LBA127LS

LBA127L 250V, 150mA Dual Single-Pole Relays: 1-Form-A (NO) Current Limiting & 1-Form-B (NC) INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 250 150 15 Units VP mArms / mADC  Features • • • • • • • • • • Current Limited 1-Form-A Relay 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount, Tape & Reel Version Available Description LBA127L comprises two independent solid state relays (one current-limited, single-pole, normally open (1-Form-A) relay and one single-pole, normally closed (1-Form-B) relay), in an 8-pin package that employs optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. The optically coupled relay outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. LBA127L is designed to provide an ideal solution where a complementary Form-A/Form-B relay pair is required in a space-saving single package. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Ordering Information Part # LBA127L LBA127LS LBA127LSTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) Pin Configuration + Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open 1 8 2 7 3 6 4 5 Switching Characteristics of Normally Open (Form A) Devices Form-A Switching Characteristics of Normally Closed (Form B) Devices IF ILOAD 90% 10% ILOAD ton www.ixysic.com Normally Open Pole Form-B IF DS-LBA127L-R10 Normally Closed Pole toff 10% toff 90% ton 1 INTEGRATED CIRCUITS DIVISION LBA127L Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak (Form-B Only) Current Limiting (Form-A Only) On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 250 - - VP t = 10ms IF=5mA, VL=8V IL=150mA VL=250VP IL ILPK ICL RON ILEAK ±190 - ±200 6.8 - 150 ±400 ±280 15 1 mArms / mADC mAP mA  VL=50V, f=1MHz ton toff COUT - 110 5 5 - IL=150mA IF=5mA VR=5V IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within 1 second of on-time. www.ixysic.com A ms pF R10 INTEGRATED CIRCUITS DIVISION LBA127L Form-A/Form-B PERFORMANCE DATA* Device Count (N) Device Count (N) 25 20 15 10 5 25 25 20 20 Device Count (N) 30 15 10 5 0 0 1.364 0.65 1.8 15 10 5 0 0.35 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0.40 0.45 0.50 0.55 0.60 LED Current (mA) 332 334 336 338 340 Blocking Voltage (VP) Typical IF for Switch Operation vs. Temperature (IL=75mADC) Load Current vs. Load Temperature (Form-A: IF=5mA, Form-B: IF=0mA) 250 342 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 0.60 Load Current (mA) LED Current (mA) LED Forward Voltage Drop (V) Typical Blocking Voltage Distribution (Form-A: IF=0mA, Form-B: IF=5mA) (N=50) Typical IF for Switch Operation (N=50, IL=150mADC) Typical LED Forward Voltage Drop (N=50, IF=5mA) 0.55 0.50 0.45 200 150 100 50 1.1 0.40 -40 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 355 0 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Blocking Voltage vs. Temperature (Form-A: IF=0mA, Form-B: IF=5mA) Blocking Voltage (VP) 350 345 340 335 330 325 320 315 -40 -20 0 20 40 60 80 100 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R10 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA127L Form-A RELAY PERFORMANCE DATA* Form-A Typical Turn-On Time (N=50, IF=5mA, IL=150mADC) 25 15 10 5 0 20 15 10 5 0 0.30 0.33 0.36 0.39 0.42 Turn-On Time (ms) 1.00 20 15 10 5 0 0.12 0.45 Form-A Typical Turn-On Time vs. LED Forward Current (IL=75mADC) Form-A Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=150mADC) 0.13 0.14 0.15 0.16 Turn-Off Time (ms) 0.17 6.70 6.80 6.85 6.90 6.95 On-Resistance (:) Form-A Typical Turn-Off Time vs. LED Forward Current (IL=75mADC) 0.165 6.75 Form-A Typical