IXXK110N65B4H1
IXXX110N65B4H1
XPTTM 650V GenX4TM
w/ Sonic Diode
VCES =
IC110 =
VCE(sat)
tfi(typ) =
Extreme Light Punch Through
IGBT for 10-30kHz Switching
650V
110A
2.10V
43ns
TO-264 (IXXK)
Symbol
Test Conditions
VCES
VCGR
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGE = 1M
Maximum Ratings
650
650
V
V
VGES
VGEM
Continuous
Transient
±20
±30
V
V
IC25
ILRMS
IC110
IF110
ICM
TC = 25°C (Chip Capability)
Terminal Current Limit
TC = 110°C
TC = 110°C
TC = 25°C, 1ms
250
160
110
78
570
A
A
A
A
A
SSOA
(RBSOA)
VGE = 15V, TVJ = 150°C, RG = 2
Clamped Inductive Load
ICM = 220
@VCE VCES
A
tsc
(SCSOA)
VGE = 15V, VCE = 360V, TJ = 150°C
RG = 82, Non Repetitive
10
μs
G = Gate
C = Collector
PC
TC = 25°C
Features
880
W
-55 ... +175
175
-55 ... +175
°C
°C
°C
300
260
°C
°C
1.13/10
Nm/lb.in.
20..120 /4.5..27
N/lb.
10
6
g
g
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque (TO-264)
FC
Mounting Force
Weight
TO-264
PLUS247
(PLUS247)
G
C
E
PLUS247 (IXXX)
G
Characteristic Values
Min.
Typ.
Max.
BVCES
IC
= 250A, VGE = 0V
650
VGE(th)
IC
= 250A, VCE = VGE
4.0
ICES
VCE = VCES, VGE = 0V
V
6.5
25 A
3 mA
TJ = 150C
IGES
VCE = 0V, VGE = 20V
VCE(sat)
IC
= 110A, VGE = 15V, Note 1
TJ = 150C
V
100
1.72
2.05
2.10
nA
V
V
C
E
Tab
E
= Emitter
Tab = Collector
Optimized for 10-30kHz Switching
Square RBSOA
Short Circuit Capability
Anti-Parallel Sonic Diode
High Current Handling Capability
International Standard Packages
High Power Density
Low Gate Drive Requirement
Applications
©2019 IXYS CORPORATION, All Rights Reserved
G
Advantages
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Tab
Power Inverters
UPS
Motor Drives
SMPS
PFC Circuits
Battery Chargers
Welding Machines
Lamp Ballasts
High Frequency Power Inverters
DS100502D(4/19 )
IXXK110N65B4H1
IXXX110N65B4H1
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
30
IC = 60A, VCE = 10V, Note 1
Cies
Coes
Cres
VCE = 25V, VGE = 0V, f = 1MHz
Qg(on)
Qge
Qgc
IC = 110A, VGE = 15V, VCE = 0.5 • VCES
td(on)
tri
Eon
td(off)
tfi
Eoff
td(on)
tri
Eon
td(off)
tfi
Eoff
Inductive load, TJ = 25°C
IC = 55A, VGE = 15V
VCE = 400V, RG = 2
Note 2
Inductive load, TJ = 150°C
IC = 55A, VGE = 15V
VCE = 400V, RG = 2
Note 2
RthJC
RthCS
52
S
5500
470
80
pF
pF
pF
183
nC
32
nC
83
nC
26
40
2.20
146
43
1.05
ns
ns
mJ
ns
ns
mJ
1.70
25
40
3.00
140
110
2.16
ns
ns
mJ
ns
ns
mJ
0.15
0.17 °C/W
°C/W
Reverse Sonic Diode (FRD)
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
VF
IF = 100A, VGE = 0V, Note 1
IRM
IF = 100A, VGE = 0V,
-diF/dt = 1500A/sVR = 300V
trr
Characteristic Values
Min.
Typ.
Max.
TJ = 150C
1.7
1.8
TJ = 150C
95
A
100
ns
V
V
0.38 C/W
RthJC
Notes:
2.3
1. Pulse test, t 300μs, duty cycle, d 2%.
2. Switching times & energy losses may increase for higher VCE(Clamp), TJ or RG.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXXK110N65B4H1
IXXX110N65B4H1
o
o
Fig. 2. Extended Output Characteristics @ TJ = 25 C
Fig. 1. Output Characteristics @ TJ = 25 C
500
VGE = 15V
13V
12V
200
400
160
14V
350
13V
10V
I C - Amperes
I C - Amperes
VGE = 15V
450
11V
120
9V
80
8V
40
7V
0
300
12V
250
11V
200
150
10V
100
9V
50
8V
0
0
0.5
1
1.5
2
2.5
3
3.5
7V
0
2
4
6
8
10
2.0
VGE = 15V
14V
13V
10V
80
9V
40
VCE(sat) - Normalized
I C - Amperes
120
8V
2.5
3
3.5
4
1.6
I C = 220A
1.4
1.2
I C = 110A
1.0
0.6
-50
4.5
-25
0
25
VCE - Volts
50
75
100
125
150
175
TJ - Degrees Centigrade
Fig. 5. Collector-to-Emitter Voltage vs.
