LBA110STR

LBA110 350V, 120mA Dual Single-Pole Relays: 1-Form-A (NO) & 1-Form-B (NC) INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC  LBA110 is designed to provide an ideal solution where a complementary Form-A/Form-B relay pair is required. Features • • • • • • • Description LBA110 comprises two independent 350V, 120mA, 35 solid state relays: one single-pole, normally open (1-Form-A) relay and one single-pole, normally closed (1-Form-B) relay. 3750Vrms Input/Output Isolation 100% Solid State Low Drive Power Requirements FCC Compatible VDE Compatible No EMI/RFI Generation Flammability Rating UL 94 V-0 Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Ordering Information Part # LBA110 LBA110S LBA110STR LBA110P LBA110PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open 1 8 2 7 3 6 4 5 Switching Characteristics of Normally Open Devices Switching Characteristics of Normally Closed Devices IF IF ILOAD 90% 10% ILOAD ton www.ixysic.com Normally Open Pole Form-B Form-A DS-LBA110-R11 Normally Closed Pole toff 10% toff 90% ton 1 INTEGRATED CIRCUITS DIVISION LBA110 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - VP t = 10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 25 - 120 ±350 35 1 mArms / mADC mAP  VL=50V, f=1MHz ton toff COUT - 25 3 3 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 2 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate the load current must be derated so as not to exceed the package power dissipation value. www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION LBA110 Form-A/Form-B PERFORMANCE DATA* 25 Device Count (N) Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage Drop (V) 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) 20 15 10 5 0 1.364 1.8 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) -25 0 25 50 Temperature (ºC) 75 100 Form-A PERFORMANCE DATA* 15 10 5 0 15 10 5 1.65 15 10 5 0.20 0.28 0.36 0.44 0.52 1.43 LED Current (mA) 1.69 10 0.60 19.5 25 Form-A Typical IF for Switch Dropout (N=50, IL=120mADC) 20.5 1.95 21.5 22.5 23.5 24.5 On-Resistance (:) 25.5 Form-A Typical Blocking Voltage Distribution (N=50) 35 30 20 15 10 5 25 20 15 10 5 0 0 1.17 15 Turn-Off Time (ms) 20 0.91 20 0 0.12 Form-A Typical IF for Switch Operation (N=50, IL=120mADC) 0.65 25 5 Device Count (N) 0.75 1.05 1.35 Turn-On Time (ms) Device Count (N) Device Count (N) 30 20 0 0.45 25 35 Device Count (N) 20 Form-A Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mADC) Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 25 Device Count (N) Device Count (N) 25 Form-A Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 0 0.39 0.65 0.91 1.17 1.43 LED Current (mA) 1.69 1.95 400 420 440 460 480 500 Blocking Voltage (VP) 520 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R11 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA110 Form-A PERFORMANCE DATA* Form-A Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 0.220 5 10 15 20 25 30 35 40 45 LED Current (mA) 0.205 0.200 0.195 0.190 0.185 1.5 1.0 0.5 5 10 15 20 25 30 35 40 50 45 -40 0 20 40 60 LED Forward Current (mA) Temperature (ºC) Form-A Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Form-A Typical Turn-On Time vs. Temperature (IL=120mADC) Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=120mADC) 1.4 0.5 IF=5mA 1.0 Turn-Off Time (ms) Turn-On Time (ms) 1.0 0.40 IF=10mA 0.8 0.6 IF=20mA 0.4 0.2 -20 0 20 40 60 80 100 -20 0 Temperature (ºC) 150 40 30 20 20 40 60 Temperature (ºC) 80 0.15 0.10 0 100 Form-A Typical Load Current vs. Load Voltage (IF=5mA) -40 -20 0 20 40 60 Temperature (ºC) Form-A Maximum Load Current vs. Temperature 180 160 100 50 0 -50 -100 10 100 0.20 Load Current (mA) Load Current (mA) 50 80 0.25 0.05 -40 Form-A Typical On-Resistance vs. Temperature (IF=5mA, IL=120mADC) 100 0.30 0 0 80 0.35 1.2 -40 -20 LED Forward Current (mA) 1.5 140 120 100 IF=20mA IF=10mA IF=5mA 80 60 40 20 -150 0 -40 -20 0 20 40 60 80 100 0 -4 -3 -2 -1 0 1 2 3 Temperature (ºC) Load Voltage (V) Form-A Typical Blocking Voltage vs. Temperature Form-A Typical Leakage vs. Temperature Measured Across Pins 5&6 480 -40 4 0.014 Leakage (µA) 460 450 440 0.012 0.010 0.008 0.006 0.004 430 0.002 420 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 -20 0 20 40 0 20 40 60 80 100 120 Energy Rating Curve 0.016 470 -20 