LBA710
60V, 1A Dual Single-Pole Relays:
1-Form-A (NO) & 1-Form-B (NC)
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
60
1
0.6
2
Units
V
Arms / ADC
mA
Features
•
•
•
•
•
•
•
•
•
•
Low On-Resistance (0.6)
Low Control Current (2mA)
3750Vrms Input/Output Isolation
100% Solid State
Low Drive Power Requirements
No EMI/RFI Generation
Surface Mount Version
Small 8-Pin Package
Tape & Reel available
Flammability Rating UL 94 V-0
Description
LBA710 is a 60V, 1A, 0.6 dual Solid State Relay
integrating independent single-pole normally open
(1-Form-A) and single-pole normally closed
(1-Form-B) relays into a single package. It features
a superior combination of low on-resistance and 1A
load current handling capability.
Approvals
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate # 1175739
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part #
LBA710
LBA710S
LBA710STR
Description
8-Pin DIP (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1000/Reel)
Applications
•
•
•
•
•
•
•
•
Security
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Medical Equipment-Patient/Equipment Isolation
Industrial Controls
Pin Configuration
+ Control
– Control
+ Control
– Control
1
8
2
7
3
6
4
5
Normally Closed
Form-B
Normally Open
Form-A
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
toff
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
10%
toff
DS-LBA710-R05
www.ixysic.com
90%
ton
1
INTEGRATED CIRCUITS DIVISION
LBA710
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
ESD Rating, Human Body Model
Operational Temperature, Ambient
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate output power linearly 6.67 mW / ºC
Ratings
60
5
50
1
Units
VP
V
mA
A
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
150
800
3750
8
-40 to +85
-40 to +125
mW
mW
Vrms
kV
°C
°C
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Electrical Characteristics @ 25ºC
Parameter
Conditions
Output Characteristics: Form-A (Normally Open)
Blocking Voltage
IL=1A
Load Current
IF=2mA
Continuous
Peak
IF=2mA, t < 10ms
On-Resistance
IF=2mA, IL=1A
Switching Speeds
Turn-On Output (Activate)
IF=5mA, VL=10V
Turn-Off Output (Deactivate)
Off-State Leakage Current
IF=0mA, VL=60V
Output Capacitance
IF=0mA, VL=50V, f=1MHz
Output Characteristics: Form-B (Normally Closed)
Blocking Voltage
IF=2mA, IL=1A
Load Current
Symbol
Min
Typ
Max
Units
VDRM
60
-
-
VP
IL
-
-
1
Arms / ADC
ILPK
RON
-
0.21
±5
0.6
AP
ton
toff
ILEAK
COUT
-
0.7
0.09
44
5
5
1
-
A
pF
VDRM
60
-
-
VP
IL
-
-
1
Arms / ADC
ILPK
RON
-
0.39
±5
0.6
AP
ton
toff
0.63
1.5
125
5
5
1
-
A
pF
ms
IF=0mA
Continuous
Peak
IF=0mA, t < 10ms
On-Resistance
IF=0mA, IL=1A
Switching Speeds
Turn-On Output (Deactivate)
IF=5mA, VL=10V
Turn-Off Output (Activate)
Off-State Leakage Current
IF=2mA, VL=60V
Output Capacitance
IF=2mA, VL=50V, f=1MHz
Input Characteristics: Form-A and Form-B
Input Control Current to Activate
IL=1A
Input Control Current to Deactivate
Input Voltage Drop
IF=5mA
Reverse Input Current
VR=5V
Common Characteristics: Form-A and Form-B
ILEAK
COUT
-
IF
IF
VF
IR
0.1
0.9
-
1.36
-
2
1.5
10
mA
mA
V
A
Capacitance, Input to Output
CIO
-
3
-
pF
VIO=0V, f=1MHz
ms
*NOTE: If both poles operate simultaneously, then load current must be derated so as not to exceed the package total power dissipation value.