Gate-to-Emitter Voltage
4.5
24
I C = 55A
7V
2
22
0.8
0
1.5
20
VGE = 15V
1.8
11V
1
18
12V
160
0.5
16
Fig. 4. Dependence of VCE(sat) on
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 150 C
0
14
VCE - Volts
VCE - Volts
200
12
Fig. 6. Input Admittance
350
o
TJ = 25 C
4.0
300
o
TJ = - 40 C
o
3.5
25 C
250
3.0
I C - Amperes
VCE - Volts
o
I C = 220A
2.5
2.0
TJ = 150 C
200
150
100
110A
1.5
50
55A
0
1.0
8
9
10
11
12
VGE - Volts
©2019 IXYS CORPORATION, All Rights Reserved
13
14
15
4
5
6
7
8
9
10
VGE - Volts
11
12
13
14
15
IXXK110N65B4H1
IXXX110N65B4H1
Fig. 7. Transconductance
Fig. 8. Gate Charge
16
90
o
TJ = - 40 C
80
VCE = 325V
14
I C = 110A
70
60
25 C
V GE - Volts
g f s - Siemens
I G = 10mA
12
o
50
o
150 C
40
30
10
8
6
4
20
2
10
0
0
0
50
100
150
200
250
300
0
350
20
40
I C - Amperes
80
100
120
140
160
180
200
QG - NanoCoulombs
Fig. 10. Reverse-Bias Safe Operating Area
Fig. 9. Capacitance
240
10,000
Cies
200
1,000
I C - Amperes
Capacitance - PicoFarads
60
Coes
160
120
80
100
o
Cres
TJ = 150 C
40
RG = 2Ω
dv / dt < 10V / ns
f = 1 MHz
10
0
0
5
10
15
1
20
25
VCE - Volts
30
35
40
100
200
300
400
Fig. 13. Maximum Transient Thermal Impedance
500
600
700
VCE - Volts
Fig. 11. Maximum Transient Thermal Impedance (IGBT)
AAAAA
0.3
Z(th)JC - K / W
0.1
D = 0.5
D = 0.2
D = 0.1
0.01
D = tp / T
D = 0.05
tp
D = 0.02
D = 0.01
T
Single Pulse
0.001
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1.E-01
1.E+00
1.E+01
IXXK110N65B4H1
IXXX110N65B4H1
Fig. 12. Inductive Switching Energy Loss vs.
Gate Resistance
7
Eoff
6
Eon
o
14
6
12
5
TJ = 150 C , VGE = 15V
10
3
6
2
4
I C = 55A
1
4
6
8
10
12
14
o
TJ = 150 C
4
6
o
TJ = 25 C
2
Eoff
2
50
16
12
55
60
65
70
2
4
0
100
tfi
100
80
250
I C = 55A
60
150
20
100
50
3
4
5
6
o
TJ = 25 C
40
120
20
90
95
I C - Amperes
©2019 IXYS CORPORATION, All Rights Reserved
100
105
100
110
t f i - Nanoseconds
t f i - Nanoseconds
140
85
7
8
9
10
11
12
13
14
15
Fig. 17. Inductive Turn-off Switching Times vs.
Junction Temperature
tfi
td(off)
240
220
RG = 2Ω , VGE = 15V
VCE = 400V
200
100
180
80
160
I C = 55A, 110A
60
140
40
120
20
100
0
25
50
75
100
TJ - Degrees Centigrade
125
80
150
t d(off) - Nanoseconds
60
t d(off) - Nanoseconds
160
80
200
40
120
o
75
300
I C = 110A
140
TJ = 150 C
70
400
350
200
180
65
450
120
160
220
td(off)
100
60
500
VCE = 400V
2
VCE = 400V
55
0
110
RG - Ohms
RG = 2Ω , VGE = 15V
50
105
0
0
150
125
Fig. 16. Inductive Turn-off Switching Times vs.