Temperature (ºC) Load Current (A) On-Resistance (:) 2.0 0 0 50 2.0 LED Current (mA) 0.210 0 2.5 Blocking Voltage (VP) 2.5 0.180 0 60 Form-A Typical IF for Switch Operation vs. Temperature (IL=120mADC) 0.215 Turn-Off Time (ms) Turn-On Time (ms) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Form-A Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 60 80 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms Temperature (ºC) 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION LBA110 Form-B PERFORMANCE DATA* Form-B Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 25 Device Count (N) Device Count (N) 20 15 10 5 20 15 10 5 0 0 0.25 0.35 0.45 0.55 0.65 Form-B Typical IF for Switch Operation (N=50, IL=120mADC) 0.40 Device Count (N) 10 5 0.7 0.9 0.42 1.1 1.3 1.5 1.7 10 5 1.1 1.3 1.5 1.7 Form-B Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.7 0.3 0.2 0.1 0 0 3.0 5 10 15 20 25 30 35 40 45 50 385 395 405 415 Blocking Voltage (VP) 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 45 -40 50 -20 0 20 40 60 LED Forward Current (mA) Temperature (ºC) Form-B Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) Form-B Typical Turn-Off Time vs. Temperature (IL=120mADC) 0.7 1.2 Turn-On Time (ms) 1.5 1.0 0.5 0.5 0.4 0.3 0.2 0.1 0 0 -20 0 20 40 60 Temperature (ºC) 80 100 80 100 IF=5mA 0.6 2.0 425 Form-B Typical IF for Switch Operation vs. Temperature (IL=120mADC) LED Forward Current (mA) 2.5 -40 375 2.5 0.4 0.34 10 3.0 0.5 0.35 15 365 LED Current (mA) 0.36 20 1.9 0.6 0.37 31.5 0 0.9 Form-B Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 0.38 27.5 28.5 29.5 30.5 On-Resistance (:) 5 LED Current (mA) Turn-Off Time (ms) Turn-On Time (ms) 15 LED Current (mA) 0.39 26.5 25 0.7 0.40 5 30 20 1.9 0.41 10 Form-B Typical Blocking Voltage Distribution (N=50) 0 0 15 25.5 Turn-Off Time (ms) Device Count (N) 15 20 1.04 Form-B Typical IF for Switch Dropout (N=50, IL=120mADC) 25 20 0.56 0.72 0.88 Turn-Off Time (ms) Device Count (N) 25 Form-B Typical On-Resistance Distribution (N=50, IF=0mA, IL=120mADC) 0 0.24 0.75 Turn-On Time (ms) LED Current (mA) 25 Device Count (N) 25 Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 1.0 0.8 IF=10mA 0.6 0.4 IF=20mA 0.2 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 80 100 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R11 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA110 Form-B PERFORMANCE DATA* 150 30 20 0 -50 -40 -20 0 20 40 60 80 100 -2 -1 0 1 2 3 Load Voltage (V) Form-B Typical Blocking Voltage vs. Temperature Form-B Typical Leakage vs. Temperature Measured Across Pins 5&6 (IF=5mA) 0.014 405 0.012 Leakage (µA) 410 400 395 390 0.002 -20 0 20 40 60 Temperature (ºC) 80 100 60 40 0 -40 -20 0 20 40 -20 0 20 40 60 80 100 120 Energy Rating Curve 0.006 0.004 80 Temperature (ºC) 0.008 380 100 -40 4 0.010 385 -40 -3 Temperature (ºC) 0.016 120 0 -4 415 140 20 -150 0 Blocking Voltage (VP) 50 -100 10 180 Load Current (mA) Load Current (mA) On-Resistance (:) 40 Form-B Maximum Load Current vs. Temperature (IF=0mA) 160 100 50 375 Form-B Typical Load Current vs. Load Voltage (IF=0mA) Load Current (A) 60 Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=120mADC) 60 80 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms Temperature (ºC) 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 6 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION LBA110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBA110S / LBA110P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LBA110S LBA110P 250ºC 260ºC 30 Seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LBA110 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R11 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA110 MECHANICAL DIMENSIONS LBA110 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA110S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 (0.130 ± 0.002) 0.635 ± 0.127 (0.025 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA110P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 8 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION LBA110 MECHANICAL DIMENSIONS LBA110STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LBA110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 9 Specification: DS-LBA110-R11 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/25/2021