IXXH30N60B3D1
XPTTM 600V IGBT
GenX3TM w/ Diode
VCES =
IC110 =
VCE(sat)
tfi(typ) =
Extreme Light Punch Through
IGBT for 5-30 kHz Switching
600V
30A
1.85V
125ns
TO-247 AD
Symbol
Test Conditions
Maximum Ratings
VCES
VCGR
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGE = 1M
600
600
V
V
VGES
VGEM
Continuous
Transient
±20
±30
V
V
IC25
IC110
IF110
ICM
TC
TC
TC
TC
60
30
30
115
A
A
A
A
IA
EAS
TC = 25°C
TC = 25°C
20
250
A
mJ
SSOA
(RBSOA)
VGE = 15V, TVJ = 150°C, RG = 10
Clamped Inductive Load
ICM = 48
@VCE VCES
A
tsc
(SCSOA)
VGE = 15V, VCE = 360V, TJ = 150°C
RG = 82, Non Repetitive
10
μs
PC
TC = 25°C
= 25°C
= 110°C
= 110°C
= 25°C, 1ms
Md
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Mounting Torque
W
-55 ... +175
175
-55 ... +175
°C
°C
°C
300
260
°C
°C
1.13/10
Nm/lb.in
6
g
Weight
Tab
E
C
= Collector
Tab = Collector
Features
270
C
G = Gate
E = Emitter
TJ
TJM
Tstg
TL
TSOLD
G
Optimized for 5-30kHz Switching
Square RBSOA
Anti-Parallel Ultra Fast Diode
Avalanche Capability
Short Circuit Capability
International Standard Package
Advantages
High Power Density
175°C Rated
Extremely Rugged
Low Gate Drive Requirement
Applications
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVCES
IC
= 250A, VGE = 0V
600
VGE(th)
IC
= 250A, VCE = VGE
3.5
ICES
VCE = VCES, VGE = 0V
VCE = 0V, VGE = 20V
VCE(sat)
IC
= 24A, VGE = 15V, Note 1
TJ = 150C
© 2013 IXYS CORPORATION, All Rights Reserved
V
6.0
V
100 A
1 mA
TJ = 150C
IGES
100
1.66
1.97
1.85
nA
Power Inverters
UPS
Motor Drives
SMPS
PFC Circuits
Battery Chargers
Welding Machines
Lamp Ballasts
V
V
DS100334B(7/13)
IXXH30N60B3D1
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
8
IC = 24A, VCE = 10V, Note 1
Cies
Coes
Cres
VCE = 25V, VGE = 0V, f = 1MHz
Qg(on)
Qge
Qgc
IC = 24A, VGE = 15V, VCE = 0.5 • VCES
td(on)
tri
Eon
td(off)
tfi
Eoff
td(on)
tri
Eon
td(off)
tfi
Eoff
Inductive load, TJ = 25°C
IC = 24A, VGE = 15V
VCE = 400V, RG = 10
Note 2
Inductive load, TJ = 150°C
IC = 24A, VGE = 15V
VCE = 400V, RG = 10
Note 2
RthJC
RthCS
TO-247 (IXXH) Outline
14
S
1185
137
25
pF
pF
pF
39
9
17
nC
nC
nC
23
36
0.55
97
125
0.50
ns
ns
mJ
ns
ns
mJ
150
0.80
23
34
1.10
112
180
0.70
ns
ns
mJ
ns
ns
mJ
0.21
0.55 °C/W
°C/W
1 - Gate
2,4 - Collector
3 - Emitter
Reverse Diode (FRED)
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
Min. Typ.
Max.
VF
IF = 30A, VGE = 0V, Note 1
TJ = 150°C
1.6
IRM
trr
TJ = 100°C
IF = 30A, VGE = 0V, -diF/dt = 100A/μs,
TJ = 100°C
VR = 100V
IF = 1A, VGE = 0V, -diF/dt = 100A/μs, VR = 30V
100
25
RthJC
Notes:
2.7
V
V
4
A
ns
ns
0.9 °C/W
1. Pulse test, t 300μs, duty cycle, d 2%.
2. Switching times & energy losses may increase for higher VCE(clamp), TJ or RG.
IXYS Reserves the Right to Change Limits, Test Conditions,and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXXH30N60B3D1
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
Fig. 1. Output Characteristics @ TJ = 25ºC
50
VGE = 15V
14V
13V
45
40
VGE = 15V
120
12V
100
14V
11V
30
I C - Amperes
I C - Amperes
35
10V
25
20
15
80
13V
12V
60
9V
40
8V
20
11V
10V
10
9V
8V
6V
5
7V
0
0
0.5
1
1.5
2
2.5
0
3
0
5
10
15
Fig. 3. Output Characteristics @ TJ = 150ºC
50
35
11V
30
25
10V
20
9V
15
10
8V
5
7V
5V
I C = 48A
1.6
1.4
1.2
I C = 24A
1.0
0.8
0
0.5
1
1.5
2
2.5
3
I C = 12A
0.6
-50
3.5
-25
0
25
VCE - Volts
50
75
100
125
150
175
TJ - Degrees Centigrade
Fig. 5. Collector-to-Emitter Voltage vs.
