LCA182
350V, 120mA Single-Pole
Normally Open Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Input Control Current
Rating
350
120
35
0.25
Units
VP
mArms / mADC
mA
Features
• Very Low Input Control Current (0.25mA)
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
• Greater Reliability than Electromechanical Relays
• No EMI/RFI Generation
• Small 6-Pin Package
• Surface Mount, Tape & Reel Version Available
• Flammability Rating UL 94 V-0
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, PocketSize)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment Patient/Equipment Isolation
• Industrial Controls
Description
LCA182 is a normally open (1-Form-A) solid
state relay that uses optically coupled MOSFET
technology to provide 3750Vrms of input to output
isolation. It features an extremely low input control
current of only 0.25mA, which is the lowest available
in IXYS Integrated Circuits Division’s Solid State
Relay family.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED.
The LCA182 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no
moving parts, it offers faster, bounce-free switching
in a more compact surface mount or through-hole
package.
Approvals
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate # 1175739
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part #
LCA182
LCA182S
LCA182STR
Description
6 Pin DIP (50/Tube)
6 Pin Surface Mount (50/Tube)
6 Pin Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
+ Load
– Load
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-LCA182-R05
www.ixysic.com
toff
1
INTEGRATED CIRCUITS DIVISION
LCA182
Absolute Maximum Ratings @ 25°C
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature, Ambient
Storage Temperature
1
Derate linearly 1.33 mW / °C
2
Derate output power linearly 6.67 mW / °C
Ratings
350
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at the specified
temperatures and are the result of engineering evaluations.
They are provided for information purposes only and are not
part of the manufacturing testing requirements.
Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Blocking Voltage
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance 1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 2
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
350
-
-
VP
-
IL
-
-
t=10ms
ILPK
-
-
120
200
350
mArms / mADC
mADC
mA
RON
-
35
10
1
ILEAK
23
7
-
-
25
3
3
-
IL=120mA
IL=200mA
VL=350VP
µA
IF=0mA, VL=50V, f=1MHz
ton
toff
COUT
IL=120mA
IF=1mA
VR=5V
IF
IF
VF
IR
0.05
0.9
-
1.2
-
0.25
1.4
10
mA
mA
V
µA
VIO=0V, f=1MHz
CIO
-
3
-
pF
IF=1mA, VL=10V
-
ms
pF
1 Measurement taken within one second of on-time.
2 It is recommended that the input control current be increased to 1mA in high temperature (>55ºC) operation.
2
www.ixysic.com
R05
INTEGRATED CIRCUITS DIVISION
LCA182
PERFORMANCE DATA*
25
20
15
10
5
1.17
35
15
10
5
Typical IF for Switch Operation
(N=50, IL=120mADC)
0.456 0.476 0.496 0.516
Turn-On Time (ms)
Device Count (N)
15
10
15
10
0
0
0.10
0.15
0.20
LED Current (mA)
0.193 0.203 0.213 0.223
Turn-Off Time (ms)
0.233
Typical On-Resistance Distribution
(N=50, IL=120mADC)
30
20
5
5
35
25
5
10
0.183
30
20
15
0.536
Typical IF for Switch Dropout
(N=50, IL=120mADC)
35
25
20
0
0.436
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
30
Device Count (N)
20
0
0
Typical Turn-Off Time
(N=50, IF=2mA, IL=120mADC)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
25
Typical Turn-On Time
(N=50, IF=2mA, IL=120mADC)
Device Count (N)
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
20
15
10
5
0
0.25
0.10
0.15
0.20
LED Current (mA)
0.25
21.5
21.7
21.9 22.1 22.3 22.5
On-Resistance (:)
22.7
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
390
IF=50mA
1.2
IF=10mA
IF=5mA
IF=0.25mA
1.0
0.8
