Advance Technical Information
IXYL40N250CV1
High Voltage
XPTTM IGBT
w/ Diode
VCES =
IC110 =
VCE(sat)
tfi(typ) =
2500V
40A
4.0V
134ns
(Electrically Isolated Tab)
ISOPLUS i5-PakTM
Symbol
Test Conditions
VCES
VCGR
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGE = 1M
Maximum Ratings
VGES
VGEM
2500
2500
V
V
Continuous
Transient
±20
±30
V
V
IC25
IC110
IF110
ICM
TC
TC
TC
TC
80
40
23
380
A
A
A
A
SSOA
(RBSOA)
VGE = 15V, TVJ = 150°C, RG = 1
Clamped Inductive Load
ICM = 80
1500
A
V
PC
TC = 25°C
577
W
-55 ... +175
175
-55 ... +175
°C
°C
°C
300
260
°C
°C
40..120 / 9..27
N/lb
2500
V~
8
g
= 25°C
= 110°C
= 110°C
= 25°C, 1ms
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
FC
Mounting Force
VISOL
50/60 Hz, RM, t = 1min
Weight
G
E
C
G = Gate
C = Collector
Isolated Tab
E = Emitter
Features
Silicon Chip on Direct-Copper Bond
(DCB) Substrate
Isolated Mounting Surface
4500V~ Electrical Isolation
High Voltage Package
High Blocking Voltage
High Peak Current Capability
Low Saturation Voltage
Advantages
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
BVCES
IC
= 250μA, VGE = 0V
VGE(th)
IC
= 250μA, VCE = VGE
ICES
VCE = VCES, VGE = 0V
VCE = 0.8 • VCES
IGES
VCE = 0V, VGE = ±20V
VCE(sat)
IC
Characteristic Values
Min.
Typ.
Max.
2500
V
3.0
5.0
© 2017 IXYS CORPORATION, All Rights Reserved
V
25 μA
5 mA
TJ = 125°C
= 40A, VGE = 15V, Note 1
TJ = 150°C
3.2
4.4
±100
nA
4.0
V
V
Low Gate Drive Requirement
High Power Density
Applications
UPS
Motor Drives
SMPS
PFC Circuits
High Frequency Power Inverters
DS100815B(5/17)
IXYL40N250CV1
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
IC = 40A, VCE = 10V, Note 1
24
RGi
Gate Input Resistance
Cies
Coes
Cres
VCE = 25V, VGE = 0V, f = 1MHz
Qg(on)
Qge
Qgc
IC = 40A, VGE = 15V, VCE = 0.5 • VCES
td(on)
tri
Eon
td(off)
tfi
Eoff
td(on)
tri
Eon
td(off)
tfi
Eoff
Inductive load, TJ = 25°C
IC = 40A, VGE = 15V
VCE = 0.5 • VCES, RG = 1
Note 2
Inductive load, TJ = 150°C
IC = 40A, VGE = 15V
VCE = 0.5 • VCES, RG = 1
Note 2
RthJC
RthCS
42
S
2.2
5470
280
74
pF
pF
pF
270
28
110
nC
nC
nC
21
22
11.7
200
134
6.9
ns
ns
mJ
ns
ns
mJ
21
22
14.7
255
250
11.5
ns
ns
mJ
ns
ns
mJ
0.15
0.26 °C/W
°C/W
Reverse Sonic Diode (FRD)
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
VF
IF = 40A, VGE = 0V, Note 1
TJ = 150°C
3.4
V
V
IRM
IF = 40A, VGE = 0V, TJ = 150°C
-diF/dt = 600A/sVR = 1200V
52
A
210
ns
trr
4.0
RthJC
Notes:
