LAA125

LAA125 350V, 170mA Dual Single-Pole Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 170 16 Units VP mArms / mADC  Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements • Higher Reliability than Electromechanical Relays • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 8-Pin Packages • Flammability Rating UL 94 V-0 • Surface Mount and Tape & Reel Versions Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Description LAA125 is a 350V, 170mA, 16 dual normally open (1-Form-A) relay. It combines enhanced peak load current capability with low on-resistance. Its MOSFET switches and photovoltaic die provide 3750Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. This dual switch OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating two switches in a single 8-pin package. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LAA125 LAA125S LAA125STR LAA125P LAA125PTR Description 8 Pin DIP (50/Tube) 8 Pin Surface Mount (50/Tube) 8 Pin Surface Mount (1,000/Reel) 8 Pin Flat Pack (50/Tube) 8 Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-LAA125-R08 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA125 Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Blocking Voltage Load Current Continuous Peak Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V - IL - - 170 mArms / mADC t =10ms ILPK - - ±400 On-Resistance IL=170mA RON - - 16 mAP  Off-State Leakage Current VL=350VP ILEAK - - 1 A ton - - 5 toff - - 5 IF=0mA, VL=50V, f=1MHz COUT - 50 - pF IL=170mA IF - - 5 mA - - 0.4 0.7 - mA Input Voltage Drop IF=5mA VF 0.9 1.36 1.5 V Reverse Input Current VR=5V IR - - 10 A VIO=0V, f=1MHz CIO - 3 - pF Switching Speeds Turn-On Turn-Off Output Capacitance IF=5mA, VL=10V ms Input Characteristics Input Control Current for Activation Input Control Current for Deactivation Input to Output Capacitance 2 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LAA125 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 15 10 5 0 0 1.364 1.6 Device Count (N) 15 10 5 0 1.7 1.8 1.9 2.0 Turn-On Time (ms) 2.1 0.42 0.54 0.66 0.78 LED Current (mA) 10 5 0.2 0.3 0.4 0.5 0.6 Turn-Off Time (ms) 0.7 0.8 Typical On-Resistance Distribution (N=50, IL=170mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0.30 15 2.2 Typical IF for Switch Dropout (N=50, IL=170mADC) 25 20 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=170mADC) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=10mA, IL=120mADC) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=10mA, IL=120mADC) 0 0.90 0.18 0.30 0.35 0.40 0.45 LED Current (mA) 12.36 12.5 12.64 12.78 12.92 13.06 On-Resistance (:) 0.78 13.2 Typical Blocking Voltage Distribution (N=50) Device Count (N) 25 20 15 10 5 0 390 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.60 0.55 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 1.7 440 Typical Turn-On Time vs. LED Forward Current (IL=170mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 400 410 420 430 Blocking Voltage (VP) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 10 15 20 25 30 35 40 45 50 55 LED Forward Current (mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA125 PERFORMANCE DATA* 18 Dual Pole 16 14 Instantaneous 12 10 3.0 2.5 IF=5mA 2.0 1.5 IF=10mA 1.0 -20 0 20 40 60 80 Temperature (ºC) 100 120 -40 Typical IF for Switch Operation vs. Temperature (IL=170mA) 3.6 -20 0 20 40 60 Temperature (ºC) 80 0.4 0.3 IF=5mA 0.2 0.1 -40 100 Typical IF for Switch Dropout vs. Temperature (IL=170mADC) 150 2.8 1.4 2.4 2.0 1.6 1.2 0.8 Load Current (mA) 200 1.6 LED Current (mA) 1.7 3.2 0.4 1.2 1.0 0.8 0.6 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 150 IF=10mA IF=5mA 125 Dual Pole 100 IF=10mA IF=5mA 75 0 335 330 325 320 315 310 305 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 100 100 50 0 -50 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 Leakage (PA) Blocking Voltage (VP) 175 80 -200 -2.0 -1.5 -1.25 -0.625 0 0.625 1.25 1.875 3.0 Load Voltage (V) 100 340 Single Pole 20 40 60 Temperature (ºC) Typical Load Current vs. Load Voltage (IF=5mA) Typical Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature 200 0 -150 0.2 -40 -20 -100 0.4 0 Load Current (mA) 0.5 0 0 -40 Typical Turn-Off Time vs. Temperature (IL=120mADC) 0.6 0.5 0 LED Current (mA) Typical Turn-On Time vs. Temperature (IL=80mADC) Turn-Off Time (ms) IF=5mA IF=10mA IF=5mA IF=10mA IF=5mA Single Pole Turn-On Time (ms) On-Resistance (:) 20 Typical On-Resistance vs. Temperature (IL=170mADC) -40 -20 0 20 40 60 80 100 10s 100s Temperature (ºC) 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LAA125 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LAA125S / LAA125P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LAA125S LAA125P 250ºC 260ºC 30 Seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LAA125 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA125 MECHANICAL DIMENSIONS LAA125 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA125S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA125P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LAA125 MECHANICAL DIMENSIONS LAA125STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LAA125PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LAA125-R08 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/30/2021