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R05
INTEGRATED CIRCUITS DIVISION
LBA710
Form-A PERFORMANCE DATA*
Form-A
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
Device Count (N)
20
15
10
5
20
15
10
5
1.366
1.368
1.370
1.372
LED Forward Voltage Drop (V)
Device Count (N)
25
0.57
0.61
0.65 0.69 0.73 0.77
Turn-On Time (ms)
20
15
10
5
5
65.5
1.7
66.0
66.5 67.0 67.5 68.0
Blocking Voltage (VP)
77.7
Turn-On Time (Ps)
1000
1.6
IF=10mA
IF=5mA
IF=2mA
1.5
1.4
1.3
1.2
800
600
400
200
1.1
0
25
50
Temperature (ºC)
75
100
10
20
30
40
LED Forward Current (mA)
Turn-On Time (Ps)
0.85
0.80
0.75
77.4
77.3
0
50
Form-A
Typical Turn-On Time
vs. Temperature
(IL=100mA)
2500
0.90
77.5
77.1
0
Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=500mA)
77.6
77.2
0
1.0
68.5
Form-A
Typical Turn-Off
vs. LED Forward Current
(IL=100mA, TA=25ºC)
77.8
Turn-Off Time (Ps)
LED Forward Voltage Drop (V)
0.102
10
Form-A
Typical Turn-On
vs. LED Forward Current
(IL=100mA, TA=25ºC)
1200
1.8
0.95
0.082 0.087 0.092 0.097
Turn-Off Time (ms)
0
Typical LED Forward Voltage Drop
vs. Temperature
LED Current (mA)
0.077
0.81
15
0.206 0.207 0.208 0.209 0.210 0.211 0.212
On-Resistance (:)
-25
5
20
0
-50
10
Form-A
Typical Blocking Voltage Distribution
(N=50)
Form-A
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=1A)
Device Count (N)
1.364
15
0
0
0
2000
50
Form-A
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
85
1500
1000
10
20
30
40
LED Forward Current (mA)
90
IF=2mA
Turn-Off Time (Ps)
Device Count (N)
25
Form-A
Typical Turn-Off Time
(N=50, IF=5mA)
20
Device Count (N)
30
Form-A
Typical Turn-On Time
(N=50, IF=5mA)
IF=5mA
500
80
IF=2mA
75
70
IF=5mA
65
60
55
0.70
-40
0
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
50
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R05
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3
INTEGRATED CIRCUITS DIVISION
LBA710
Form-A PERFORMANCE DATA (continued)*
Form-A
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=500mA)
0.26
0.3
0.18
0.16
0.1
0.0
-0.1
0.14
-0.2
0.12
-40
-0.3
-1.0
-20
0
20
40
60
Temperature (ºC)
80
100
Form-A
Typical Blocking Voltage
vs. Temperature
20
Leakage Current (nA)
Blocking Voltage (VP)
69
68
67
66
65
64
63
-20
0
20
40
60
Temperature (ºC)
80
Load Current (A)
0.20
62
-40
1.0
0.0
Voltage (V)
0.5
0.7
0.6
1.0
-40
Form-A
Typical Leakage vs. Temperature
Measured Across Pins 5&6
(VL=60V)
5
-20
0
20
40
60
Temperature (ºC)
80
100
Form-A
Output Capacitance
vs. Load Voltage
(IF=0mA, f=1MHz)
120
10
0
-40
0.8
0.4
-0.5
15
100
0.9
0.5
Output Capacitence (pF)
0.22
Form-A
Maximum Load Current
vs. Temperature
(IF=2mA)
1.1
0.2
Current (A)
On-Resistance (:)
0.24
70
Typical Load Current
vs. Load Voltage
(IF=2mA)
100
80
60
40
20
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0.1
1
10
Load Voltage (V)
100
Form-A
Energy Rating Curve
6
Load Current (A)
5
4
3
2
1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R05
INTEGRATED CIRCUITS DIVISION
LBA710
Form-B PERFORMANCE DATA*
25
25
20
20
15
10
5
Form-B
Typical Turn-On Time
(N=50, IF=5mA)
15
10
5
Device Count (N)
20
0.54
0.57
0.60 0.63 0.66 0.69
Turn-On Time (ms)
Form-B
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=1A)
15
10
5
5
25
Turn-On Time (ms)
1.7
1.6
IF=10mA
IF=5mA
IF=2mA
1.3
1.2
1.1
1.0
0
25
50
Temperature (ºC)
75
0.640
0.638
0.636
0.634
0.632
0.630
0.628
0.626
0.624
0.622
0.620
100
5
Turn-On Time (ms)
0.20
0.16
0
20
40
60
Temperature (ºC)
80
100
69
71
73
75
77
79
Blocking Voltage (VP)
81
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
8
6
5
4
3
2
1
0
10
20
30
40
LED Forward Current (mA)
50
10
20
30
40
LED Forward Current (mA)
50
Form-B