Collector Current
80
100
td(off)
TJ - Degrees Centigrade
120
95
2
I C = 55A
140
90
o
t f i - Nanoseconds
6
75
85
t d(off) - Nanoseconds
I C = 110A
3
E on - MilliJoules
8
50
80
TJ = 150 C, VGE = 15V
140
4
E off - MilliJoules
tfi
160
10
VCE = 400V
25
75
Fig. 15. Inductive Turn-off Switching Times vs.
Gate Resistance
180
Eon
RG = 2Ω , VGE = 15V
1
4
I C - Amperes
Fig. 14. Inductive Switching Energy Loss vs.
Junction Temperature
5
8
3
RG - Ohms
6
10
0
0
2
Eon
RG = 2Ω , VGE = 15V
1
2
0
12
E on - MilliJoules
8
E on - MilliJoules
4
Eoff
VCE = 400V
E off - MilliJoules
VCE = 400V
5
E off - MilliJoules
I C = 110A
Fig. 13. Inductive Switching Energy Loss vs.
Collector Current
IXXK110N65B4H1
IXXX110N65B4H1
Fig. 18. Inductive Turn-on Switching Times vs.
Gate Resistance
200
tri
180
td(on)
100
180
90
160
Fig. 19. Inductive Turn-on Switching Times vs.
Collector Current
tri
o
TJ = 150 C, VGE = 15V
140
70
120
60
100
50
I C = 55A
80
40
140
36
VCE = 400V
o
TJ = 25 C
120
33
100
30
80
27
o
TJ = 150 C
60
24
60
30
40
21
40
20
20
18
10
0
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
50
RG - Ohms
tri
60
td(on)
RG = 2Ω , VGE = 15V
160
50
VCE = 400V
40
I C = 110A
80
30
I C = 55A
20
0
25
t d(on) - Nanoseconds
120
40
50
75
100
55
60
65
70
75
80
85
I C - Amperes
Fig. 20. Inductive Turn-on Switching Times vs.
Junction Temperature
200
t r i - Nanoseconds
39
RG = 2Ω , VGE = 15V
125
10
150
TJ - Degrees Centigrade
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
90
95
100
105
15
110
t d(on) - Nanoseconds
I C = 110A
t r i - Nanoseconds
80
VCE = 400V
t d(on) - Nanoseconds
t r i - Nanoseconds
160
td(on)
42
IXXK110N65B4H1
IXXX110N65B4H1
Fig. 22. Typ. Reverse Recovery Charge Qrr vs. -diF/dt
Fig. 21. Typ. Forward characteristics
20
200
o
TVJ = 150 C
175
VR = 300V
16
150
IF = 200A
o
TVJ = 25 C
o
TVJ = 150 C
12
Q RM [μC]
I F [A]
125
100
100A
8
75
50A
50
4
25
0
1000
0
0
0.5
1
1.5
2
2.5
3
1200
1400
1800
2000
Fig. 24. Typ. Recovery Time trr vs. -diF/dt
Fig. 23. Typ. Peak Reverse Current IRM vs. -diF/dt
350
140
IF = 200A
o
TVJ = 150 C
120
1600
-diF/ dt [A/μs]
VF - [V]
o
TVJ = 150 C
VR = 300V
VR = 300V
300
250
100A
trr [ns]
I RM [A]
100
50A
80
200
IF = 200A
150
100A
60
100
40
1000
1200
1400
1600
1800
50A
50
1000
2000
diF/dt [A/μs]
1200
1400
1600
1800
2000
-diF/dt [A/μs]
Fig. 26. Maximum Transient Thermal Impedance
(Diode)
Fig. 25. Typ. Recovery Energy Erec vs. -diF/dt
1
5
o
TVJ = 150 C
IF = 200A
VR = 300V
D = 0.5
3
Z (th)JC - K / W
E rec [mJ]
4
100A
2
0.1
D = 0.2
D = 0.1
D = 0.05
D = tp / T
D = 0.02
0.01
tp
D = 0.01
50A
1
0
1000
1200
1400
1600
-diF/dt [A/μs]
©2019 IXYS CORPORATION, All Rights Reserved
1800
Single Pulse
2000
0.001
1.E-05
1.E-04
T
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Pulse Width - Seconds
IXYS REF: IXX_110N65B4 (E8-RZ43) 4-12-19-A
IXXK110N65B4H1
IXXX110N65B4H1
PLUS247 Outline
PINS:
1 - Gate
2,4 - Collector
3 - Emitter
TO-264 Outline
PINS:
1 - Gate 2,4 - Collector
3 - Emitter
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXXK110N65B4H1
IXXX110N65B4H1
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and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
©2019 IXYS CORPORATION, All Rights Reserved