LAA710

LAA710 60V, 1A Dual Single-Pole Normally Open Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 60 1 0.5 Units VP Arms / ADC  Features • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Version Available Applications • • • • • • • • • • Telecommunications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Description LAA710 is a dual normally open (1-Form-A) Solid State Relay that comprises two independently controlled, optically coupled MOSFET switches. The combination of super efficient MOSFET switches and photovoltaic die provides 3750Vrms of input to output isolation. The optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Dual OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-pin package. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LAA710 LAA710S Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) LAA710STR 8-Pin Surface Mount (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-LAA710-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA710 Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 60 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 60 - - V t =10ms IL=1A VL=60VP IL ILPK RON ILEAK - - 1 ±5 0.5 1 Arms / ADC AP  IF=0mA, VL=50V, f=1MHz ton toff COUT - 220 2.5 0.25 - IL=150mA IF=10mA VR=5V IF VF IR 0.4 0.9 - 0.7 1.42 - 10 1.56 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=10mA, VL=10V A ms pF If both poles operate, the load current must be derated so as not to exceed the package power dissipation value. Measurement taken within one (1) second of on-time. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LAA710 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=10mA) 25 Device Count (N) 20 15 10 5 1.416 15 10 5 0.5 Device Count (N) 15 10 5 0 0.7 0.9 1.1 1.3 Turn-On Time (ms) 1.75 2.25 2.75 3.25 LED Current (mA) 10 5 0.03 0.05 0.07 0.09 0.11 Turn-Off Time (ms) 0.13 Typical On-Resistance Distribution (N=50, IF=10mA, IL=1ADC) 35 30 20 15 10 5 25 20 15 10 5 0 1.25 15 1.5 Typical IF for Switch Dropout (N=50, IL=1ADC) 25 20 20 0 1.418 1.420 1.422 1.424 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=1ADC) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=10mA, IL=1ADC) 25 Device Count (N) Device Count (N) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=10mA, IL=1ADC) 0 3.75 1.25 1.75 2.25 2.75 3.25 LED Current (mA) 3.75 0.215 0.225 0.235 0.245 0.255 On-Resistance (:) 0.265 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 72 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=1ADC) 0.09 0.08 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 1.7 82 Typical Turn-On Time vs.LED Forward Current (IL=1ADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 74 76 78 80 Blocking Voltage (VP) 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 0 5 10 15 20 25 30 35 40 Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA710 PERFORMANCE DATA* Typical Turn-On Time vs. Temperature (IL=1ADC) 1.4 0.14 0.8 0.6 IF=20mA 0.4 0.10 0.08 0.06 0.04 0.02 0 -40 0 -20 0 20 40 60 Temperature (ºC) 80 100 LED Current (mA) -40 -20 0 0.30 0.25 0.20 0.15 0.10 0.05 0 -20 0 20 40 60 80 -40 100 20 40 60 Temperature (ºC) 80 Typical IF for Switch Dropout vs. Temperature (IL=1ADC) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 100 -40 Maximum Load Current vs. Temperature 1000 800 600 400 200 0 -200 -400 -600 -800 -1000 -0.3 -20 0 20 40 60 Temperature (ºC) 80 100 0.006 79 0.005 1200 1000 IF=20mA IF=10mA IF=5mA 400 -40 -20 0 20 40 60 80 100 Leakage (PA) 0.007 80 Blocking Voltage (VP) 81 1400 78 77 76 75 73 -40 Temperature (ºC) 80 100 -0.2 0 -0.1 0.1 Load Voltage (V) 0.2 0.3 0.004 0.003 0.002 0.001 74 120 20 40 60 Temperature (ºC) Typical Leakage vs. Temperature Measured across Pins 5 & 6, 7 & 8 Typical Blocking Voltage vs. Temperature 1600 600 0 Typical Load Current vs. Load Voltage (IF=10mA) 1800 800 -20 Temperature (ºC) Typical IF for Switch Operation vs. Temperature (IL=1ADC) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.35 Load Current (mA) -40 Typical On-Resistance vs. Temperature (IF=10mA, IL=1ADC) 0.40 On-Resistance (:) 1.0 Turn-Off Time (ms) Turn-On Time (ms) IF=10mA 0.2 LED Current (mA) 0.45 0.12 1.2 Load Current (mA) Typical Turn-Off Time vs. Temperature (IF=10mA, IL=1ADC) -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 8 Load Current (A) 7 6 5 4 3 2 1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LAA710 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LAA710S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LAA710S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LAA710 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA710 MECHANICAL DIMENSIONS LAA710S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 2.54 (0.10) 9.525 ± 0.254 (0.375 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.457 ± 0.076 (0.018 ± 0.003) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA710STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment 6 16.0±0.3 (0.63±0.012) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LAA710 MECHANICAL DIMENSIONS LAA710 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 4.064 TYP (0.160) 3.302 ± 0.051 (0.130 ± 0.002) 7.239 TYP. (0.285) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LAA710-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/25/2021