LBA110PLTR

LBA110L 350V, 120mA Dual Single-Pole Relays: INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 ±120 35 1-Form-A (NO) Current Limiting & 1-Form-B (NC) Units VP mArms / mADC  Features • • • • • • • • 3750Vrms Input/Output Isolation Normally Open Relay is a Current-Limiting Device Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Versions Available The normally open (1-Form-A) relay is configured as a current-limiting device. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Applications • • • • • • • • • • Description LBA110L is a combination device comprising one normally open (1-Form-A) and one normally closed (1-Form-B) solid state relays. Both relays are independent, 350V, 120mA, 35 devices designed to provide an ideal solution where a complementary relay pair (1-Form-A / 1-Form-B) is required. Telecommunications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Part # LBA110L LBA110PL Description 8-Pin DIP (50/Tube) 8-Pin SOIC (Flatpack) (50/Tube) LBA110PLTR 8-Pin SOIC (Flatpack) (1000/Reel) LBA110LS 8-Pin Surface Mount (50/Tube) LBA110LSTR 8-Pin Surface Mount (1,000/Reel) Pin Configuration + Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open 1 8 2 7 3 6 4 5 Switching Characteristics of Normally Open (Form A) Devices Form-B IF IF ILOAD 90% 10% ton DS-LBA110L-R09 www.ixysic.com Normally Open Pole Switching Characteristics of Normally Closed (Form B) Devices Form-A ILOAD Normally Closed Pole toff 10% toff 90% ton 1 INTEGRATED CIRCUITS DIVISION LBA110L Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Blocking Voltage Load Current, AC/DC Continuous 1 Peak (1-Form-B) Load Current Limiting (1-Form-A) On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - VP t =10ms IL=120mA VL=350VP IL ILPK ICL RON ILEAK ±130 - ±170 23 - ±120 ±350 ±210 35 1 mArms / mADC mAP mA  VL=50V, f=1MHz ton toff COUT - 25 3 3 - IL=120mA IF=5mA VR=5V IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value. Measurement taken within one (1) second of on-time. www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LBA110L Form-A/Form-B PERFORMANCE DATA* 20 15 10 5 0 1.364 1.8 0.030 1.7 0.025 1.6 Leakage (PA) Device Count (N) 25 Typical Leakage vs. Temperature Measured Across Pins 5&6 or 7&8 Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage Drop (V) 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 0.020 0.015 0.010 1.2 0.005 1.1 1.0 -50 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) -25 0 25 50 Temperature (ºC) 75 0 -40 100 -20 0 20 40 60 80 100 Temperature (ºC) Form-A RELAY PERFORMANCE DATA* Form-A Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 25 15 10 5 0 15 10 5 0.65 20 25 15 10 5 0.08 0.13 0.18 Turn-Off Time (ms) 0.5 0.7 0.9 1.1 1.3 LED Current (mA) 1.5 15 10 0.23 15.8 16.1 16.4 16.7 17.0 17.3 On-Resistance (:) 17.6 Form-A Typical Blocking Voltage Distribution (N=50) Form-A Typical IF for Switch Dropout (N=50, IL=120mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0 20 0 0.03 Form-A Typical IF for Switch Operation (N=50, IL=120mADC) 25 5 Device Count (N) 0.35 0.45 0.55 Turn-On Time (ms) Device Count (N) Device Count (N) 0.25 Form-A Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mADC) 30 20 0 0.15 25 35 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 0 0.15 0.45 0.75 1.05 1.35 LED Current (mA) 1.65 1.95 376.8 378.3 379.8 381.3 382.8 384.3 385.8 Blocking Voltage (VP) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA110L Form-A PERFORMANCE DATA* FormA Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 0.092 20 0.25 0.20 0.15 0.088 On-Resistance (:) 0.30 0.086 0.084 0.082 0.080 0.078 10 15 20 25 30 35 40 LED Forward Current (mA) 45 0 50 Form-A Typical Turn-On Time vs. Temperature (IL=120mADC) 0.50 0.45 0.40 Turn-Off TIme (ms) IF=5mA IF=10mA 0.35 0.30 0.25 IF=20mA 0.20 0.15 -40 -20 0 20 40 60 Temperature (ºC) 80 10 15 20 25 30 35 40 LED Forward Current (mA) 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 12 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Form A Maximum Load Current vs. Temperature 180 160 140 120 100 IF=20mA IF=10mA IF=5mA 80 60 40 20 0 -40 100 14 50 45 Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=120mADC) -20 0 20 40 60 Temperature (ºC) 80 -40 100 Form-A Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Form-A