LAA100

LAA100 350V, 120mA Dual Single-Pole Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 25 Units VP mArms / mADC  Description The LAA100 is a 350V, 120mA, dual single-pole, normally open (1-Form-A) relay featuring low, 25, maximum on-resistance. Features • • • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Higher Reliability than Electromechanical Relays FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Version Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LAA100 LAA100P LAA100PTR LAA100S LAA100STR Description 8 Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-LAA100-R04 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA100 Absolute Maximum Ratings @25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance Input to Output 1 2 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V 10ms IL=120mA VL=350V IL ILPK RON ILEAK - - 120 ±350 25 1 mArms / mADC mAP  IF=0mA, VL = 50V, f=1MHz ton toff COUT - 35 5 5 - ms ms pF IL = 120mA IF = 5mA VR = 5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF IF = 5mA, VL = 10V µA If both poles operate, the load current must be derated so that the package power dissipation value is not exceeded. Measurement taken within 1 second of on-time. www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LAA100 PERFORMANCE DATA* 30 25 Device Count (N) 20 15 10 5 15 10 5 0 0 1.364 1.2 Device Count (N) 15 10 5 0 1.3 1.4 1.5 1.6 Turn-On Time (ms) 1.7 0.65 0.70 0.75 0.80 LED Current (mA) 0.85 10 5 0.08 0.10 0.13 0.15 0.17 Turn-Off Time (ms) 0.19 Typical On-Resistance Distribution (N=50, TA=25ºC, IL=120mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0.90 0.55 35 15 0.06 0 0.60 20 1.8 Typical IF for Switch Dropout (N=50, TA=25ºC, IL=120mADC) 25 20 Typical Turn-Off Time (N=50, TA=25ºC, IL=120mADC, IF=5mA) 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, TA=25ºC, IL=120mADC) 25 Device Count (N) 20 25 Device Count (N) Device Count (N) 25 Typical Turn-On Time (N=50, TA=25ºC, IL=120mADC, IF=5mA) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) 0.60 0.65 0.70 0.75 LED Current (mA) 0.80 0.85 13.85 14.00 14.15 14.30 14.45 14.60 14.75 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, TA=25ºC) Device Count (N) 30 25 20 15 10 5 0 390 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 420 2.5 2.0 1.5 1.0 0.5 -50 -25 0 25 50 Temperature (ºC) 75 100 0.25 0.20 0.15 0.10 0.05 0 0 1.0 Typical Turn-Off Time vs. LED Forward Current (TA=25ºC, IL=120mADC) 0.30 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 3.0 1.7 400 405 410 415 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (TA=25ºC, IL=120mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 395 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA100 PERFORMANCE DATA* 5.0 3.0 2.0 1.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 120 -20 0 20 40 60 80 10 100 120 -40 -20 0 20 40 60 80 100 120 Typical Turn-Off Time vs. Temperature (IL=70mADC) Typical On-Resistance vs. Temperature (IL=120mADC, Both Poles Operating) Turn-Off Time (ms) -20 0 20 40 60 80 100 120 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -40 30 0 20 40 60 80 100 Typical Load Current vs. Load Voltage (TA=25oC, IF=5mA) 150 IF=10mA IF=10mA IF=5mA IF=5mA Two Poles Operating 60 40 100 50 0 -50 -100 20 0 0 20 40 60 80 Temperature (ºC) 0.016 100 120 -3 -2 -1 0 Typical Leakage vs. Temperature Measured across Pins 5&6, 7&8 (VL=350V) Load Current (A) Leakage (PA) 0 0.010 0.008 0.006 0.004 0.002 0 20 40 60 80 Temperature (ºC) 100 120 Typical Blocking Voltage vs. Temperature 450 440 430 420 410 400 390 1 2 -40 3 -20 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 0.012 -20 -20 Load Voltage (V) 0.014 0 -40 10 380 -150 -20 15 -40 Blocking Voltage (VP) Load Current (mA) One Pole Operating 20 120 Maximum Continuous DC Load Current vs. Temperature 160 IF=10mA 0 -20 Temperature (ºC) 180 IF=5mA 25 5 Temperature (ºC) -40 Pulsed IL=100mA 0 -40 0 80 IF=10mA 15 Typical IF for Switch Dropout vs. Temperature (IL=70mADC) 1.0 100 IF=5mA Temperature (ºC) 2.0 120 20 Temperature (ºC) 3.0 140 IF=10mA Continuous Load IL=Max Rated Temperature (ºC) 4.0 -40 25 5 On-Resistance (:) 5.0 LED Current (mA) IF=10mA 2.0 0 -40 Typical On-Resistance vs. Temperature (IL=120mADC, One Pole Operating) IF=5mA IF=5mA 2.5 On-Resistance (:) 4.0 0 Load Current (mA) 30 3.0 Turn-On Time (ms) LED Current (mA) Typical Turn-On Time vs. Temperature (IL=70mADC) Typical IF for Switch Operation vs. Temperature (IL=70mADC) 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LAA100 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LAA100S / LAA100P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LAA100S LAA100P 250ºC 260ºC 30 Seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Dwell Time Wave Cycles LAA100 260ºC 250ºC 10 seconds* 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA100 MECHANICAL DIMENSIONS LAA100 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA100S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA100P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION LAA100 LAA100STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LAA100PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LAA100-R04 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/29/2021