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mA)
2.6
2.4
0.8
0.7
0.6
0.5
0.4
-40
0
Form-B
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=100mA)
0.9
0.24
-20
1.9
7
0
Form-B
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
0.28
0.12
-40
1.8
10
Turn-Off Time (ms)
0.32
-25
1.4 1.5 1.6 1.7
Turn-Off Time (ms)
15
Turn-Off Time (ms)
1.8
-50
1.3
20
Form-B
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
Typical LED Forward Voltage Drop
vs. Temperature
1.4
1.2
Form-B
Typical Blocking Voltage Distribution
(N=50, IF=2mA)
0.381 0.384 0.387 0.390 0.393 0.396 0.399
On-Resistance (:)
1.5
0.72
0
0
LED Forward Voltage Drop (V)
10
0
1.366
1.368
1.370
1.372
LED Forward Voltage Drop (V)
Device Count (N)
1.364
LED Current (mA)
15
0
0
Form-B
Typical Turn-Off Time
(N=50, IF=5mA)
20
Device Count (N)
30
Device Count (N)
Device Count (N)
Form-B
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
2.2
2.0
1.8
1.6
1.4
-20
0
20
40
60
Temperature (ºC)
80
100
1.2
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R05
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5
INTEGRATED CIRCUITS DIVISION
LBA710
Form-B PERFORMANCE DATA (continued)*
Form-B
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=500mA)
1.0
0.9
0.8
0.7
0.6
0.5
0
20
40
60
Temperature (ºC)
80
-1.0
-0.4 -0.3 -0.2
100
Form-B
Typical Blocking Voltage
vs. Temperature
(IF=2mA)
0.10
Leakage Current (PA)
79
78
77
76
75
74
-20
0
20
40
60
Temperature (ºC)
80
100
0.4
-0.1 0.0 0.1
Voltage (V)
0.2
0.3
Form-B
Typical Leakage vs. Temperature
Measured Across Pins 7&8
(IF=2mA, VL=60V)
0.06
0.04
0.02
-20
0
20
40
60
Temperature (ºC)
80
100
Form-B
Output Capacitance
vs. Load Voltage
(IF=2mA, f=1MHz)
450
0.08
0.00
-40
-40
0.4
Output Capacitance (pF)
-20
80
Blocking Voltage (VP)
0.0
-0.5
0.32
73
-40
Load Current (A)
0.36
81
1.1
0.5
0.40
0.28
-40
Form-B
Maximum Load Current
vs. Temperature
(IF=0mA)
1.0
0.44
Current (A)
On-Resistance (:)
0.48
Form-B
Typical Load Current
vs. Load Voltage
(IF=0mA)
400
350
300
250
200
150
100
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0.1
1
10
Load Voltage (V)
100
Form-B
Energy Rating Curve
6
Load Current (A)
5
4
3
2
1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
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INTEGRATED CIRCUITS DIVISION
LBA710
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
LBA710S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
LBA710S
250ºC
30 seconds
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
LBA710
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
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7
INTEGRATED CIRCUITS DIVISION
LBA710
Mechanical Dimensions
LBA710
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.762 DIA.
(8-0.030 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
3.302 ± 0.051
(0.130 ± 0.002)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.127
(0.300 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LBA710S
PCB Land Pattern
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
0.635 ± 0.127
(0.025 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
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INTEGRATED CIRCUITS DIVISION
LBA710
LBA710STR Tape & Reel
2.0
(0.08)
4.0
(0.16)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
7.5
(0.30)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
16.0±0.3
(0.63±0.012)
Ao=10.30
(0.406)
P1=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
3. Controlling dimension: mm
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
9
Specification: DS-LBA710-R05
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
10/27/2021
