LBA127P

LBA127 250V, 200mA Dual Single-Pole Relays: 1-Form-A (NO) & 1-Form-B (NC) INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 250 200 10 Units VP mArms / mADC  Features • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount, Tape & Reel Versions Available LBA127 is a combination device comprising one normally open (1-Form-A) and one normally closed (1-Form-B) solid state relay. Both relays are independent, 250V, 200mA, 10 devices designed to provide an ideal solution where a complementary relay pair (1-Form-A / 1-Form-B) is required. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Applications • • • • • • • • • • Description Telecommunications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Part # LBA127 LBA127P LBA127PTR LBA127S LBA127STR Description 8-Pin DIP (50/Tube) 8-Pin SOIC (Flatpack) (50/Tube) 8-Pin SOIC (Flatpack) (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open 1 8 2 7 3 6 4 5 Switching Characteristics of Normally Open (Form A) Devices Switching Characteristics of Normally Closed (Form B) Devices IF IF ILOAD 90% 10% ILOAD ton www.ixysic.com Normally Open Pole Form-B Form-A DS-LBA127-R15 Normally Closed Pole toff 10% toff 90% ton 1 INTEGRATED CIRCUITS DIVISION LBA127 Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Blocking Voltage Load Current, AC/DC Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 250 - - VP t = 10ms IL=200mA VL=250VP IL ILPK RON ILEAK - 6.8 - 200 ±400 10 1 mArms / mADC mAP  VL=50V, f=1MHz ton toff COUT - 110 5 5 - IL=200mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within 1 second of on-time. www.ixysic.com A ms pF R15 INTEGRATED CIRCUITS DIVISION LBA127 Form-A/Form-B PERFORMANCE DATA* 30 25 Device Count (N) Device Count (N) 25 20 15 10 5 25 20 15 10 5 0 0 1.364 0.65 1.8 20 15 10 5 0 0.35 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0.40 0.45 0.50 0.55 0.60 LED Current (mA) 332 334 336 338 340 Blocking Voltage (VP) Typical IF for Switch Operation vs. Temperature (IL=100mADC) Typical Blocking Voltage vs. Temperature (Form-A: IF=0mA, Form-B: IF=5mA) 355 342 350 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 0.60 Blocking Voltage (VP) LED Current (mA) 0.55 0.50 0.45 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) Load Current (mA) 250 75 100 0.40 -40 -20 0 20 40 60 Temperature (ºC) Load Current vs. Load Temperature (Form-A: IF=5mA, Form-B: IF=0mA) 100 340 335 330 325 320 315 -40 -20 0 20 40 60 80 100 Temperature (ºC) Energy Rating Curve 1.0 200 150 100 50 0.8 0.6 0.4 0.2 0 -40 80 345 1.2 Load Current (A) LED Forward Voltage Drop (V) Typical Blocking Voltage Distribution (Form-A: IF=0mA, Form-B: IF=5mA) (N=50) Typical IF for Switch Operation (N=50, IL=200mADC) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) -20 0 20 40 60 Temperature (ºC) 80 100 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R15 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA127 Form-A RELAY PERFORMANCE DATA* Form-A Typical Turn-On Time (N=50, IF=5mA, IL=200mADC) 25 15 10 5 0 20 15 10 5 0.33 0.36 0.39 0.42 0.12 0.45 0.13 Turn-On Time (ms) Form-A Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mADC) 1.2 0.14 0.15 0.16 Turn-Off Time (ms) 0.4 0.2 0 -40 -20 0 20 40 60 Temperature (ºC) 80 Form-A Typical Turn-On Time vs. LED Forward Current (IL=100mADC) 1.00 5 6.75 6.80 6.85 6.90 6.95 Form-A Typical On-Resistance vs. Temperature (IF=5mA, IL=100mADC) 8.5 8.0 0.16 0.14 0.12 0.10 7.5 7.0 6.5 6.0 5.5 0.08 -40 100 10 On-Resistance (:) On-Resistance (:) Turn-Off Time (ms) 0.6 15 6.70 0.18 0.8 20 0.17 Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mADC) 0.20 1.0 Form-A Typical On-Resistance Distribution (N=50, IF=5mA, IL=200mADC) 0 0 0.30 Turn-On Time (ms) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=200mADC) -20 0 20 40 60 Temperature (ºC) 80 5.0 -40 100 Form-A Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) 0.165 0.20 -20 0 20 40 60 Temperature (ºC) 80 100 Form-A Typical Load Current vs. Load Voltage (IF=5mA) 0.50 0.25 Load Current (A) Turn-Off Time (ms) Turn-On Time (ms) 0.15 0.75 0.160 0.155 0.10 0.05 0.00 -0.05 -0.10 -0.15 0.150 0 0 10 20 30 40 LED Forward Current (mA) 50 0 0.025 10 20 30 40 LED Forward Current (mA) 50 -0.20 -1.5 -1.0 -0.5 0.0 0.5 Load Voltage (V) 1.0 1.5 Form-A Typical Leakage vs.Temperature (Measured Across Pins 5 & 6) (VL=250V) Leakage (PA) 0.020 0.015 0.010 0.005 0.000 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R15 INTEGRATED CIRCUITS DIVISION LBA127 Form-B RELAY PERFORMANCE DATA* Form-B Typical Turn-On Time (N=50, IF=5mA, IL=200mADC) 25 15 10 5 20 15 10 5 15 10 5 0.05 0.20 0.07 0.09 0.11 0 0.75 0.13 1.25 1.75 2.25 2.75 3.25 4.05 4.95 5.25 5.55 On-Resistance (:) Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mADC) Form-B Typical Turn-Off Time vs. Temperature (IL=100mADC) Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=100mADC) 3.5 Turn-Off Time (ms) 0.15 0.10 0.05 2.5 9 IF=5mA 8 IF=10mA 7 IF=20mA 2.0 1.5 1.0 0.5 -20 78.5 4.65 Turn-Off Time (ms) 3.0 0 -40 4.35 Turn-On Time (ms) On-Resistance (:) 0.03 Form-B Typical On-Resistance Distribution (N=50, IF=0mA, IL=200mADC) 20 0 0 Turn-On Time (ms) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=200mADC) 0 20 40 60 80 5 4 3 2 1 0 -40 100 6 -20 0 20 40 80 60 0 -40 100 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) Temperature (ºC) Form-B Typical Turn-On Time vs. LED Forward Current (IL=100mADC) Form-B Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) Form-B Typical Load Current vs. Load Voltage (IF=0mA) 2.5 200 77.5 77.0 76.5 2.0 Load Current (mA) Turn-Off Time (ms) Turn-On Time (Ps) 150 78.0 1.5 1.0 0.5 100 50 0 -50 -100 -150 76.0 0 0 5 10 15 20 25 30 35 40 45 50 -200 0 5 10 LED Forward Current (mA) 15 20 25 30 35 40 45 50 LED Forward Current (mA) 0.06 -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 Load Voltage (V) Form-B Typical Leakage vs. Temperature Measured Across Pins 7&8 (IF=5mA) Leakage (PA) 0.05 0.04 0.03 0.02 0.01 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R15 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA127 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBA127S MSL 1 LBA127P MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LBA127S LBA127P 250ºC 245ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LBA127 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 6 www.ixysic.com R15 INTEGRATED CIRCUITS DIVISION LBA127 MECHANICAL DIMENSIONS LBA127 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA127S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA127P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) R15 PCB Land Pattern Dimensions mm (inches) www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA127 MECHANICAL DIMENSIONS LBA127STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LBA127PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 8 Specification: DS-LBA127-R15 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/25/2021