Preliminary Technical Information
IXTU12N06T
IXTY12N06T
TrenchMVTM
Power MOSFET
VDSS
ID25
= 60V
= 12A
Ω
≤ 85mΩ
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
TO-251 (IXTU)
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGS = 1MΩ
VGSM
Transient
ID25
IDM
ILRMS
G
D
60
60
V
V
±20
V
TC = 25°C
TC = 25°C, pulse width limited by TJM
Package Current Limit, RMS TO-252
12
30
25
A
A
A
IAR
EAS
TC = 25°C
TC = 25°C
3
20
A
mJ
PD
TC = 25°C
33
W
-55 ... +175
175
-55 ... +175
°C
°C
°C
300
260
°C
°C
1.13/10
Nm/lb.in.
z
0.40
0.35
g
g
z
TJ
TJM
Tstg
TL
TSOLD
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10s
Md
Mounting torque
Weight
TO-251
TO-252
D (TAB)
S
TO-252 (IXTY)
G
S
G = Gate
S = Source
D (TAB)
D = Drain
TAB = Drain
Features
z
z
Ultra-low On Resistance
Unclamped Inductive Switching (UIS)
rated
Low package inductance
- easy to drive and to protect
175 °C Operating Temperature
Advantages
z
Symbol
Test Conditions
(TJ = 25°C unless otherwise specified)
z
Characteristic Values
Min.
Typ. Max.
BVDSS
VGS = 0V, ID = 250μA
60
VGS(th)
VDS = VGS, ID = 25μA
2.0
IGSS
VGS = ± 20V, VDS = 0V
IDSS
VDS = VDSS
VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Notes 1, 2
z
V
4.0
V
Applications
z
± 50 nA
TJ = 150°C
1 μA
100 μA
85 mΩ
z
z
z
2008 IXYS CORPORATION All rights reserved
Easy to mount
Space savings
High power density
Automotive
- Motor Drives
- 42V Power Bus
- ABS Systems
DC/DC Converters and Off-line UPS
Primary Switch for 24V and 48V
Systems
High Current Switching
Applications
DS99947(4/08)
IXTU12N06T
IXTY12N06T
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
gfs
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg(on)
Qgs
Qgd
Characteristic Values
Min.
Typ.
Max.
VDS = 10V, ID = 0.5 • ID25, Notes 1
2.9
VGS = 0V, VDS = 25V, f = 1MHz
4.7
S
256
46
10.4
pF
pF
pF
12
29
29
18
ns
ns
ns
ns
3.4
1.0
0.9
nC
nC
nC
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 6A
RG = 50Ω (External)
VGS = 10V, VDS = 0.5 • VDSS, ID = 6A
TO-251 (IXTU) Outline
4.5 °C/W
RthJC
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
12
A
ISM
Repetitive, pulse width limited by TJM
48
A
VSD
IF = 6A, VGS = 0V, Note 1
1.2
V
trr
IF = 6A, VGS = 0V, -di/dt = 100A/μs
VR = 30V
IRM
30
ns
1.34
A
1. Gate
3. Source
2.Drain
4. Drain
Dim.
Millimeter
Min.
Max.
Inches
Min. Max.
A
A1
2.19
0.89
2.38
1.14
.086
0.35
.094
.045
b
b1
b2
0.64
0.76
5.21
0.89
1.14
5.46
.025
.030
.205
.035
.045
.215
c
c1
0.46
0.46
0.58
0.58
.018
.018
.023
.023
D
5.97
6.22
.235
.245
E
e
e1
6.35
2.28
4.57
6.73
BSC
BSC
.250
.090
.180
.265
BSC
BSC
H
17.02
17.78
.670
.700
L
L1
L2
8.89
1.91
0.89
9.65
2.28
1.27
.350
.075
.035
.380
.090
.050
TO-252 (IXTY) Outline
Notes: 1. Pulse test: t ≤ 300μs; duty cycle, d ≤ 2%.
2. On through-hole packages, RDS(on) Kelvin test contact location must be
5mm or less from the package body.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
Pins:
1 - Gate
3 - Source
Dim.
Millimeter
Min. Max.
2,4 - Drain
Inches
Min.
Max.
