LBB110S

LBB110 350V, 120mA Dual Single-Pole Normally Closed Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC  Features • • • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount, Tape & Reel Versions Available Description LBB110 is a dual normally closed (1-Form-B) solid state relay that has two independently controlled, optically coupled MOSFET switches in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications by incorporating both relays in a single 8-pin package. Approvals Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LBB110 LBB110P LBB110PTR LBB110S LBB110STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-LBB110-R10 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION LBB110 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - VP t=10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 25 - 120 ±350 35 1 mArms / mADC AP  IF=5mA, VL=50V, f=1MHz ton toff COUT - 25 3 3 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=50V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V 1 If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within 1 second of on-time. www.ixysic.com A ms pF R10 INTEGRATED CIRCUITS DIVISION LBB110 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 15 10 5 0.27 0.09 25 Device Count (N) 20 15 10 5 0 0.45 0.63 0.81 0.55 0.77 0.99 1.21 LED Current (mA) 1.43 5 0.27 0.45 0.63 0.81 0.99 1.17 1.35 Turn-Off Time (ms) Typical IF for Switch Dropout (N=50, IL=120mADC) Typical On-Resistance Distribution (N=50, IL=120mADC) 25 15 10 5 20 15 10 5 0 1.65 0.11 Device Count (N) 10 Turn-On Time (ms) 20 25 15 0.99 0 0.33 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=120mADC) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 25 Device Count (N) Device Count (N) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 0.33 0.55 0.77 0.99 LED Current (mA) 1.21 1.43 25.5 26.5 27.5 28.5 29.5 30.5 31.5 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=5mA) 20 15 10 5 0 357.5 0.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 Turn-Off Time (ms) 1.6 0.20 0.15 0.10 0.05 -50 -25 0 25 50 Temperature (ºC) 75 100 0.5 0.4 0.3 0.2 0.1 0 0 1.0 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.7 0.25 Turn-On Time (ms) LED Forward Voltage Drop (V) 0.30 1.7 432.5 Typical Turn-On Time vs. LED Forward Current (IL=120mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 372.5 387.5 402.5 417.5 Blocking Voltage (VP) 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R10 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBB110 PERFORMANCE DATA* Typical IF for Switch Operation vs. Temperature (IL=120mADC) 0.6 Turn-On Time (ms) 2.0 1.5 1.0 0.5 0.3 0.2 0.1 3.0 -20 0 20 40 60 80 -40 100 -20 0 20 40 60 Temperature (ºC) Temperature (ºC) Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Typical Turn-Off Time vs. Temperature (IL=120mADC) 2.0 1.8 Turn-Off Time (ms) 2.5 2.0 1.5 1.0 0.5 80 -40 1.2 1.0 0.8 0.6 -20 0 20 40 60 80 80 100 100 50 0 -50 -20 0 20 40 60 80 100 -4 -3 -2 0 -1 1 2 3 4 Temperature (ºC) Load Voltage (V) Maximum Load Current vs. Temperature Typical Blocking Voltage vs. Temperature (IF=5mA) Typical Leakage vs. Temperature (Measured across Pins 5&6 or 7&8) (IF=5mA) 410 Blocking Voltage (VP) 160 140 120 100 80 60 40 20 0 0.045 0.040 405 0.035 400 395 390 0 20 40 60 80 Temperature (ºC) 100 0.025 0.020 0.015 0.005 -40 120 0.030 0.010 385 380 -20 60 Temperature (ºC) 180 -40 40 -150 -40 100 20 -100 0 -40 0 Typical Load Current vs. Load Voltage 0.4 0 -20 150 IF=10mA 1.4 Dual Pole Single Pole Instantaneous Temperature (ºC) IF=5mA 1.6 50 45 40 35 30 25 20 15 10 5 0 100 Load Current (mA) -40 LED Current (mA) 0.4 0 0 Load Current (mA) 0.5 Leakage (PA) LED Current (mA) 2.5 Typical On-Resistance vs. Temperature (IL=120mADC) On-Resistance (:) 3.0 Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) -20 0 20 40 60 80 100 Temperature (ºC) 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION LBB110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBB110P / LBB110S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LBB110S LBB110P 250ºC 260ºC 30 Seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LBB110 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R10 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBB110 MECHANICAL DIMENSIONS LBB110 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBB110P 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 8.70 (0.3425) 1.55 (0.0610) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) PCB Land Pattern 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) LBB110S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 (0.130 ± 0.002) 0.635 ± 0.127 (0.025 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 6 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION LBB110 LBB110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LBB110STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LBB110-R10 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/27/2021