0.83 °C/W
1. Pulse test, t 300μs, duty cycle, d 2%.
2. Switching times & energy losses may increase for higher VCE(Clamp), TJ or RG.
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are
derived from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a "considered reflection" of the anticipated result. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXYL40N250CV1
o
Fig. 1. Output Characteristics @ TJ = 25oC
Fig. 2. Extended Output Characteristics @ TJ = 25 C
80
VGE = 15V
10V
8V
7V
70
VGE = 15V
6V
14V
13V
12V
11V
10V
400
50
I C - Amperes
I C - Amperes
60
500
5V
40
30
300
9V
8V
200
7V
4V
20
6V
100
10
5V
3V
0
4V
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
5
10
15
VCE - Volts
80
2.2
VGE = 15V
12V
10V
8V
7V
6V
30
VGE = 15V
2.0
I C = 80A
1.8
5V
VCE(sat) - Normalized
I C - Amperes
60
25
Fig. 4. Dependence of VCE(sat) on
Junction Temperature
o
Fig. 3. Output Characteristics @ TJ = 150 C
70
20
VCE - Volts
50
40
30
4V
20
1.6
I C = 40A
1.4
1.2
1.0
I C = 20A
0.8
10
0.6
3V
0.4
0
0
1
2
3
4
5
6
7
-50
8
-25
0
25
VCE - Volts
Fig. 5. Collector-to-Emitter Voltage vs.
Gate-to-Emitter Voltage
7
50
75
100
125
150
175
TJ - Degrees Centigrade
Fig. 6. Input Admittance
140
o
TJ = 25 C
120
6
5
I C - Amperes
VCE - Volts
100
I C = 80A
4
80
60
o
40A
TJ = 150 C
40
o
25 C
3
o
- 40 C
20
20A
0
2
3
4
5
6
7
8
9
10
11
VGE - Volts
© 2017 IXYS CORPORATION, All Rights Reserved
12
13
14
15
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VGE - Volts
4.5
5.0
5.5
6.0
6.5
IXYL40N250CV1
Fig. 7. Transconductance
Fig. 8. Gate Charge
90
16
o
80
TJ = - 40 C
70
I C = 40A
I G = 10mA
12
o
60
25 C
V GE - Volts
g f s - Siemens
VCE = 1250V
14
50
o
150 C
40
30
10
8
6
4
20
2
10
0
0
0
20
40
60
80
100
120
140
160
0
40
80
I C - Amperes
120
160
200
240
280
QG - NanoCoulombs
Fig. 9. Capacitance
Fig. 10. Reverse-Bias Safe Operating Area
90
10,000
80
70
60
1,000
I C - Amperes
Capacitance - PicoFarads
Cies
C oes
50
40
30
100
Cres
f = 1 MHz
10
o
20
TJ = 150 C
10
RG = 1Ω
dv / dt < 10V / ns
0
0
5
10
15
20
25
30
35
250
40
500
750
1000
VCE - Volts
1250
1500
1750
2000
2250
2500
VCE - Volts
Fig. 11. Maximum Transient Thermal Impedance
1
Z (th)JC - K / W
0.1
0.01
0.001
0.0001
0.00001
0.0001
0.001
0.01
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.1
1
10
IXYL40N250CV1
Fig. 12. Inductive Switching Energy Loss vs.
Gate Resistance
Eoff
35
o
TJ = 150 C , VGE = 15V
40
28
35
24
30
25
20
20
15
15
10
10
I C = 40A
5
0
5
6
7
8
9
12
15
10
o
4
5
0
0
20
10
30
40
Fig. 14. Inductive Switching Energy Loss vs.
Junction Temperature
28
32
I C = 80A
VCE = 1250V
20
16
16
12
12
I C = 40A
8
td(off)
4
0
VCE = 1250V
480
250
420
I C = 40A
200
125
0
150
150
300
100
240
50
180
1
2
3
4
360
350
320
300
tfi
8
9
10
360
td(off)
320
RG = 1Ω, VGE = 15V
200
240
150
250
280
I C = 40A
200
240
I C = 80A
150
200
160
100
160
120
50
200
o
TJ = 25 C
100
50
20
30
40
50
60
I C - Amperes
© 2017 IXYS CORPORATION, All Rights Reserved
70
80
25
50
75
100
TJ - Degrees Centigrade
125
120
150
t d(off) - Nanoseconds
280
o
TJ = 150 C
t d(off) - Nanoseconds
t f i - Nanoseconds
7
VCE = 1250V
VCE = 1250V
250
6
Fig. 17. Inductive Turn-off Switching Times vs.
Junction Temperature
td(off)
RG = 1Ω, VGE = 15V
t f i - Nanoseconds
tfi
5
RG - Ohms
Fig. 16. Inductive Turn-off Switching Times vs.
