IXZR18N50 & IXZR18N50A/B
Z-MOS RF Power MOSFET
N-Channel Enhancement Mode Switch Mode RF MOSFET
Low Capacitance Z-MOSTM MOSFET Process
Optimized for RF Operation
Ideal for Class C, D, & E Applications
VDSS
=
500 V
ID25
=
19 A
Symbol
Test Conditions
RDS(on)
≤
0.37 Ω
VDSS
TJ = 25°C to 150°C
500
V
PDC
=
350 W
VDGR
TJ = 25°C to 150°C; RGS = 1 MΩ
500
V
VGS
Continuous
±20
V
VGSM
Transient
±30
V
ID25
Tc = 25°C
19
A
IDM
Tc = 25°C, pulse width limited by TJM
95
A
IAR
Tc = 25°C
19
A
EAR
Tc = 25°C
TBD
mJ
IS ≤ IDM, di/dt ≤ 100A/µs, VDD ≤ VDSS,
Tj ≤ 150°C, RG = 0.2Ω
5
V/ns
dv/dt
>200
V/ns
350
W
TBD
W
3.0
W
RthJC
TBD
C/W
RthJHS
TBD
C/W
Maximum Ratings
PDC
PDHS
Tc = 25°C, Derate 4.4W/°C above 25°C
PDAMB
Tc = 25°C
S
D D
G
= G SS G
50 A = D
50 B =
50
IS = 0
Features
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C unless otherwise specified)
VDSS
VGS = 0 V, ID = 4 ma
VGS(th)
VDS = VGS, ID = 250µΑ
IGSS
VGS = ±20 VDC, VDS = 0
IDSS
VDS = 0.8VDSS
VGS=0
=125C
min.
V
4.6
TJ = 25C
TJ
VGS = 20 V, ID = 0.5ID25
Pulse test, t ≤ 300µS, duty cycle d ≤ 2%
gfs
VDS = 50 V, ID = 0.5ID25, pulse
test
V
±100
nA
50
1
µA
mA
0.37
Ω
6.7
S
+175
175
TJM
-55
Tstg
1.6mm(0.063 in) from case for 10
s
•
•
−
−
•
•
•
cycling capability
IXYS advanced Z-MOS process
Low gate charge and capacitances
easier to drive
faster switching
Low RDS(on)
Very low insertion inductance (2500V)
− excellent thermal transfer
− Increased temperature and power
°C
°C
+ 175
°C
300
°C
3.5
g
• Optimized for RF and high speed
• Easy to mount—no insulators needed
• High power density
IXZR18N50 & IXZR18N50A/B
Z-MOS RF Power MOSFET
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C unless otherwise specified)
min.
typ.
max.
1
RG
Ciss
Coss
2020
pF
172
pF
21
pF
33
pF
4
ns
4
ns
4
ns
5
ns
42
nC
14
nC
21
nC
VGS = 0 V, VDS = 0.8 VDSS(max),
f = 1 MHz
Crss
Cstray
Back Metal to any Pin
Td(on)
Ton
Td(off)
VGS = 15 V, VDS = 0.8 VDSS
ID = 0.5 IDM
RG = 1 Ω (External)
Toff
Qg(on)
Qgs
VGS = 10 V, VDS = 0.5 VDSS
ID = 0.5 ID25 IG = 3mA
Qgd
Source-Drain Diode
Symbol
Test Conditions
IS
VGS = 0 V
ISM
Repetitive; pulse width limited by TJM
VSD
IF = Is, VGS=0 V, Pulse test, t ≤ 300µs, duty cycle
≤2%
Ω
Characteristic Values
(TJ = 25°C unless otherwise specified)
min.
typ.
max.
200
Trr
19
Α
114
A
1.5
V
ns
CAUTION: Operation at or above the Maximum Ratings values may impact device reliability or cause permanent damage to the device.
Information in this document is believed to be accurate and reliable. IXYSRF reserves the right to make changes to information published in this document at any time and without notice.
IXYS RF reserves the right to change limits, test conditions and dimensions.
IXYS RF MOSFETS are covered by one or more of the following U.S. patents:
4,835,592
4,860,072
4,881,106
4,891,686
4,931,844
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,640,045
6,404,065
6,583,505
6,710,463
6,731,002
5,017,508
5,486,715
6,727,585
IXZR18N50 & IXZR18N50A/B
Z-MOS RF Power MOSFET
Fig. 2
Gate Charge vs. Gate-to-Source Voltage
V DS = 250V, ID = 9.5A, IG = 3m A
Typical Output Characteristics
16
30
14
25
8V - 15V
ID , Drain Currnet (A)
Gate-to-Source Voltage (V)
Fig. 1
12
10
8
6
4
7.5V
20
15
7V
10
6.5V
5
2
6V
0
0
0
20
40
60
0
80
20
Gate Charge (nC)
40
60
80
100
120
VDS, Drain-to-Source Voltage (V)
Fig. 3
Fig. 4
Typical Transfer Characteristics
V DS = 50V
Extended Typical Output Characteristics
60
Top
80
ID , Drain Currnet (A)
ID , Drain Current (A)
50
40
30
20
10
60
Bottom
40
20
0
0
5
6
7
8
9
10
11
12
13
14
0
15
Fig. 5
VDS vs. Capacitance
10000
Ciss
1000
Coss
100
Crss
10
1
0
50
100
150
200
250
VDS Voltage (V)
20
40
60
80
100
VDS, Drain-to-Source Voltage (V)
VGS, Gate-to Source Voltage (V)
Capacitance (pF)
12V - 15V
10V
9V
8.5V
8V
7.5V
7V
6.5V
6V
300
350
400
120
IXZR18N50 & IXZR18N50A/B
Z-MOS RF Power MOSFET
Fig. 6 Package Drawing
1
2
3
50: 1=G, 2=D, 3=S
50A: 1=G, 2=S, 3= D
50B: 1=D, 2=S, 3=G
Doc #dsIXZR18N50_A/B REV 08/09
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An
IXYS Company
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