A
A1
2.19
0.89
2.38
1.14
0.086
0.035
0.094
0.045
A2
b
0
0.64
0.13
0.89
0
0.025
0.005
0.035
b1
b2
0.76
5.21
1.14
5.46
0.030
0.205
0.045
0.215
c
c1
0.46
0.46
0.58
0.58
0.018
0.018
0.023
0.023
D
D1
5.97
4.32
6.22
5.21
0.235
0.170
0.245
0.205
E
E1
6.35
4.32
6.73
5.21
0.250
0.170
0.265
0.205
e
e1
2.28 BSC
4.57 BSC
H
L
9.40 10.42
0.51 1.02
0.370
0.020
0.410
0.040
L1
L2
L3
0.64
0.89
2.54
0.025
0.035
0.100
0.040
0.050
0.115
1.02
1.27
2.92
0.090 BSC
0.180 BSC
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTU12N06T
IXTY12N06T
Fig. 1. Output Characteristics
@ 25ºC
12
Fig. 2. Extended Output Characteristics
@ 25ºC
32
VGS = 10V
9V
8V
11
10
9
9V
24
8
7V
7
ID - Amperes
ID - Amperes
VGS = 10V
28
6
6V
5
4
8V
20
16
7V
12
6V
3
8
2
5V
5V
4
1
0
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.9
2
4
6
10
8
RDS(on) - Normalized
ID - Amperes
14
16
18
VGS = 10V
2.0
9
7V
7
6
6V
5
4
3
1.8
I D = 12A
1.6
I D = 6A
1.4
1.2
1.0
5V
2
0.8
1
0
0.6
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
-50
-25
0
25
50
75
100
125
150
175
TJ - Degrees Centigrade
VDS - Volts
Fig. 5. RDS(on) Normalized to ID = 6A Value
vs. Drain Current
Fig. 6. Drain Current vs. Case Temperature
13
3.5
12
VGS = 10V
TJ = 175ºC
15V - - - -
3.0
11
10
9
2.5
ID - Amperes
RDS(on) - Normalized
12
2.2
VGS = 10V
9V
8V
11
10
Fig. 4. RDS(on) Normalized to ID = 6A Value
vs. Junction Temperature
Fig. 3. Output Characteristics
@ 150ºC
12
8
VDS - Volts
VDS - Volts
2.0
1.5
8
7
6
5
4
3
1.0
2
TJ = 25ºC
1
0
0.5
0
5
10
15
20
ID - Amperes
2008 IXYS CORPORATION All rights reserved
25
30
35
-50
-25
0
25
50
75
100
TC - Degrees Centigrade
125
150
175
IXTU12N06T
IXTY12N06T
Fig. 8. Transconductance
Fig. 7. Input Admittance
10
6
TJ = - 40ºC
9
5
8
25ºC
g f s - Siemens
ID - Amperes
7
6
5
4
TJ = 150ºC
25ºC
- 40ºC
3
2
4
150ºC
3
2
1
1
0
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0
6.5
1
2
3
VGS - Volts
Fig. 9. Forward Voltage Drop of
Intrinsic Diode
5
6
7
8
9
10
Fig. 10. Gate Charge
10
30
VDS = 30V
9
25
I D = 6A
8
I G = 10mA
7
20
VGS - Volts
IS - Amperes
4
ID - Amperes
15
TJ = 150ºC
10
6
5
4
3
TJ = 25ºC
2
5
1
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0
1.4
0.5
1.5
2
2.5
3
3.5
Fig. 12. Maximum Transient Thermal
Impedance
Fig. 11. Capacitance
1,000
10.0
Ciss
100
Z(th)JC - ºC / W
Capacitance - PicoFarads
1
QG - NanoCoulombs
VSD - Volts
Coss
10
1.0
Crss
f = 1 MHz
1
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS reserves the right to change limits, test conditions, and dimensions.
0.1
0.00001
0.0001
0.001
0.01
Pulse Width - Second
0.1
1
IXTU12N06T
IXTY12N06T
Fig. 13. Resistive Turn-on
Rise Time vs. Junction Temperature
Fig. 14. Resistive Turn-on
Rise Time vs. Drain Current
34
34
RG = 50Ω
32
30
30
VDS = 30V
28
t r - Nanoseconds
t r - Nanoseconds
32
VGS = 10V
26
24
I
22
20
I
D
D
= 12A
= 6A
RG = 50Ω
26
VGS = 10V
24
VDS = 30V
22
20
18
18
16
16
14
14
12
TJ = 25ºC
28
TJ = 125ºC
12
25
35
45
55
65
75
85
95
105
115
125
6
7
8
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on
Switching Times vs. Gate Resistance
td(on) - - - -
19
18
24
17
22
16
20
15
18
14
16
13
14
I D = 6A, 12A
60
70
80
90
100
110
28
19
20
I D = 12A
17
25
35
45
30
105
115
16
125
TJ = 25ºC
26
24
TJ = 125ºC
22
td(off) - - - -
20
RG = 50Ω, VGS = 10V
VDS = 30V
17
10
ID - Amperes
2008 IXYS CORPORATION All rights reserved
11
12
td(off) - - - 40
TJ = 125ºC, VGS = 10V
VDS = 30V
t f - Nanoseconds
t f - Nanoseconds
95
35
36
I D = 6A
30
32
25
28
20
24
18
15
16
10
I
50
60
70
80
D
90
= 12A
100
t d ( o f f ) - Nanoseconds
28
9
85
44
40
t d ( o f f ) - Nanoseconds
20
8
75
45
tf
7
65
Fig. 18. Resistive Turn-off
Switching Times vs. Gate Resistance
32
6
55
18
TJ - Degrees Centigrade
21
tf
22
I D = 6A
18
10
120
26
24
Fig. 17. Resistive Turn-off
Switching Times vs. Drain Current
18
30
I D = 12A
RG - Ohms
19
32
I D = 6A
11
10
50
VDS = 30V
20
12
12
34
RG = 50Ω, VGS = 10V
21
t d ( o f f ) - Nanoseconds
VDS = 30V
26
t d(off) - - - -
t f - Nanoseconds
TJ = 125ºC, VGS = 10V
12
36
tf
20
t d ( o n ) - Nanoseconds
t r - Nanoseconds
28
11
22
21
tr
10
Fig. 16. Resistive Turn-off
Switching Times vs. Junction Temperature
32
30
9
ID - Amperes
20
110
16
120
RG - Ohms
IXYS REF: T_12N06T(U1) 4-03-08-A
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.