-40
-20
0
20
40
60
Temperature (ºC)
80
100
120
450
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
0.7
0.6
Turn-Off Time (ms)
1.4
Turn-On Time (ms)
LED Forward Voltage Drop (V)
1.6
410 420 430 440
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=120mADC)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
400
0.5
0.4
0.3
0.2
0.1
0
0
2
4
6
8 10 12 14 16
LED Forward Current (mA)
18
20
0
2
4
6
8 10 12 14 16
LED Forward Current (mA)
18
20
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R05
www.ixysic.com
3
INTEGRATED CIRCUITS DIVISION
LCA182
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
IF=0.25mA
IF=0.5mA
IF=5mA
-40
-20
0
20
40
60
Temperature (ºC)
80
0
20
40
60
Temperature (ºC)
80
0.00
-20
0
20
40
60
Temperature (ºC)
80
Typical Load Current vs. Load Voltage
(IF=2mA)
50
0
-50
-100
-3
-2
-1
0
1
Load Voltage (V)
2
80
100
180
160
IF=2mA
140
AC/DC Configuration
120
100
IF=1mA
IF=2mA
80
IF=1mA
-20
0
20
40
60
Temperature (ºC)
80
-40
100
-20
0
20
40
60
80
Temperature (ºC)
100
120
Typical Leakage vs. Temperature
(Measured across Pins 4 & 6)
430
0.016
425
0.014
420
415
410
405
0.012
0.010
0.008
0.006
0.004
400
0.002
-40
3
20
40
60
Temperature (ºC)
0
395
-150
0
DC Configuration
Typical Blocking Voltage
vs. Temperature
Blocking Voltage (VP)
100
-20
60
-40
100
10
200
0.10
0.00
-40
20
210
0.15
0.05
30
Maximum Load Current
vs. Temperature
0.20
0.05
40
-40
Leakage (PA)
0.10
IF=1mA
IF=2mA
IF=5mA
50
100
Load Current (mA)
LED Current (mA)
LED Current (mA)
-20
0.25
0.15
150
60
Typical IF for Switch Dropout
vs. Temperature
(IL=70mADC)
0.30
0.20
Typical On-Resistance
vs. Temperature
(IL=70mADC)
0
-40
0.25
Load Current (mA)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
100
Typical IF for Switch Operation
vs. Temperature
(IL=70mADC)
0.30
Typical Turn-Off Time
vs. Temperature
(IF=0.25mA, IL=70mADC)
On-Resistance (:)
Typical Turn-On time
vs. Temperature
(IL=70mADC)
Turn-Off Time (ms)
Turn-On Time (ms)
PERFORMANCE DATA*
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
www.ixysic.com
R05
INTEGRATED CIRCUITS DIVISION
LCA182
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
LCA182S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
LCA182S
250ºC
30 seconds
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
LCA182
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
R05
www.ixysic.com
5
INTEGRATED CIRCUITS DIVISION
LCA182
MECHANICAL DIMENSIONS
LCA182
8.382±0.381
(0.330±0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54±0.127
(0.100±0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144±0.508
(0.360±0.020)
6.350±0.127
(0.250±0.005)
1.524 TYP
(0.060 TYP)
Pin 1
1.651±0.254
(0.065±0.010)
2.540±0.127
(0.100±0.005)
7.620±0.127
(0.300±0.005)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
5.080±0.127
(0.200±0.005)
Controlling dimension: inches
3.302±0.051
(0.130±0.002)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457±0.076
(0.018±0.003)
LCA182S
8.382±0.381
(0.330±0.015)
9.524±0.508
(0.375±0.020)
Pin 1
0.635±0.127
(0.025±0.005)
2.54
(0.10)
6.350±0.127
(0.250±0.005)
0.457±0.076
(0.018±0.003)
1.651±0.254
(0.065±0.010)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302±0.051
(0.130±0.002)
4.445±0.254
(0.175±0.010)
Controlling dimension: inches
1.524 TYP
(0.060 TYP)
1.651±0.254
(0.065±0.010)
6
PCB Land Pattern
2.54±0.127
(0.100±0.005)
Dimensions
mm
(inches)
www.ixysic.com
R05
INTEGRATED CIRCUITS DIVISION
LCA182
LCA182STR Tape & Reel
330.2 Dia
(13.00 Dia)
P1 = 12.00
(0.472)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
A0 = 10.10
(0.398)
User Direction of Feed
Embossed
Carrier
Embossment
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
7
Specification: DS-LCA182-R05
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
11/3/2021
