LAA110

LAA110 350V, 120mA Dual Single-Pole Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC  Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Machine Insertable, Wave Solderable • Surface Mount Tape & Reel Packages Available Description LAA110 is a dual 1-Form-A Solid State Relay that has two independently controlled, optically coupled MOSFET switches. The output MOSFET switches and photovoltaic die employ optically coupled MOSFET technology to provide 3750 Vrms of input-to-output isolation. The relay outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. This dual pole OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-Pin package. Approvals Applications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LAA110 LAA110S LAA110STR LAA110P LAA110PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-LAA110-R12 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA110 Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V t=10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 25 - 120 ±350 35 1 mArms / mADC mAP  IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 3 3 - ms ms pF IL=120mA IF=5mA VR=5V IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V A If both poles operate the load current must be derated so as not to exceed the package power dissipation value. Measurement taken within 1 second of on-time. www.ixysic.com R12 INTEGRATED CIRCUITS DIVISION LAA110 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 20 15 10 5 1.364 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 0.56 Typical IF for Switch Operation (N=50, IL=120mADC) 25 Device Count (N) 15 10 5 0 0.65 0.74 0.83 0.92 1.01 Turn-On Time (ms) 0.65 0.91 1.17 1.43 1.69 LED Current (mA) 10 5 0.04 0.08 0.12 0.16 0.20 0.24 Turn-Off Time (ms) 0.28 Typical On-Resistance Distribution (N=50, IL=120mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0.39 15 1.1 Typical IF for Switch Dropout (N=50, IL=120mADC) 25 20 20 0 0 0 Device Count (N) 25 Device Count (N) Device Count (N) 25 Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 0 1.95 0.39 0.65 0.91 1.17 1.43 LED Current (mA) 1.69 22.9 1.95 23.3 23.7 24.1 24.5 24.9 On-Resistance (:) 25.3 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 420 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 450 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=50mADC) 0.7 0.6 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 1.7 430 435 440 445 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=50mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 425 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R12 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA110 PERFORMANCE DATA* I F =5mA I F =10mA 50 40 I F =5mA I F =10mA Dual Pole 30 20 Single Pole 10 Turn-On TIme (ms) 0 -40 0 20 40 60 Temperature (ºC) 80 100 Typical On-Resistance vs. Temperature (IL=50mADC Instantaneous, IF=5mA) 3.0 50 40 30 20 0 20 40 60 80 100 0 -20 0 20 40 60 80 -40 3.0 Single Pole 120 100 80 IF=10mA IF=5mA IF=10mA IF=5mA Dual Pole 60 0 20 40 60 80 40 20 -20 0 20 40 60 80 100 120 50 0 -50 -3 -2 -1 0 1 Load Voltage (V) Temperature (ºC) 0.016 Typical Leakage vs. Temperature Measured Across Pins 5&6 or 7&8 (VL=350V) Load Current (A) Leakage (PA) 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 100 120 1.5 1.0 -20 0 20 40 60 Temperature (ºC) 80 100 80 100 Typical Blocking Voltage vs. Temperature 20 40 60 Temperature (ºC) 80 100 2 3 425 420 415 410 405 400 395 -40 -20 0 20 40 60 Temperature (ºC) Energy Rating Curve 0.014 0 -40 80 430 -150 -40 60 435 100 -100 0 40 2.0 0 -40 100 Typical Load Current vs. Load Voltage (IF=5mA) Load Current (mA) 140 -20 Maximum Load Current vs. Temperature 150 20 0.5 Temperature (ºC) 160 0 Typical IF for Switch Dropout vs. Temperature (IL=50mADC) Temperature (ºC) 180 -20 2.5 -40 100 IF=5mA Typical IF for Switch Operation vs. Temperature (IL=50mADC) 1.0 0.5 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Temperature (ºC) 1.5 0 Typical Turn-Off Time vs. Temperature (IL=50mADC) Temperature (ºC) 2.0 10 -40 Load Current (mA) -20 2.5 LED Current (mA) On-Resistance (:) 60 IF=5mA IF=10mA IF=20mA LED Current (mA) 70 -20 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 Blocking Voltage (VP) On-Resistance (:) 60 Typical Turn-On Time vs. Temperature (IL=50mADC) Turn-Off Time (ms) Typical On-Resistance vs. Temperature (IL=120mADC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R12 INTEGRATED CIRCUITS DIVISION LAA110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. c Device Moisture Sensitivity Level (MSL) Classification LAA110S / LAA110P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LAA110S LAA110P 250ºC 260ºC 30 Seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Total Dwell Time Wave Cycles LAA110 260ºC 250ºC 10 seconds 1 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R12 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA110 MECHANICAL DIMENSIONS LAA110 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA110S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA110P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R12 INTEGRATED CIRCUITS DIVISION LAA110 MECHANICAL DIMENSIONS LAA110STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LAA110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LAA110-R12 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 9/29/2021