LBA126PTR

LBB126 250V, 170mA Dual Single-Pole Normally Closed Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 250 170 15 Units VP mArms / mADC  Features • • • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromagnetic Relays FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount, Tape & Reel Version Available Description LBB126 is a dual 250V, 170mA, 15 normally closed (1-Form-B) relay that features low on-resistance combined with enhanced peak load current handling capability. It is provided in an 8-pin package, and employs optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single pole relays in a variety of applications by incorporating both relays in a single 8-pin package. Approvals Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LBB126 LBB126P LBB126PTR LBB126S LBB126STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-LBB126-R07 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION LBB126 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration 1 Peak On-Resistance, AC/DC Configuration 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IF=5mA, IL=1A VDRM 250 - - VP t=10ms IL=170mA VL=250VP IL ILPK RON ILEAK - 10 - 170 ±400 15 1 mArms / mADC mAP  IF=5mA, VL=50V, f=1MHz ton toff COUT - 50 5 5 - IL=170mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within 1 second of on-time. www.ixysic.com A ms pF R07 INTEGRATED CIRCUITS DIVISION LBB126 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 10 5 0 0 30 0.42 0.54 0.66 0.78 0.90 Device Count (N) 10 5 0.625 0.875 1.125 1.375 1.625 1.875 2.125 Turn-Off Time (ms) Typical IF for Switch Dropout (N=50, IL=170mADC) Typical On-Resistance Distribution (N=50, IL=170mADC) 35 30 20 15 10 0.63 0.81 0.99 1.17 LED Current (mA) 1.35 20 15 10 0 1.53 0.45 35 25 5 0 0.45 10 Turn-On Time (ms) 5 0 15 1.02 25 15 20 0 0.30 20 25 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=170mADC) 25 Device Count (N) 15 5 1.364 30 20 Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=170mADC) 35 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=170mADC) 0.63 0.81 0.99 1.17 LED Current (mA) 1.35 10.4 1.53 10.8 11.2 11.6 12.0 12.4 On-Resistance (:) 12.8 Typical Blocking Voltage Distribution (N=50, IF=5mA) Device Count (N) 30 25 20 15 10 5 0 291.25 293.75 296.25 298.75 301.25 303.75 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=170mADC) 0.634 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 0.630 0.628 0.626 -50 -25 0 25 50 Temperature (ºC) 75 100 0.8 0.6 0.4 0 0.622 1.0 1.0 0.2 0.624 1.1 Typical Turn-Off Time vs. LED Forward Current (IL=170mADC) 1.2 0.632 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBB126 PERFORMANCE DATA* 2.5 1.0 Turn-Off TIme (ms) 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 Temperature (ºC) 80 Typical IF for Switch Operation vs. Temperature (IL=170mADC) 3.0 1.5 1.0 0.5 LED Current (mA) 1.5 1.0 0 20 40 60 Temperature (ºC) 80 0 -20 0 20 40 60 Temperature (ºC) 80 200 100 50 0 20 40 60 Temperature (ºC) 80 -40 -20 0 20 40 60 80 Temperature (ºC) 100 100 Typical Load Current vs. Load Voltage (IF=0mA) 100 50 0 -50 -100 0.030 0 0.5 1.0 1.5 2.0 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 (IF=5mA) 0.025 305 300 295 290 0.020 0.015 0.010 0.005 -40 120 80 Load Voltage (V) 285 0 20 40 60 Temperature (ºC) -200 -2.0 -1.5 -1.0 -0.5 100 Leakage (PA) Blocking Voltage (VP) 150 -20 Typical Blocking Voltage vs. Temperature (IF=5mA) 310 200 0 -150 Maximum Load Current vs. Temperature (IF=0mA) 250 -20 150 -40 100 20 -40 Typical IF for Switch Dropout vs. Temperature (IL=170mADC) 1.0 0 30 100 1.5 0.5 -40 Load Current (mA) -20 2.0 0.5 40 0 -40 2.5 2.0 50 10 3.0 2.5 LED Current (mA) IF=5mA IF=10mA IF=20mA 2.0 0 100 Typical On-Resistance vs. Temperature (IF=0mA, IL=170mADC) 60 Load Current (mA) Turn-On Time (ms) 1.2 Typical Turn-Off Time vs. Temperature (IL=170mADC) On-Resistance (:) Typical Turn-On Time vs. Temperature (IF=5mA, IL=170mADC) -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LBB126 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBB126P / LBB126S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LBB126S LBB126P 250ºC 260ºC 30 Seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LBB126 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R07 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBB126 MECHANICAL DIMENSIONS LBB126 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBB126P 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 8.70 (0.3425) 1.55 (0.0610) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) PCB Land Pattern 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) LBB126S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 6 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LBB126 LBB126PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LBB126STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LBB126-R07 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/27/2021