PolarTM
Power MOSFETs
IXTT52N30P
IXTQ52N30P
VDSS
ID25
RDS(on)
= 300V
= 52A
73m
N-Channel Enhancement Mode
Avalanche Rated
TO-268 (IXTT)
G
S
D (Tab)
Symbol
Test Conditions
VDSS
TJ = 25C to 150C
Maximum Ratings
300
V
VDGR
TJ = 25C to 150C, RGS = 1M
300
V
VGSS
VGSM
Continuous
Transient
20
30
V
V
ID25
TC = 25C
52
A
IDM
TC = 25C, Pulse Width Limited by TJM
150
A
IA
TC = 25C
52
A
EAS
TC = 25C
1
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
10
V/ns
PD
TC = 25C
400
W
-55 ... +150
C
TJM
150
C
Tstg
-55 ... +150
C
TJ
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque (TO-3P)
Weight
TO-286
TO-3P
300
260
°C
°C
1.13 / 10
Nm/lb.in
4.0
5.5
g
g
TO-3P (IXTQ)
G
D
G = Gate
S = Source
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 250μA
300
VGS(th)
VDS = VGS, ID = 250μA
2.5
IGSS
VGS = 20V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
© 2013 IXYS CORPORATION, All Rights Reserved
D
= Drain
Tab = Drain
Fast Intrinsic Rectifier
Avalanche Rated
Low RDS(ON) and QG
Low Package Inductance
Advantages
High Power Density
Easy to Mount
Space Savings
Applications
V
5.0
V
100
nA
TJ = 125C
D (Tab)
Features
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
S
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
Laser Drivers
AC and DC Motor Drives
Robotics and Servo Controls
25 A
250 A
73 m
DS99115F(9/13)
IXTT52N30P
IXTQ52N30P
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
20
VDS = 10V, ID = 0.5 • ID25, Note 1
Ciss
Coss
30
S
3490
pF
550
pF
130
pF
24
ns
22
ns
60
ns
20
ns
110
nC
25
nC
53
nC
0.25
0.31 C/W
C/W
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 4 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
RthJC
RthCS
TO-3P
TO-268 Outline
1 - GATE
2,4 - DRAIN
3 - SOURCE
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max.
52
A
Repetitive, Pulse Width Limited by TJM
150
A
VSD
IF = IS, VGS = 0V, Note 1
1.5
V
trr
IF = 25A, -di/dt = 100A/s
250
ns
QRM
VR = 100V, VGS = 0V
3.0
μC
Note
TO-3P Outline
1. Pulse test, t 300s, duty cycle, d 2%.
1 - GATE
2,4 - DRAIN
3 - SOURCE
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTT52N30P
IXTQ52N30P
Fig. 1. Output Characteristics @ TJ = 25ºC
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
VGS = 10V
8V
50
VGS = 10V
9V
140
7V
120
40
8V
I D - Amperes
I D - Amperes
100
30
6V
20
80
7V
60
40
6V
10
20
5V
5V
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
5
10
3.0
VGS = 10V
8V
7V
25
30
VGS = 10V
2.6
RDS(on) - Normalized
40
I D - Amperes
20
Fig. 4. RDS(on) Normalized to ID = 26A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125ºC
50
15
VDS - Volts
VDS - Volts
6V
30
20
I D = 52A
2.2
I D = 26A
1.8
1.4
1.0
10
5V
0.6
0
0.2
0
1
2
3
4
5
6
7
8
9
10
-50
-25
0
25
50
75
100
VDS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 26A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
125
150
125
150
4.0
VGS = 10V
50
40
TJ = 125ºC
3.0
I D - Amperes
RDS(on) - Normalized
3.5
2.5
2.0
30
20
TJ = 25ºC
1.5
10
1.0
0.5
0
0
20
40
60
80
I D - Amperes
© 2013 IXYS CORPORATION, All Rights Reserved
100
120
140
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
IXTT52N30P
IXTQ52N30P
Fig. 7. Input Admittance
Fig. 8. Transconductance
60
100
90
TJ = - 40ºC
50
80
g f s - Siemens
I D - Amperes
70
60
50
TJ = 125ºC
25ºC
- 40ºC
40
25ºC
40
125ºC
30
20
30
20
10
10
0
0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
0
8.0
10
20
30
40
VGS - Volts
50
60
70
80
90
100
I D - Amperes
Fig. 9. Forward Voltage Drop of Intrinsic Diode
Fig. 10. Gate Charge
160
10
VDS = 150V
9
140
I D = 26A
8
I G = 10mA
120
VGS - Volts
I S - Amperes
7
100
80
60
TJ = 125ºC
5
4
3
TJ = 25ºC
40
6
2
20
1
0
0
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
0
20
VSD - Volts
60
80
100
120
QG - NanoCoulombs
Fig. 11. Capacitance
Fig. 12. Forward-Bias Safe Operating Area
10,000
1000
RDS(on) Limit
Ciss
100
I D - Amperes
Capacitance - PicoFarads
40
1,000
C oss
25µs
100µs
10
1ms
TJ = 150ºC
TC = 25ºC
Single Pulse
Crss
f = 1 MHz
100
10ms
DC
1
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
10
100
VDS - Volts
1,000
IXTT52N30P
IXTQ52N30P
Fig. 13. Maximum Transient Thermal Impedance
10
1
Fig. 13. Maximum Transient Thermal Impedance
aaaaaa
Z (th )JC - ºC / W
0.5
0.1
0.01
0.00001
0.0001
0.001
0.01
0.1
Pulse Width - Second
© 2013 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_52N30P(6S) 9-26-13
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.