 1.2A
1.8
1.4
1.0
0.4
0.6
5V
0.0
0.2
0
2
4
6
8
10
12
14
16
18
20
22
-50
-25
0
VDS - Volts
Fig. 5. RDS(on) Normalized to ID = 1.2A Value vs.
Drain Current
3.0
50
75
100
125
150
Fig. 6. Maximum Drain Current vs. Case Temperature
2.8
VGS = 10V
2.4
o
TJ = 125 C
2.6
2.0
2.2
I D - Amperes
RDS(on) - Normalized
25
TJ - Degrees Centigrade
1.8
o
TJ = 25 C
1.4
1.6
1.2
0.8
1.0
0.4
0.6
0.0
0
0.5
1
1.5
2
2.5
3
I D - Amperes
© 2017 IXYS CORPORATION, All Rights Reserved
3.5
4
4.5
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
125
150
IXTY2R4N50P
IXTP2R4N50P
Fig. 7. Input Admittance
Fig. 8. Transconductance
4.0
4.0
3.5
3.5
3.0
3.0
o
g f s - Siemens
I D - Amperes
TJ = - 40 C
2.5
o
2.0
TJ = 125 C
1.5
25 C
o
- 40 C
o
o
25 C
2.5
o
125 C
2.0
1.5
1.0
1.0
0.5
0.5
0.0
0.0
4.0
4.5
5.0
5.5
6.0
6.5
0.0
7.0
0.5
1.0
1.5
VGS - Volts
Fig. 9. Forward Voltage Drop of Intrinsic Diode
2.5
3.0
3.5
4.0
Fig. 10. Gate Charge
10
7
VDS = 250V
9
I D = 1.2A
8
6
I G = 10mA
7
V GS - Volts
5
I S - Amperes
2.0
I D - Amperes
4
3
6
5
4
o
TJ = 125 C
3
o
2
TJ = 25 C
2
1
1
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
0.5
1.0
1.5
VSD - Volts
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
QG - NanoCoulombs
Fig. 11. Capacitance
1,000
2.0
Fig. 12. Forward-Bias Safe Operating Area
10
RDS(on) Limit
Ciss
25μs
100
I D - Amperes
Capacitance - PicoFarads
f = 1 MHz
Coss
100μs
1
1ms
10
o
TJ = 150 C
DC
10ms
o
TC = 25 C
Single Pulse
Crss
1
0.1
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
10
100
VDS - Volts
1,000
IXTY2R4N50P
IXTP2R4N50P
Fig. 13. Maximum Transient Thermal Impedance
10
Z (th)JC - K / W
1
0.1
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2017 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_2R4N50P(1J) 6-19-17-B
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.