IXTP32N65XM
X-Class
Power MOSFET
VDSS
ID25
RDS(on)
(Electrically Isolated Tab)
N-Channel Enhancement Mode
= 650V
= 32A
135m
OVERMOLDED
TO-220
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 150C
650
V
VDGR
TJ = 25C to 150C, RGS = 1M
650
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C, Limited by TJM
32
A
IDM
TC = 25C, Pulse Width Limited by TJM
64
A
dv/dt
IS
30
V/ns
PD
TC = 25C
78
W
ID25, VDD VDSS, TJ 150°C
G
G = Gate
S = Source
-55 ... +150
C
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
2500
V~
1.13 / 10
Nm/lb.in
2.5
g
TL
TSOLD
Maximum Lead Temperature for Soldering
Plastic Body for 10s
VISOL
50/60 Hz, 1 Minute
Md
Mounting Torque
Weight
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 250μA
650
VGS(th)
VDS = VGS, ID = 250μA
3.0
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 16A, Note 1
V
100 nA
TJ = 125C
© 2018 IXYS CORPORATION, All Rights Reserved
International Standard Package
Plastic Overmolded Tab
Low RDS(ON) and QG
Avalanche Rated
2500V~ Electrical Isolation
Low Package Inductance
High Power Density
Easy to Mount
Space Savings
Applications
V
5.5
D = Drain
Advantages
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Isolated Tab
Features
TJM
TJ
DS
5 A
50 A
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
135 m
DS100589F(11/18)
IXTP32N65XM
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 10V, ID = 16A, Note 1
13
RGi
Gate Input Resistance
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
22
S
2.6
2205
pF
1600
pF
30
pF
111
349
pF
pF
23
ns
49
ns
58
ns
28
ns
54
nC
12
nC
29
nC
Crss
OVERMOLDED TO-220
(IXTP...M)
oP
1
2
3
Effective Output Capacitance
Co(er)
Co(tr)
Energy related
td(on)
Resistive Switching Times
tr
td(off)
tf
Time related
VGS = 0V
VDS = 0.8 • VDSS
VGS = 10V, VDS = 0.5 • VDSS, ID = 16A
RG = 5 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 16A
Qgd
Terminals:
1 - Gate
2 - Drain
3 - Source
1.6 C/W
RthJC
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
IS
VGS = 0V, Note1
ISM
Characteristic Values
Min.
Typ.
Max
32
A
Repetitive, pulse Width Limited by TJM
128
A
VSD
IF = IS, VGS = 0V, Note 1
1.4
V
trr
QRM
IRM
IF = 16A, -di/dt = 100A/μs
400
6.1
31
VR = 100V
ns
C
A
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXTP32N65XM
o
o
Fig. 1. Output Characteristics @ TJ = 25 C
Fig. 2. Extended Output Characteristics @ TJ = 25 C
32
70
60
24
8V
16
9V
50
20
I D - Amperes
I D - Amperes
VGS = 10V
VGS = 10V
28
7V
12
8V
40
30
7V
20
8
4
10
6V
6V
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0
5
10
15
VDS - Volts
32
3.8
VGS = 10V
8V
30
VGS = 10V
3.4
3.0
RDS(on) - Normalized
24
7V
I D - Amperes
25
Fig. 4. RDS(on) Normalized to ID = 16A Value vs.
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 125 C
28
20
VDS - Volts
20
16
12
6V
8
2.6
I D = 32A
2.2
1.8
I D = 16A
1.4
1.0
4
0.6
5V
0.2
0
0
4.0
1
2
3
4
5
6
7
8
9
10
11
-50
12
-25
0
25
50
75
100
125
150
VDS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 16A Value vs.
Drain Current
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
1.3
VGS = 10V
1.2
BVDSS / VGS(th) - Normalized
3.5
RDS(on) - Normalized
o
TJ = 125 C
3.0
2.5
2.0
o
TJ = 25 C
1.5
BVDSS
1.1
1.0
0.9
0.8
VGS(th)
0.7
1.0
0.6
0.5
0
10
20
30
40
I D - Amperes
© 2018 IXYS CORPORATION, All Rights Reserved
50
60
70
-60
-40
-20
0
20
40
60
80
TJ - Degrees Centigrade
100
120
140
IXTP32N65XM
Fig. 7. Input Admittance
Fig.8. Transconductance
45
40
o
40
35
30
g f s - Siemens
30
I D - Amperes
TJ = - 40 C
35
25
20
o
TJ = 125 C
o
25 C
15
o
25 C
25
o
125 C
20
15
o
- 40 C
10
10
5
5
0
0
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
0
5
10
15
20
VGS - Volts
25
30
35
40
45
50
I D - Amperes
Fig. 9. Forward Voltage Drop of Intrinsic Diode
Fig. 10. Gate Charge
10
100
VDS = 325V
90
I D = 16A
8
80
I G = 10mA
60
VGS - Volts
I S - Amperes
70
50
40
o
TJ = 125 C
6
4
30
o
TJ = 25 C
20
2
10
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0
5
10
15
VSD - Volts
20
25
30
35
40
45
50
QG - NanoCoulombs
Fig. 11. Capacitance
Fig. 12. Output Capacitance Stored Energy
10,000
22
18
Ciss
1,000
EOSS - MicroJoules
Capacitance - PicoFarads
20
100
C oss
16
14
12
10
8
6
10
4
C rss
f = 1 MHz
2
1
0
1
10
100
1000
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0
100
200
300
VDS - Volts
400
500
600
55
IXTP32N65XM
Fig. 13. Forward-Bias Safe Operating Area
Fig. 14. Maximum Transient Thermal Impedance
100
10
RDS(on) Limit
25μs
1
100μs
1ms
1
Z (th)JC - K / W
I D - Amperes
10
0.1
0.01
o
TJ = 150 C
o
TC = 25 C
Single Pulse
10ms
0.1
10
100
VDS - Volts
© 2018 IXYS CORPORATION, All Rights Reserved
1,000
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width - Seconds
IXYS REF: T_32N65X(J7) 6-15-18
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
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