Typical IF for Switch Operation vs. Temperature (IL=120mADC) 2.5 5 Load Current (mA) 5 16 8 0.074 0 18 10 0.076 0.10 Turn-On Time (ms) Form-A Typical On-Resistance vs. Temperature (IF=5mA, IL=120mADC) 0.090 0.35 Turn-Off Time (ms) Turn-On Time (ms) 0.40 Form-A Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) -20 0 20 40 60 80 Temperature (ºC) 100 120 80 100 Form-A Typical Blocking Voltage vs. Temperature 400 2.5 1.5 1.0 0.5 Blocking Voltage (VP) LED Current (mA) LED Current (mA) 395 2.0 2.0 1.5 1.0 0.5 390 385 380 375 370 365 360 0 355 0 -20 0 20 40 60 Temperature (ºC) Load Current (mA) 150 80 100 -40 -20 0 20 40 60 Temperature (ºC) 100 50 0 -50 -100 -150 -2.0 80 100 -40 -20 0 20 40 60 Temperature (ºC) Form-A Typical Current Limiting Characteristics vs. Temperature (IF=5mA) Form-A Typical Load Current vs. Load Voltage (IF=5mA) 250 Current Limit (mA) -40 200 150 100 50 0 -1.5 -1.0 -0.5 0 0.5 1.0 Load Voltage (V) 1.5 2.0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LBA110L Form-B PERFORMANCE DATA* Form-B Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 30 30 30 15 10 20 15 10 5 5 0 0 0.14 0.18 0.22 0.26 Turn-On Time (ms) 30 0.25 Device Count (N) 20 15 10 5 0.35 0.45 0.55 0.65 Turn-Off Time (ms) 27.8 0.7 1.1 1.3 1.5 LED Current (mA) 15 10 5 0.55 0.65 0.75 LED Current (mA) 0.85 386.3 388.8 391.3 393.8 396.3 398.8 401.3 Blocking Voltage (VP) Form-B Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=120mADC) 60 0.5 0.4 0.3 0.2 10 15 20 25 30 35 40 LED Forward Current (mA) 45 0 50 FormB Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) 0.35 Turn-Off Time (ms) Turn-On Time (ms) 0.25 0.20 0.15 0.10 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 180 160 IF=10mA 0.3 IF=20mA 0.1 20 Form-B Maximum Load Current vs. Temperature (IF=0mA) IF=5mA 0.4 0 30 50 0.5 0.2 0 45 Form-B Typical Turn-Off Time vs. Temperature (IL=120mADC) 0.6 0.05 -20 10 15 20 25 30 35 40 LED Forward Current (mA) 0.7 0.30 -40 5 Load Current (mA) 5 40 0 0 0 50 10 0.1 0.05 10 0.95 On-Resistance (:) Turn-Off Time (ms) Turn-On Time (ms) 0.10 15 0 0.45 0.6 0.15 20 5 0.7 0.20 32.0 25 0.35 0.25 29.2 29.9 30.6 31.3 On-Resistance (:) 30 20 1.9 Form-B Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 28.5 Form-B Typical Blocking Voltage Distribution (N=50) 0 0 10 0.75 Form-B Typical IF for Switch Dropout (N=50, IL=120mADC) 25 25 15 0 0.30 Form-B Typical IF for Switch Operation (N=50, IL=120mADC) 20 5 Device Count (N) 0.10 Device Count (N) 20 Form-B Typical On-Resistance Distribution (N=50, IF=0mA, IL=120mADC) 25 25 Device Count (N) Device Count (N) 25 Device Count (N) Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA110L Form-B PERFORMANCE DATA* Form-B Typical IF for Switch Operation vs. Temperature (IL=120mADC) 3.0 3.0 LED Current (mA) 2.0 1.5 1.0 Blocking Voltage (VP) 2.5 2.5 LED Current (mA) Form-B Typical IF for Switch Dropout vs. Temperature (IL=120mADC) 2.0 1.5 1.0 0.5 0.5 0 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) Form-B Typical Load Current vs. Load Voltage (IF=0mA) Load Current (A) Load Current (mA) 100 0 -50 -100 -150 -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Form-B Energy Rating Curve 150 50 80 410 405 400 395 390 385 380 375 370 365 360 Form-B Typical Blocking Voltage vs. Temperature (IF=5mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 6 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LBA110L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBA110LS MSL 1 LBA110PL MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LBA110LS LBA110PL 250ºC 245ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LBA110L Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R09 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA110L MECHANICAL DIMENSIONS LBA110L 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA110LS PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA110PL 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 8 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LBA110L MECHANICAL DIMENSIONS LBA110LSTR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LBA110PLTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 9 Specification: DS-LBA110L-R09 ©Copyright 2021, Littelfuse, inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/25/2021