Collector Current
300
360
I C = 80A
TJ - Degrees Centigrade
350
540
8
4
100
600
t d(off) - Nanoseconds
20
75
80
o
300
24
50
70
TJ = 150 C, VGE = 15V
28
24
25
tfi
350
Eon - MilliJoules
E off - MilliJoules
Eon
RG = 1ΩVGE = 15V
60
Fig. 15. Inductive Turn-off Switching Times vs.
Gate Resistance
400
36
t f i - Nanoseconds
Eoff
32
50
I C - Amperes
RG - Ohms
36
20
o
TJ = 150 C
TJ = 25 C
0
4
16
25
8
5
3
30
E on - MilliJoules
25
2
Eon
VCE = 1250V
20
E on - MilliJoules
I C = 80A
1
Eoff
35
RG = 1ΩVGE = 15V
VCE = 1250V
30
E off - MilliJoules
Eon
E off - MilliJoules
40
Fig. 13. Inductive Switching Energy Loss vs.
Collector Current
IXYL40N250CV1
Fig. 18. Inductive Turn-on Switching Times vs.
Gate Resistance
140
tri
120
td(on)
o
50
80
45
70
Fig. 19. Inductive Turn-on Switching Times vs.
Collector Current
tri
35
I C = 80A
60
30
I C = 40A
40
25
20
0
1
2
3
4
5
6
7
8
9
tri
I C = 80A
60
0
14
20
29
23
40
21
I C = 40A
20
19
0
100
125
20
15
10
t d(on) - Nanoseconds
t r i - Nanoseconds
o
TJ = 25 C
30
16
27
75
22
10
25
50
40
20
VCE = 1250V
80
24
TJ = 150 C
18
td(on)
RG = 1Ω, VGE = 15V
25
o
50
30
40
50
I C - Amperes
Fig. 20. Inductive Turn-on Switching Times vs.
Junction Temperature
100
26
20
RG - Ohms
120
VCE = 1250V
60
t r i - Nanoseconds
t r i - Nanoseconds
80
28
17
150
TJ - Degrees Centigrade
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
60
70
80
t d(on) - Nanoseconds
40
t d(on) - Nanoseconds
VCE = 1250V
td(on)
RG = 1Ω, VGE = 15V
TJ = 150 C, VGE = 15V
100
30
IXYL40N250CV1
Fig. 21. Diode Forward Characteristics
Fig. 22. Reverse Recovery Charge vs. -diF/dt
200
10
o
TJ = 150 C
9
VR = 1200V
160
IF = 80A
8
o
TJ = 25 C
7
QRR (μC)
I F (A)
120
o
TJ = 150 C
80
40A
6
5
20A
4
40
3
0
2
0
1
2
3
4
5
6
7
8
9
300
400
500
600
700
800
900
1000
1100
1200 1300
1400
-diF/ dt (A/μs)
VF (V)
Fig. 23. Reverse Recovery Current vs. -diF/dt
Fig. 24. Reverse Recovery Time vs. -diF/dt
320
80
IF = 80A
o
TJ = 150 C
o
TJ = 150 C
VR = 1200V
70
280
VR = 1200V
IF = 80A
40A
240
tRR (ns)
I RR (A)
60
20A
40A
50
200
20A
40
160
30
120
300
400
500
600
700
800
900
1000
1100 1200
1300 1400
300
400
500
diF/dt (A/μs)
700
800
900
1000
1100 1200
1300 1400
-diF/dt (A/μs)
Fig. 25. Dynamic Parameters QRR, IRR vs.
Junction Temperature
1.1
600
1
Fig. 26. Maximum Transient Thermal Impedance
(Diode)
VR = 1200V
Z (th)JC - K / W
IF = 40A
-diF/dt = 600A/μs
1.0
KF
0.9
KF IRR
0.8
0.1
KF QRR
0.7
0.6
0
20
40
60
80
100
TJ (oC)
© 2017 IXYS CORPORATION, All Rights Reserved
120
140
160
0.01
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS REF: IXY_40N250CHV(9T-P628) 5-16-17
IXYL40N250CV1
ISOPLUS i5-PakTM (IXYL) Outline
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.