LAA120PLTR

LAA120L 250V, 150mA Dual Single-Pole Current Limiting, Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Load Voltage, AC/DC Load Current On-Resistance (max) Ratings 250 150 25 Units VP mArms / mADC  Features • • • • • • • • Two Current Limiting Relays in One Package 3750Vrms Input/Output Isolation Low Drive Power Requirements Higher Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount and Tape & Reel Versions Available Applications • • • • • • • • • • Telecommunications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Description LAA120L is a dual normally open (1-Form-A) Solid State Relay that has two independently controlled, optically coupled MOSFET switches with an additional current limiting circuit. The MOSFET switches and photovoltaic die employ optically coupled MOSFET technology to provide 3750Vrms of input/output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. This dual switch OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications and saves board space by incorporating both switches in a single 8-Pin package. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LAA120L LAA120LS LAA120LSTR LAA120PL LAA120PLTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin SOIC (Flatpack) (50/Tube) 8-Pin SOIC (Flatpack) (1,000/Reel) Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-LAA120L-R08 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA120L Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Blocking Voltage Load Current, Continuous 1 On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Load Current Limiting Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Conditions Symbol Min Typ Max Units IL=1A IL=150mA VL=250VP VDRM IL RON ILEAK 250 - 12 - 150 25 1 VP mArms / mADC  IF=0mA, VL=50V, f=1MHz - ton toff COUT ICL 190 50 235 5 5 280 pF mA IL=Load Current IF=5mA VR=5V IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V Input to Output Capacitance 2 1 If both poles operate, then the load current must be derated so that it does not exceed the package power dissipation value. 2 Measurement taken within one second of on-time. www.ixysic.com A ms R08 INTEGRATED CIRCUITS DIVISION LAA120L PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Typical Turn-On Time (N=50, IF=5mA, IL=120mA) 25 20 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 15 10 5 5 0 1.364 0.75 Typical IF for Switch Operation (N=50, IL=120mA) 45 20 15 10 5 0 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) 0.80 0.85 0.90 0.95 1.00 Turn On Time (ms) 0.310 0.318 0.326 0.334 0.342 0.350 0.358 Turn Off Time (ms) 1.05 Typical Blocking Voltage Distribution (N=50) Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mA) 20 20 30 25 20 15 10 Device Count (N) 35 Device Count (N) Device Count (N) 40 15 10 5 15 10 5 5 0 0 0 0.17 0.18 0.19 0.20 0.21 LED Current (mA) 0.22 9.4 Typical LED Forward Voltage Drop vs. Temperature 396 10.0 IF=10mA IF=5mA IF=2mA 1.3 1.2 1.1 1.2 0.39 1.0 0.38 0.8 0.6 0.4 0.2 0.24 -25 0 25 50 Temperature (ºC) 75 100 10 20 30 LED Current (mA) 40 Turn-On Time (ms) 0.18 0.16 0.14 0 20 40 60 Temperature (ºC) 80 100 0.35 0.34 1.4 1.2 1.0 0.8 0.4 -40 -20 0 20 40 60 Temperature (ºC) 10 20 30 40 LED Forward Current (mA) 80 100 50 Typical Turn-Off Time vs. Temperature (IL=80mA, IF=5mA) 0.50 0.6 -20 0.36 0 1.6 0.20 420 0.37 50 Typical Turn-On Time vs. Temperature (IF=5mA, IL=80mA) 1.8 0.22 0.12 -40 0 Typical IF for Switch Operation (IL=80mA) 404 408 412 416 Blocking Voltage (VP) 0.33 0.0 1.0 400 Typical Turn-Off Time vs. LED Forward Current Turn-Off Time (ms) Turn-On Time (ms) 1.6 -50 LED Current (mA) 9.9 Turn-Off Time (ms) LED Forward Voltage Drop (V) 1.7 1.4 9.6 9.7 9.8 On Resistance (:) Typical Turn-On Time vs. LED Forward Current 1.8 1.5 9.5 0.45 0.40 0.35 0.30 0.25 0.20 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA120L PERFORMANCE DATA* 150 Load Current (mA) On Resistance (:) 14 12 10 8 50 0 -50 -100 4 -40 -150 -1.5 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Blocking Voltage vs. Temperature 0.025 440 Leakage Current (PA) Blocking Voltage (VP) 450 430 420 410 400 390 -40 -20 0 20 40 60 Temperature (ºC) 80 100 150 100 6 140 130 120 110 100 90 80 70 -1.0 -0.5 0.0 0.5 Load Voltage (V) 1.0 1.5 -40 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (VL=250V) 350 0.020 0.015 0.010 0.005 0.000 -40 Maximum Load Current vs. Temperature (IF=5mA) 160 Load Current (mA) 16 Typical Load Current vs. Load Voltage (IF=5mA) Load Current (mA) Typical On-Resistance vs. Temperature (IL=150mA, IF=5mA) -20 0 20 40 60 Temperature (ºC) 80 100 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Current Limiting vs. Temperature (IF=5mA, VL=8V) 300 250 200 150 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LAA120L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LAA120LS MSL 1 LAA120PL MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LAA120LS LAA120PL 250ºC 245ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LAA120L Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA120L MECHANICAL DIMENSIONS LAA120L 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA120LS PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA120PL 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LAA120L MECHANICAL DIMENSIONS LAA120LSTR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LAA120PLTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LAA120L-R08 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/30/2021