On-Resistance vs. Temperature (IF=5mA, IL=75mADC) 8.5 0.50 0.25 0.160 0.155 0 10 20 30 40 LED Forward Current (mA) 50 0 Form-A Typical Turn-On Time vs. Temperature (IF=5mA, IL=75mADC) 1.2 10 20 30 40 LED Forward Current (mA) 0.2 0 -40 -20 0 20 40 60 Temperature (ºC) 0.025 80 100 6.0 0.16 0.14 0.12 0.10 0.08 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Form-A Typical Load Current vs. Load Voltage (IF=5mA) 0.15 Load Current (A) Turn-Off Time (ms) 0.4 6.5 0.20 0.18 0.6 7.0 5.0 -40 50 Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=75mADC) 0.20 1.0 0.8 7.5 5.5 0.150 0 Turn-On Time (ms) On-Resistance (:) Turn-Off Time (ms) Turn-On Time (ms) 8.0 0.75 0.10 0.05 0.00 -0.05 -0.10 -0.15 -20 0 20 40 60 Temperature (ºC) Form-A Typical Leakage vs.Temperature (Measured Across Pins 5 & 6) (VL=250V) 80 100 -0.20 -1.5 -1.0 -0.5 0.0 0.5 Load Voltage (V) 1.0 1.5 Form-A Typical Current Limiting vs. Temperature (IF=5mA) 400 350 300 Current (mA) Leakage (PA) 0.020 0.015 0.010 250 200 150 100 0.005 50 0.000 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 -20 0 20 40 60 80 100 120 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION LBA127L Form-B RELAY PERFORMANCE DATA* Form-B Typical Turn-On Time (N=50, IF=5mA, IL=150mADC) 25 15 10 5 0 20 15 10 5 0.05 0.07 0.09 0.11 Turn-On Time (ms) 0.13 0.75 15 10 5 1.25 1.75 2.25 2.75 4.05 3.25 4.35 Turn-Off Time (ms) Form-B Typical Turn-On Time vs. LED Forward Current (IL=75mADC) 78.5 20 0 0 0.03 Form-B Typical On-Resistance Distribution (N=50, IF=0mA, IL=150mADC) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=150mADC) Form-B Typical Turn-Off Time vs. LED Forward Current (IL=75mADC) 2.5 4.65 4.95 5.25 On-Resistance (:) 5.55 Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=75mADC) 9 77.5 77.0 76.5 2.0 On-Resistance (:) Turn-Off Time (ms) Turn-On Time (Ps) 8 78.0 1.5 1.0 0.5 7 6 5 4 3 2 1 0 76.0 5 10 0.20 15 20 25 30 35 40 45 0 50 5 10 20 25 30 35 40 LED Forward Current (mA) LED Forward Current (mA) Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=75mADC) Form-B Typical Turn-Off Time vs. Temperature (IL=75mADC) 3.5 Turn-Off Time (ms) 0.15 0.10 0.05 45 200 2.5 -20 0 20 40 60 80 100 IF=20mA 2.0 1.5 1.0 0 -40 0 20 40 60 Temperature (ºC) Typical Leakage vs. Temperature Measured Across Pins 7&8 (IF=5mA) 80 100 Form-B Typical Load Current vs. Load Voltage (IF=0mA) 100 50 0 -50 -100 80 -1 -0.8 -0.6 -0.4 -0.2 100 0 0.2 0.4 0.6 0.8 1 Load Voltage (V) Energy Rating Curve 1.2 1.0 Load Current (A) Leakage (PA) 20 40 60 Temperature (ºC) -200 -20 0.05 0.04 0.03 0.02 0.8 0.6 0.4 0.2 0.01 0 -40 0 -150 Temperature (ºC) 0.06 -20 150 IF=10mA 0.5 0 -40 0 -40 50 IF=5mA 3.0 Turn-On Time (ms) 15 Load Current (mA) 0 -20 0 20 40 60 Temperature (ºC) 80 100 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R10 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA127L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBA127LS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LBA127LS 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LBA127L Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 6 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION LBA127L MECHANICAL DIMENSIONS LBA127L 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA127LS PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) R10 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA127L MECHANICAL DIMENSIONS LBA127LSTR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 8 Specification: DS-LBA127L-R10 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/27/2021