LAA126

LAA126 Dual Single-Pole, Normally Open OptoMOS® Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 250 170 15 Units VP mArms / mADC  Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 8-Pin Packages • Machine Insertable, Wave Solderable • Surface Mount and Tape & Reel Versions Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Description LAA126 is a 250V, 170mA, 15, dual normally open (1-Form-A) Solid State Relay. The combination of super efficient MOSFET switches and photovoltaic die provides 3750Vrms of input to output isolation. The optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. This dual pole OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-pin package Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 Ordering Information Part # LAA126 LAA126S LAA126STR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton Pb DS-LAA126-R05 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LAA126 Absolute Maximum Ratings @25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms ºC ºC Derate linearly 1.33 mW / ºC Derate linearly 6.67 mW / ºC Electrical Characteristics @25ºC (Unless Otherwise Noted) Parameter Output Characteristics Load Current Continuous Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units t =10ms IL=170mA VL=250VP IL ILPK RON ILEAK - 10 - 170 ±400 15 1 mArms / mADC mAP  VL=50V, f=1MHz ton toff COUT - 50 5 5 - IL=170mA IF=5mA VR=5V - IF VF IR CI/O 0.4 0.9 - 0.7 1.2 3 5 1.4 10 - IF=5mA, VL=10V www.ixysic.com A ms pF mA mA V A pF R05 INTEGRATED CIRCUITS DIVISION LAA126 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Device Count (N) Device Count (N) 30 25 20 15 10 25 25 20 20 Device Count (N) 35 Typical Turn-On Time (N=50, IF=5mA, IL=170mADC) Typical LED Forward Voltage Drop (N=50, IF=5mA) 15 10 5 5 0 0 1.17 20 20 15 10 5 0 1.3 5 0.05 Typical IF for Switch Dropout (N=50, IL=170mADC) 0.25 0.35 0.45 0.55 Turn-Off Time (ms) 0.65 30 15 10 5 1.5 0.15 Typical On-Resistance Distribution (N=50, IF=5mA, IL=170mADC) 35 25 20 15 10 5 0 0.7 0.9 1.1 LED Current (mA) 10 0 Device Count (N) 25 Device Count (N) Device Count (N) 25 0.5 15 0.625 0.875 1.125 1.375 1.625 1.875 2.125 Turn-On Time (ms) 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=170mADC) 0.3 Typical Turn-Off Time (N=50, IF=5mA, IL=170mADC) 0 0.15 0.45 0.75 1.05 1.35 1.65 LED Forward Current (mA) 6.5 1.95 7.5 8.5 9.5 On-Resistance (:) 10.5 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 305 1.4 365 0.40 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 Turn-Off Time (ms) 1.6 1.0 0.8 0.6 0.4 -20 0 20 40 60 80 Temperature (ºC) 100 120 0.38 0.37 0.36 0.34 0 -40 0.39 0.35 0.2 0.8 Typical Turn-Off Time vs. LED Forward Current (IL=170mADC) 0.41 1.2 Turn-On Time (ms) LED Forward Voltage Drop (V) 325 335 345 355 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=170mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 315 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA126 Typical Turn-On Time vs. Temperature (IL=170mADC) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=170mADC) 0.7 Typical On-Resistance vs. Temperature (IF=5mA, IL=170mADC) 60 IF=5mA IF=10mA IF=20mA On-Resistance (:) 0.6 Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 0.5 0.4 0.3 0.2 -20 0 20 40 60 Temperature (ºC) 80 Typical IF for Switch Operation vs. Temperature (IL=170mADC) 2.5 30 20 0 -40 100 40 10 0.1 0 -40 50 -20 0 20 40 60 Temperature (ºC) 80 100 -40 Typical IF for Switch Dropout vs. Temperature (IL=170mADC) 2.5 200 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Load Current vs. Load Voltage (IF=5mA) 1.5 1.0 0.5 2.0 Load Current (mA) LED Current (mA) LED Current (mA) 150 2.0 1.5 1.0 0.5 100 50 0 -50 -100 -150 0 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 0 20 40 60 Temperature (ºC) 80 -200 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 Load Voltage (V) 100 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 Typical Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature 250 0.025 350 150 IF=20mA IF=10mA IF=5mA 100 50 0 345 0.020 340 Leakage (PA) 200 Blocking Voltage (VP) Load Current (mA) -20 335 330 325 -20 0 20 40 60 80 Temperature (ºC) 100 120 0.010 0.005 320 315 -40 0.015 -40 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LAA126 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LAA126 / LAA126S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LAA126 / LAA126S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R05 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA126 MECHANICAL DIMENSIONS LAA126S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA126STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment 6 W=16.00 (0.63) Bo=10.30 (0.406) P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LAA126 MECHANICAL DIMENSIONS LAA126 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 4.064 TYP (0.160) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LAA126-R05 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/2012