LCA717

LCA717 30V, 2A Single-Pole, Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 30 2 0.15 Units VP Arms / ADC  Features • Very Low Maximum On-Resistance: 0.15 • High Load Current: 2A • 3750Vrms Input/Output Isolation • Low Drive Power Requirements • Greater Reliability than Electromechanical Relays • No EMI/RFI Generation • Small 6-Pin Package • Flammability Rating UL 94 V-0 • Surface Mount, Tape & Reel Version Available Applications • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment: Patient/Equipment Isolation • Industrial Controls Description The LCA717 is a 30V single-pole, normally open (1-Form-A) Solid State Relay. It uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation, and features an ultra-low on-resistance for high-current operation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Offering the superior reliability associated with semiconductor devices, the LCA717 can be used to replace mechanical relays. Because it has no moving parts, it can offer faster, bounce-free switching in a more compact surface mount or thru-hole package. Approvals • UL Recognized Component: File # E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LCA717 LCA717S LCA717STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration Switching Characteristics of Normally Open Devices AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Load Form-A Do Not Use IF Load 90% + Control – Control Do Not Use DS-LCA717-R06 1 6 2 5 3 4 10% ILOAD DC Only Configuration ton toff + Load – Load www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LCA717 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 30 5 50 1 100 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units IL=1A VDRM 30 - - VP - IL - - t=10ms ILPK - - 2 4 ±5 Arms / ADC ADC AP IL=1A RON - ILEAK - 0.15 0.04 1  VL=30VP 0.083 0.023 - - 0.92 0.44 100 3 3 - µA IF=0mA, VL=15V, f=1MHz ton toff COUT IL=1A IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.115 1.36 - 2 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V - ms pF 1 Measurement taken within 1 second of on-time. ESD Rating ESD Rating (Human Body Model) 1000 Volts 2 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LCA717 PERFORMANCE DATA* Typical Turn-On Time Distribution (N=50, IF=5mA, IL=120mA) Typical LED Forward Voltage Drop (N=50, IF=5mA) Device Count (N) Device Count (N) 25 20 15 10 25 25 20 20 Device Count (N) 30 15 10 5 5 0 5 Typical On-Resistance Distribution (N=50, IF=2mA, IL=1A) 15 10 5 0.105 0.110 0.115 0.120 0.125 LED Forward Current (mA) 15 10 5 15 10 5 0 0 0.130 80.0 81.5 83.0 84.5 86.0 87.5 89.0 36.4 36.7 On-Resistance (m:) Typical Turn-On Time vs. LED Forward Current Typical LED Forward Voltage Drop vs. Temperature 1.8 0.46 20 Device Count (N) Device Count (N) 20 0.42 0.43 0.44 0.45 Turn-Off Time (ms) Blocking Voltage Distribution (N=50) 20 0 0.41 0.730 0.785 0.840 0.895 0.950 1.005 1.060 Turn-On Time (ms) 25 Device Count (N) 10 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=500mA) LED Forward Voltage Drop (V) 15 0 1.364 37.0 37.3 37.6 37.9 Blocking Voltage (VP) 38.2 Typical Turn-Off Time vs. LED Forward Current 5000 450 4000 430 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 Turn-Off Time (Ps) Turn-On Time (Ps) 1.7 3000 2000 1000 410 390 370 1.1 0 1.0 0.17 -25 0 25 50 Temperature (ºC) 75 Typical IF for Switch Operation vs. Temperature (IL=1A) 10 20 30 40 LED Forward Current (mA) 50 Turn-On Time (Ps) 0.15 0.14 0.13 0.12 0.11 650 3000 2500 IF=2mA 2000 1500 IF=5mA 1000 20 40 60 Temperature (ºC) 80 100 0 -40 50 700 IF=1mA IF=1mA 600 IF=2mA 550 500 450 400 IF=5mA 350 500 0 10 20 30 40 LED Forward Current (mA) Typical Turn-Off Time vs. Temperature 4000 3500 -20 0 Typical Turn-On Time vs. Temperature 0.16 0.10 -40 350 0 100 Turn-Off Time (Ps) -50 LED Forward Current (mA) Typical Turn-Off Time Distribution (N=50, IF=5mA, IL=120mA) -20 0 20 40 60 Temperature (ºC) 80 100 300 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCA717 PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=2mA, IL=1A) 0.12 Maximum Load Current vs. Temperature DC-Only Configuration (ADC) 0.08 0.07 AC/DC Configuration (ADC/Arms) 2 1.0 0.5 0.0 -0.5 -1.0 -1.5 0 0 20 40 60 Temperature (ºC) 80 100 -40 Typical Blocking Voltage vs. Temperature (IL=1PA) 350 38.5 38.0 37.5 37.0 36.5 36.0 -20 0 20 40 60 Temperature (ºC) 80 100 -20 0 20 40 60 Temperature (ºC) 80 100 -2.0 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 Load Voltage (V) Typical Leakage vs. Temperature Measured Across Pins 4&6 (VL=30V) Energy Rating Curve 8 300 7 250 6 Load Current (A) -20 Leakage Current (nA) Blocking Voltage (VP) 3 1 0.06 35.5 -40 Load Current (A) Load Current On-Resistance (:) 0.09 39.0 1.5 4 0.10 0.05 -40 2.0 5 0.11 Typical Load Current vs. Load Voltage (IF=2mA) 200 150 100 50 0 -40 5 4 3 2 1 -20 0 20 40 60 Temperature (ºC) 80 100 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LCA717 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LCA717S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LCA717S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LCA717 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCA717 MECHANICAL DIMENSIONS LCA717 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) LCA717S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LCA717 LCA717STR Tape & Reel P1 = 12.00 (0.472) 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LCA717-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/2/2021