Gate-to-Emitter Voltage
8
30
VGE = 15V
1.8
VCE(sat) - Normalized
40
0
25
Fig. 4. Dependence of VCE(sat) on
Junction Temperature
2.0
VGE = 15V
14V
13V
12V
45
I C - Amperes
20
VCE - Volts
VCE - Volts
Fig. 6. Input Admittance
60
TJ = 25ºC
7
50
40
I C - Amperes
VCE - Volts
6
5
4
I C = 48A
30
TJ = 150ºC
25ºC
20
3
- 40ºC
24A
10
12A
2
0
1
8
9
10
11
12
VGE - Volts
© 2013 IXYS CORPORATION, All Rights Reserved
13
14
15
4
5
6
7
8
VGE - Volts
9
10
11
12
IXXH30N60B3D1
Fig. 7. Transconductance
22
Fig. 8. Gate Charge
16
20
TJ = - 40ºC
VCE = 300V
14
I C = 24A
16
25ºC
12
14
150ºC
10
V GE - Volts
g f s - Siemens
18
12
10
8
6
I G = 10mA
8
6
4
4
2
2
0
0
0
10
20
30
40
50
0
60
5
10
I C - Amperes
Fig. 9. Capacitance
10,000
15
20
25
30
35
40
QG - NanoCoulombs
Fig. 10. Reverse-Bias Safe Operating Area
55
50
f = 1 MHz
40
1,000
I C - Amperes
Capacitance - PicoFarads
45
Cies
Coes
100
35
30
25
20
15
Cres
TJ = 150ºC
10
RG = 10Ω
dv / dt < 10V / ns
5
0
10
0
5
10
15
20
25
30
35
100
40
200
300
Fig. 11. Forward-Bias Safe Operating Area
1000
400
500
600
VCE - Volts
VCE - Volts
Fig. 12. Maximum Transient Thermal Impedance
1
VCE(sat) Limit
25µs
10
100µs
1
Z(th)JC - ºC / W
I D - Amperes
100
0.01
1ms
TJ = 175ºC
TC = 25ºC
Single Pulse
DC
10ms
0.1
1
0.1
10
100
1000
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions,and Dimensions.
0.001
0.00001
0.0001
0.001
0.01
Pulse Width - Second
0.1
1
IXXH30N60B3D1
Fig. 13. Inductive Switching Energy Loss vs.
Gate Resistance
Eoff
1.8
4.5
---
1.2
Eoff
4.0
TJ = 150ºC , VGE = 15V
2.5
1.0
2.0
0.8
1.5
1.5
0.6
1.0
TJ = 25ºC
0.4
I C = 24A
0.6
0.8
0.5
1.0
0.4
0.2
0.5
10
20
30
40
50
60
70
0.0
10
80
15
20
25
Fig. 15. Inductive Switching Energy Loss vs.
Junction Temperature
1.4
Eoff
Eon
tfi
---2.5
0.6
1.0
t f i - Nanoseconds
1.5
- MilliJoules
Eoff - MilliJoules
on
0.8
I C = 24A
0.4
0.2
100
180
200
I C = 24A
160
150
I C = 48A
100
50
10
20
30
40
Fig. 17. Inductive Turn-off Switching Times vs.
Collector Current
tfi
tfi
td(off) - - - 160
180
140
160
140
100
TJ = 25ºC
40
I C - Amperes
© 2013 IXYS CORPORATION, All Rights Reserved
45
50
110
I C = 24A
140
100
120
90
I C = 48A
60
80
70
40
60
60
35
120
RG = 10Ω, VGE = 15V
80
80
30
130
td(off) - - - -
100
100
20
t f i - Nanoseconds
120
25
80
25
50
75
100
TJ - Degrees Centigrade
125
60
150
t d(off) - Nanoseconds
180
t d(off) - Nanoseconds
TJ = 150ºC
20
70
VCE = 400V
VCE = 400V
220
15
60
Fig. 18. Inductive Turn-off Switching Times vs.
