LAA110L

LAA110L 350V, 120mA Dual Single-Pole Current Limiting, Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Load Voltage, AC/DC Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC  Features • • • • • • • • 3750Vrms Input/Output Isolation Current Limiting Device Low Drive Power Requirements Higher Reliability than Electromechanical Relays No EMI/RFI Generation Flammability Rating UL 94 V-0 Surface Mount and Tape & Reel Versions Available Small 8-Pin Package Applications • • • • • • • • • • Telecom Switching Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Description LAA110L is a dual normally open (1-Form-A) Solid State Relay that has two independently controlled, optically coupled MOSFET switches with an additional current limiting circuit. The MOSFET switches and photovoltaic die use optically coupled MOSFET technology to provide 3750Vrms of input/output isolation. The optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. This dual switch OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-Pin package. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LAA110L LAA110LS LAA110LSTR LAA110PL LAA110PLTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin SOIC (Flatpack) (50/Tube) 8-Pin SOIC (Flatpack) (1,000/Reel) Load - Switch #1 Load - Switch #1 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Load - Switch #2 Form-A IF 90% 10% ILOAD ton DS-LAA110L-R12 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA110L Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current, Continuous 1 Load Current Limiting On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VL=8V, IF=5mA IL=120mA VL=350VP VDRM IL ICL RON ILEAK 350 ±130 - ±170 30 - 120 ±210 35 1 VP mArms / mADC mA  IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 3 3 - ms ms pF IL=120mA IF=5mA VR=5V IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate, then the load current must be derated so that it does not exceed the package power dissipation value. 2 Measurement taken within one second of on-time. www.ixysic.com A R12 INTEGRATED CIRCUITS DIVISION LAA110L PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 25 20 15 10 5 20 15 10 5 1.364 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 0.15 20 15 10 5 0.35 0.45 0.55 0.65 Turn-On Time (ms) 0.45 0.75 1.05 1.35 1.65 LED Current (mA) 1.95 10 5 0.025 0.075 0.125 0.175 0.225 Turn-Off Time (ms) Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mADC) 35 30 15 10 5 25 20 15 10 5 0 0 15 0.75 Device Count (N) 20 Device Count (N) 25 0.25 Typical IF for Switch Dropout (N=50, IL=120mADC) Typical IF for Switch Operation (N=50, IL=120mADC) 25 20 0 0 0 Device Count (N) 25 Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 0 0.45 2.25 0.75 1.05 1.35 1.65 1.95 LED Current (mA) 2.25 17.0 17.4 17.8 18.2 18.6 19.0 On-Resistance (:) 19.4 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 376.3 382.8 389.3 395.8 402.3 408.8 415.3 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.35 0.30 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0.25 0.20 0.15 0.10 0.05 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R12 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA110L 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 IF=5mA IF=10mA IF=20mA -40 -20 0 20 40 60 Temperature (ºC) 80 60 -20 0 20 40 60 Temperature (ºC) 80 1.0 Typical IF for Switch Dropout vs. Temperature (IL=120mADC) -40 -20 0 20 40 60 Temperature (ºC) 80 1.5 1.0 -100 -150 -20 0 20 40 60 Temperature (ºC) 80 100 -3 14 IF=10mA IF=5mA 40 20 0 -40 -20 0 20 40 60 80 Temperature (ºC) 100 400 390 380 370 -1 0 1 Load Voltage (V) 2 3 12 10 8 6 4 360 350 -40 120 Leakage (nA) Blocking Voltage (VP) 16 60 -2 Typical Leakage vs. Temperature Measured across Pins 5&6, 7&8 410 80 100 0 420 100 80 -50 160 120 20 40 60 Temperature (ºC) 50 180 140 0 100 Typical Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature -20 150 2.0 0 -40 100 20 Typical Load Current vs. Load Voltage (IF=5mA) 0.5 0 30 -40 Load Current (mA) LED Current (mA) 1.5 40 100 2.5 2.0 50 0 3.0 0.5 Load Current (mA) Typical On-Resistance vs. Temperature (IF=5mA, IL=120mADC) 10 -40 2.5 LED Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 Typical IF for Switch Operation vs. Temperature (IL=120mADC) 3.0 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=120mADC) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=120mADC) Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA* 2 -20 0 20 40 60 Temperature (ºC) 80 100 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Current Limiting vs. Temperature (IF=5mA) 350 Current (mA) 300 250 200 150 100 50 0 -40 -20 0 20 40 60 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R12 INTEGRATED CIRCUITS DIVISION LAA110L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LAA110LS MSL 1 LAA110PL MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LAA110LS LAA110PL 250ºC 245C 30 Seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Total Dwell Time Wave Cycles LAA110L 260ºC 250ºC 10 seconds 1 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R12 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA110L MECHANICAL DIMENSIONS LAA110L 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA110LS PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 (0.130 ± 0.002) 0.635 ± 0.127 (0.025 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA110PL 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R12 INTEGRATED CIRCUITS DIVISION LAA110L MECHANICAL DIMENSIONS LAA110LSTR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LAA110PLTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LAA110L-R12 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/29/2021