LAA108STR

LAA108 100V, 300mA Dual Single-Pole Current Limiting, Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 100 300 8 Units VP mArms / mADC  Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • Higher Reliability than Electromechanical Relays • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 8-Pin Package • Machine Insertable, Wave Solderable • Surface Mount Tape & Reel Versions Available Description IXYS Integrated Circuits Division's LAA108 is a 100V, 300mA, 8 dual single-pole, normally open (1-Form-A) Solid State Relay that has two independently controlled, optically coupled outputs. The output MOSFET switches and photovoltaic die employ optically coupled MOSFET technology to provide 3750 Vrms of input-to-output isolation. The relay outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. This dual single-pole OptoMOS relay provides a more compact design solution than two discrete single-pole relays in a variety of applications, saving board space by incorporating both switches in a single 8-Pin package. Approvals Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LAA108 LAA108S LAA108STR LAA108P LAA108PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-LAA108-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA108 Absolute Maximum Ratings @ 25°C Parameter Ratings Blocking Voltage 100 Reverse Input Voltage 5 Input Control Current 50 Peak (10ms) 1 1 Input Power Dissipation 150 800 Total Power Dissipation 2 Isolation Voltage, Input to Output 3750 Operational Temperature, Ambient -40 to +85 Storage Temperature -40 to +125 1 2 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 100 - - V t =10ms IL=300mA VL=100VP IL ILPK RON ILEAK - 4.5 - 300 ±400 8 1 mArms / mADC mAP  IF=0mA, VL=50V, f=1MHz ton toff COUT - 0.43 0.17 110 3 3 - IL=300mA IF=5mA VR=5V IF VF IR 0.2 0.9 - 0.5 0.3 1.36 - 2 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate simultaneously, the load current must be derated so as not to exceed the package total power dissipation value. Measurement taken within one (1) second of on-time. For applications requiring high-temperature operation (T>60ºC), a LED drive current of 4mA is recommended. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LAA108 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Turn-On Time Distribution (IF=5mA, IL=200mA) 20 25 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 15 10 5 5 10 5 0 10 5 LED Forward Voltage Drop (V) 0.42 0.46 0.50 0.54 Turn-Off Time (ms) 0.58 20 15 10 5 0 0.70 4.46 4.48 4.50 4.52 4.54 4.56 On-Resistance (:) 139 4.58 Turn-On Time vs. LED Forward Current (IL=80mA) 0.5 1.8 0.38 Blocking Voltage Distribution 15 Typical LED Forward Voltage Drop vs. Temperature 140 141 142 143 Blocking Voltage (VP) 144 Turn-Off Time vs. LED Forward Current (IL=80mA) 0.450 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 0.4 Turn-Off Time (ms) Turn-On Time (ms) 1.7 0.3 0.2 0.1 0.445 0.440 0.435 0.430 1.1 0.425 0 1.0 -25 0 25 50 Temperature (ºC) 75 100 0 LED Current to Operate vs. Temperature (IL=100mA) 0.80 Turn-On Time (ms) 0.70 0.65 0.60 0.55 0.20 0.18 0.45 -40 0.14 -40 0 20 40 60 Temperature (ºC) 80 100 50 Turn-Off Time vs. Temperature (IF=5mA, IL=80mA) 0.60 0.22 0.16 10 20 30 40 LED Forward Current (mA) 0.65 0.24 0.50 0 50 Turn-On Time vs. Temperature (IF=5mA, IL=80mA) 0.26 0.75 -20 10 20 30 40 LED Forward Current (mA) Turn-Off Time (ms) -50 LED Current (mA) 5 25 0 0.45 0.50 0.55 0.60 0.65 LED Current to Operate (mA) 10 0.34 On-Resistance Distribution (IF=2mA, IL=200mA) 20 Device Count (N) 15 0.40 15 0.135 0.150 0.165 0.180 0.195 0.210 0.225 Turn-On Time (ms) LED Current to Operate Distribution (IL=100mA) 20 Device Count (N) 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Device Count (N) 1.364 20 0 0 0 Turn-Off Time Distribution (IF=5mA, IL=200mA) 0.55 0.50 0.45 0.40 0.35 0.30 -20 0 20 40 60 Temperature (ºC) 80 100 0.25 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA108 PERFORMANCE DATA* 0.6 5.5 5.0 4.5 4.0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.2 0.0 -0.2 -0.4 25 -0.2 -0.1 0.0 0.1 Load Voltage (V) 0.2 140 138 350 Single Pole Operating 300 250 200 * Neither pole to exceed single pole limits -40 Leakage Current vs. Temperature Measured Across Pins 5 & 6, 7 & 8 (VL=100V) -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s Energy Rating Curve (Single Pole, IF=5mA) 1.0 0.9 Load Curent (A) Leakage (nA) 142 400 0.3 20 144 Total Current - Both Poles Operating * 100 148 146 Maximum Load Current vs. Temperature (IF=5mA) 150 -0.6 -0.3 150 500 450 0.4 Blocking Voltage vs. Temperature Blocking Voltage (VP) Typical Load Current vs. Load Voltage (IF=2mA) Load Current (mA) 6.0 Load Current (mA) On-Resistance (:) 6.5 On-Resistance vs. Temperature (IF=2mA, IL=200mA) 15 10 5 0.8 0.7 0.6 0.5 0.4 0.3 136 134 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.2 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LAA108 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. c Device Moisture Sensitivity Level (MSL) Classification LAA108S / LAA108P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LAA108S LAA108P 250ºC 260ºC 30 Seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Total Dwell Time Wave Cycles LAA108 260ºC 250ºC 10 seconds 1 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA108 MECHANICAL DIMENSIONS LAA108 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA108S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA108P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LAA108 MECHANICAL DIMENSIONS LAA108STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LAA108PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LAA108-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 9/29/2021