Junction Temperature
200
180
RG = 10Ω, VGE = 15V
10
50
RG - Ohms
TJ - Degrees Centigrade
260
250
120
0.0
150
125
300
td(off) - - - -
140
0.5
300
50
t d(off) - Nanoseconds
2.0
E
1.0
75
45
VCE = 400V
I C = 48A
50
40
TJ = 150ºC, VGE = 15V
200
VCE = 400V
25
35
Fig. 16. Inductive Turn-off Switching Times vs.
Gate Resistance
220
3.0
RG = 10ΩVGE = 15V
1.2
30
I C - Amperes
RG - Ohms
t f i - Nanoseconds
Eon - MilliJoules
1.2
2.0
TJ = 150ºC
E on - MilliJoules
3.0
I C = 48A
2.5
----
VCE = 400V
3.5
1.4
Eon
RG = 10ΩVGE = 15V
1.0
VCE = 400V
1.6
E off - MilliJoules
Eon -
E off - MilliJoules
2.0
Fig. 14. Inductive Switching Energy Loss vs.
Collector Current
IXXH30N60B3D1
Fig. 19. Inductive Turn-on Switching Times vs.
Gate Resistance
tri
140
VCE = 400V
80
80
70
70
60
I C = 24A
80
50
I C = 48A
60
40
40
30
20
20
0
t d(on) - Nanoseconds
100
10
10
20
30
40
50
60
70
tri
28
27
VCE = 400V
26
I C = 48A
60
25
50
24
40
23
I C = 24A
30
22
20
25
50
75
60
26
TJ = 25ºC, 125ºC
50
24
40
22
30
20
20
18
16
10
100
t d(on) - Nanoseconds
t r i - Nanoseconds
td(on) - - - -
RG = 10Ω, VGE = 15V
70
28
VCE = 400V
15
20
25
30
35
I C - Amperes
Fig. 21. Inductive Turn-on Switching Times vs.
Junction Temperature
80
td(on) - - - -
RG = 10Ω, VGE = 15V
10
80
RG - Ohms
90
tri
125
30
21
150
TJ - Degrees Centigrade
IXYS Reserves the Right to Change Limits, Test Conditions,and Dimensions.
40
45
50
t d(on) - Nanoseconds
120
t r i - Nanoseconds
td(on) - - - -
TJ = 150ºC, VGE = 15V
90
t r i - Nanoseconds
160
Fig. 20. Inductive Turn-on Switching Times vs.
Collector Current
IXXH30N60B3D1
1000
60
A
50
IF
30
TVJ = 100°C
VR = 300V
nC
800
Qr
30
15
400
20
10
TVJ = 25°C
200
10
0
IF= 60A
IF= 30A
IF= 15A
20
IF= 60A
IF= 30A
IF= 15A
600
TVJ =100°C
25
IRM
40
TVJ =150°C
TVJ= 100°C
VR = 300V
A
0
1
2
5
0
100
3 V
A/s 1000
-diF/dt
VF
90
2.0
trr
Kf
400
600 A/s
800 1000
-diF/dt
1.00
TVJ = 100°C
IF = 30A
V
V FR
15
IF = 60A
IF = 30A
IF = 15A
80
200
20
TVJ = 100°C
VR = 300V
ns
0
Fig. 24. Peak Reverse Current IRM
Versus -diF/dt
Fig. 23. Reverse Recovery Charge Qr
Versus -diF/dt
Fig. 22. Forward Current IF Versus VF
1.5
0
s
tfr
0.75
tfr
VFR
1.0
10
0.50
5
0.25
IRM
0.0
70
Qr
0.5
0
40
80
120 °C 160
60
0
200
T VJ
400
600
800
A/s
1000
0
0
200
400
-diF/dt
Fig. 25. Dynamic Parameters Qr, IRM
Versus TVJ
Fig. 26. Recovery Time trr Versus
-diF/dt
0.00
600 A/s
800 1000
diF/dt
Fig. 28. Peak Forward Voltage VFR
and tfr Versus diF/dt
1
K/W
Constants for ZthJC calculation:
i
0.1
1
2
3
Z thJC
Rthi (K/W)
ti (s)
0.502
0.193
0.205
0.0052
0.0003
0.0162
0.01
0.001
0.00001
DSEP 29-06
0.0001
0.001
0.01
0.1
t
s
1
Fig. 28. Transient Thermal Resistance Junction to Case
© 2013 IXYS CORPORATION, All Rights Reserved
IXYS REF: IXX_30N60B3D1(4D)05-06-11
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.