IXTK60N50L2
IXTX60N50L2
LinearL2TM
Power MOSFET
w/Extended FBSOA
VDSS
ID25
= 500V
= 60A
< 100m
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
TO-264 (IXTK)
G
D
S
Tab
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 150C
500
V
VDGR
TJ = 25C to 150C, RGS = 1M
500
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C
60
A
IDM
TC = 25C, pulse width limited by TJM
150
A
IA
EAS
TC = 25C
TC = 25C
60
3
A
J
PD
TC = 25C
960
W
TJ
-55...+150
TJM
150
C
-55...+150
C
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
FC
Mounting torque (IXTK)
Mounting Force (IXTX)
Weight
TO-264
PLUS247
300
260
°C
°C
1.13/10
20..120 / 4.5..27
Nm/lb.in
N/lb
10
6
G
D
Tab
S
G = Gate
S = Source
D = Drain
Tab = Drain
C
Tstg
TL
TSOLD
PLUS247 (IXTX)
g
g
Features
Designed for linear operation
International standard packages
Avalanche rated
Guaranteed FBSOA at 75C
Advantages
Symbol
Test Conditions
(TJ = 25C, unless otherwise specified)
Characteristic Values
Min. Typ. Max.
BVDSS
VGS = 0V, ID = 1mA
500
VGS(th)
VDS = VGS, ID = 250μA
2.5
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25 , Note 1
TJ = 125C
© 2015 IXYS CORPORATION, All Rights Reserved.
V
4.5
V
200
nA
50 A
5 mA
100
Easy to mount
Space savings
High power density
Applications
Solid state circuit breakers
Soft start controls
Linear amplifiers
Programmable loads
Current regulators
m
DS100087A(5/15)
IXTK60N50L2
IXTX60N50L2
Symbol
Test Conditions
(TJ = 25C, unless otherwise specified)
Characteristic Values
Min.
Typ.
Max.
gfs
18
VDS= 10V, ID = 0.5 • ID25, Note 1
25
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 0.5 (External)
Qg(on)
Qgs
VGS= 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
32
S
24
nF
1325
pF
172
pF
40
ns
40
ns
165
ns
38
ns
610
nC
130
nC
365
nC
RthJC
TO-264 (IXTK) Outline
Terminals:
1 - Gate
2,4 - Drain
3 - Source
0.13 C/W
RthCS
0.15
C/W
Safe Operating Area Specification
Symbol
Test Conditions
Characteristic Values
Min.
Typ.
Max.
SOA
VDS = 400V, ID = 1.1A, TC = 75C, tp = 3s
440
W
PLUS 247TM (IXTX) Outline
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, unless otherwise specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max.
60
A
Repetitive, pulse width limited by TJM
240
A
VSD
IF = IS, VGS = 0V, Note 1
1.5
V
trr
IRM
QRM
IF = 60A, -di/dt = 100A/s,
VR = 100V, VGS = 0V
980
73
35.8
ns
A
μC
Terminals:
Dim.
Notes: 1. Pulse test, t 300s, duty cycle, d 2%.
A
A1
A2
b
b1
b2
C
D
E
e
L
L1
Q
R
1 - Gate
2 - Drain
3 - Source
Millimeter
Min. Max.
4.83
5.21
2.29
2.54
1.91
2.16
1.14
1.40
1.91
2.13
2.92
3.12
0.61
0.80
20.80 21.34
15.75 16.13
5.45 BSC
19.81 20.32
3.81
4.32
5.59
6.20
4.32
4.83
Inches
Min. Max.
.190 .205
.090 .100
.075 .085
.045 .055
.075 .084
.115 .123
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 0.244
.170 .190
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTK60N50L2
IXTX60N50L2
Fig. 1. Output Characteristics @ TJ = 25ºC
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
60
160
VGS = 20V
14V
12V
10V
9V
120
40
I D - Amperes
I D - Amperes
50
VGS = 20V
14V
12V
140
8V
30
7V
20
10V
100
9V
80
60
8V
40
10
7V
6V
20
5V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
6V
0
4.5
5.0
0
5
10
VDS - Volts
20
25
30
Fig. 4. RDS(on) Normalized to ID = 30A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125ºC
60
2.8
VGS = 20V
12V
10V
9V
VGS = 10V
2.4
RDS(on) - Normalized
50
I D - Amperes
15
VDS - Volts
8V
40
30
7V
20
2.0
I D = 60A
I D = 30A
1.6
1.2
6V
10
0.8
5V
0
0.4
0
1
2
3
4
5
6
7
8
9
10
-50
-25
0
25
50
75
100
125
150
125
150
TJ - Degrees Centigrade
VDS - Volts
Fig. 5. RDS(on) Normalized to ID = 30A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
2.8
VGS = 10V
20V
60
TJ = 125ºC
----
50
I D - Amperes
RDS(on) - Normalized
2.4
2.0
1.6
TJ = 25ºC
40
30
20
1.2
10
0.8
0
0
20
40
60
80
100
I D - Amperes
© 2015 IXYS CORPORATION, All Rights Reserved.
120
140
160
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
IXTK60N50L2
IXTX60N50L2
Fig. 7. Input Admittance
Fig. 8. Transconductance
100
TJ = - 40ºC
50
90
80
60
g f s - Siemens
I D - Amperes
25ºC
40
70
TJ = 125ºC
25ºC
- 40ºC
50
40
125ºC
30
20
30
20
10
10
0
0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
0
9.5
10
20
30
40
VGS - Volts
Fig. 9. Forward Voltage Drop of Intrinsic Diode
60
70
80
90
100
110
Fig. 10. Gate Charge
16
200
VDS = 250V
14
I D = 30A
160
I G = 10mA
VGS - Volts
12
I S - Amperes
50
I D - Amperes
120
80
TJ = 125ºC
8
6
4
TJ = 25ºC
40
10
2
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0
100
200
VSD - Volts
300
400
500
600
700
800
900
QG - NanoCoulombs
Fig. 12. Maximum Transient Thermal Impedance
Fig. 11. Capacitance
1
100,000
Ciss
10,000
Z (th)JC - ºC / W
Capacitance - PicoFarads
f = 1 MHz
Coss
0.1
0.01
1,000
Crss
100
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.001
0.00001
0.0001
0.001
0.01
0.1
Pulse Width - Seconds
1
10
IXTK60N50L2
IXTX60N50L2
Fig. 14. Forward-Bias Safe Operating Area
Fig. 13. Forward-Bias Safe Operating Area
@ TC = 75ºC
@ TC = 25ºC
1000
1000
RDS(on) Limit
RDS(on) Limit
100
100
25µs
100µs
I D - A m p e re s
I D - A m p e re s
25µs
1ms
10
10ms
100µs
10
1ms
10ms
100ms
1
100ms
DC
TJ = 150ºC
1
TJ = 150ºC
TC = 25ºC
Single Pulse
DC
TC = 75ºC
Single Pulse
0.1
0.1
10
100
VDS - Volts
© 2015 IXYS CORPORATION, All Rights Reserved.
1000
10
100
1000
VDS - Volts
IXYS REF: T_60N50L2(9R)12-08-08-B
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
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