LBB127S

LBB127 250V, 200mA Dual Single-Pole Normally Closed Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 250 200 10 Units VP mArms / mADC  Features • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromagnetic Relays No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Versions Available Applications • • • • • • • • • • Telecommunications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Description LBB127 is a 250V, 200mA, 10 dual normally closed (1-Form-B) Solid State Relay that comprises two independently controlled, optically coupled MOSFET switches. It is provided in an 8-pin package, and employs optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. This dual single-pole OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-pin package. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LBB127 LBB127S LBB127STR LBB127P LBB127PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin SOIC (Flatpack) (50/Tube) 8-Pin SOIC (Flatpack) (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed (Form B) Devices Form-B IF ILOAD 10% toff DS-LBB127-R08 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION LBB127 Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / °C Derate output power linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Blocking Voltage Load Current, AC/DC Continuous 1 Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units IF=5mA, IL=1A VDRM 250 - - VP t =10ms IL=200mA VL=250VP IL ILPK RON ILEAK - 8 - 200 ±400 10 1 mArms / mADC mAP  IF=5mA, VL=50V, f=1MHz ton toff COUT - 50 5 5 - IL=200mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value. www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LBB127 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 15 10 5 0.03 Device Count (N) 15 10 5 0 0.05 0.07 0.09 0.11 Turn-On Time (ms) 1.8 2.2 2.6 3.0 LED Current (mA) 0.75 1.05 1.35 1.60 1.95 Typical On-Resistance Distribution (N=50, IF=5mA, IL=200mA) 25 15 10 5 20 15 10 5 0 3.4 1.0 Device Count (N) 5 Turn-Off Time (ms) 20 25 10 0.45 0 1.4 15 0.13 Typical IF for Switch Dropout (N=50, IL=200mA) 25 20 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=200mA) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=200mA) 25 Device Count (N) Device Count (N) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=200mA) 1.4 1.8 2.2 2.6 LED Current (mA) 5.325 3.0 5.495 5.665 5.835 6.005 On-Resistance (:) 6.175 Typical Blocking Voltage Distribution (N=50, IF=5mA) 20 15 10 5 0 310 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.4 0.04 0.03 0.02 0.01 1.1 -50 -25 0 25 50 Temperature (ºC) 75 100 1.2 1.0 0.8 0.6 0.4 0.2 0 1.0 Typical Turn-Off Time vs. LED Forward Current (IL=200mA) 1.6 0.05 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 0.06 1.7 330 Typical Turn-On Time vs. LED Forward Current (IL=200mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 314 318 322 326 Blocking Voltage (VP) 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBB127 PERFORMANCE DATA* 2.5 0.10 Turn-Off Time (ms) 0.08 0.06 0.04 0.02 -40 -20 0 20 40 60 Temperature (ºC) 80 1.5 IF=10mA 1.0 IF=20mA 0.5 200 150 100 50 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 Typical IF for Switch Dropout vs. Temperature (IL=200mA) 4.0 4.0 3.0 2.5 2.0 1.5 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.5 0 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 200 Blocking Voltage (VP) 100 50 0 -50 -100 -150 -200 -1.2 -0.4 0 0.4 0.8 100 5 4 3 2 0 20 40 60 Temperature (ºC) 80 100 -40 0.045 350 0.040 300 0.035 250 200 150 20 40 60 Temperature (ºC) 80 100 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 (IF=5mA) 0.015 0.005 0 20 40 60 Temperature (ºC) 0.020 0.010 -20 0 0.025 50 -40 -20 0.030 100 Load Voltage (V) 80 6 400 1.2 120 0 -20 0 -0.8 100 Typical On-Resistance vs. Temperature (IF=0mA, IL=200mA) Typical Blocking Voltage vs. Temperature (IF=5mA) 150 20 40 60 80 Temperature (ºC) 1 -40 Typical Load Current vs. Load Voltage (IF=0mA) 0 7 On-Resistance (:) 3.5 -20 8 3.5 LED Current (mA) LED Current (mA) IF=5mA 100 Typical IF for Switch Operation vs. Temperature (IL=200mA) 4.5 Load Current (mA) 2.0 0 0 Maximum Load Current vs. Temperature (IF=0mA) 250 Leakage (A) Turn-On Time (ms) 0.12 Typical Turn-Off Time vs. Temperature (IL=200mA) Load Current (mA) Typical Turn-On Time vs. Temperature (IF=5mA, IL=200mA) 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LBB127 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBB127S MSL 1 LBB127P MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LBB127S LBB127P 250ºC 245ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LBB127 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBB127 MECHANICAL DIMENSIONS LBB127 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBB127S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBB127P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION LBB127 MECHANICAL DIMENSIONS LBB127STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm LBB127PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LBB127-R08 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/28/2021