LCB717
30V, 1.5A Single-Pole
Normally Closed Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
30
1.5
0.3
2
Units
VP
Arms / ADC
mA
Features
•
•
•
•
•
•
•
•
•
•
1.5A Load Current
0.3 Max On-Resistance
2mA Control Current
3750Vrms Input/Output Isolation
Low Drive Power Requirements
Greater Reliability than Electromechanical Relays
No EMI/RFI Generation
Flammability Rating UL 94 V-0
Small 6-Pin Package
Tape & Reel, Surface Mount Version Available
Applications
•
•
•
•
•
•
•
•
•
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Medical Equipment-Patient/Equipment Isolation
Security
Industrial Controls
Description
LCB717 is a single-pole normally closed
(1-Form-B) solid state relay that uses optically
coupled technology to provide an enhanced 3750Vrms
isolation barrier between the input and the output of
the relay. The efficient MOSFET switches use IXYS
Integrated Circuits' patented OptoMOS architecture.
The optically coupled output is controlled by a highly
efficient infrared LED.
Approvals
• UL Recognized Component: File E76270
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part #
LCB717
LCB717S
LCB717STR
Description
6-Lead DIP (50/Tube)
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
+ Load
– Load
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
10%
toff
DS-LCB717-R03
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90%
ton
1
INTEGRATED CIRCUITS DIVISION
LCB717
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
ESD Rating, Human Body Model
Operational Temperature, Ambient
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate output power linearly 6.67 mW / ºC
Ratings
30
5
50
1
Units
VP
V
mA
A
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
100
800
3750
8
-40 to +85
-40 to +125
mW
mW
Vrms
kV
°C
°C
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Blocking Voltage
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance 1
AC/DC Configuration
DC Configuration
Switching Speeds
Turn-On
Turn-Off
Off-State Leakage Current
Output Capacitance
Input Characteristics
Input Control Current to Activate 2
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
30
-
-
VP
IF=0mA
IL
IF=0mA , t < 10ms
ILPK
-
-
1.5
3
5
Arms / ADC
ADC
A
IF=0mA, IL=1.5A
IF=0mA, IL=3A
RON
-
-
0.3
0.08
ton
-
-
2
toff
COUT
-
160
459
5
1
-
IL=1A
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
1.36
-
2
1.5
10
mA
mA
V
A
VIO=0V, f=1MHz
CIO
-
3
-
pF
IF=5mA, VL=10V
IF=2mA, VL=30V
IF=2mA, VL=25V, f=1MHz
IF=2mA, VL=1V, f=1MHz
ILEAK
1
Measurement taken within 1 second of on-time.
2
For high temperature operation (>60ºC) a minimum LED drive current of 4mA is recommended.
2
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ms
A
pF
R03
INTEGRATED CIRCUITS DIVISION
LCB717
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
Device Count (N)
20
15
10
5
15
10
5
1.364
0.45
1.366
1.368
1.370
1.372
LED Forward Voltage Drop (V)
Typical LED Current to Operate
(N=50, IL=100mA)
25
Device Count (N)
15
10
5
20
15
10
5
2.3
2.6 2.9 3.2 3.5
Turn-Off Time (ms)
3.8
4.1
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=1A)
25
20
15
10
5
0
0
34
0.275 0.300 0.325 0.350 0.375 0.400 0.425
LED Forward Current (mA)
35
36
37
38
39
Blocking Voltage (VP)
0.1700 0.1725 0.1750 0.1775 0.1800 0.1825 0.1850
40
On-Resistance (:)
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
Typical LED Forward Voltage Drop
vs. Temperature
550
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
10
1.6
IF=10mA
IF=5mA
IF=2mA
1.5
1.4
1.3
1.2
540
Turn-Off Time (ms)
Turn-On Time (Ps)
1.7
530
520
510
8
6
4
2
1.1
500
1.0
-50
0.50
-25
0
25
50
Temperature (ºC)
75
0
0
100
Typical LED Current to Operate
vs. Temperature
(IL=750mA)
10
20
30
LED Current (mA)
40
50
0
Typical Turn-On Time
vs. Temperature
(VL=10V, IL=100mA)
600
0.40
0.35
0.30
0.25
0.20
-40
IF=2mA
500
450
400
0
20
40
60
Temperature (ºC)
80
100
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
IF=2mA
10
8
6
IF=5mA
4
IF=10mA
2
0
350
-20
50
12
550
Turn-Off Time (ms)
Turn-On Time (Ps)
0.45
10
20
30
40
LED Forward Current (mA)
14
IF=5mA
LED Current (mA)
10
2.0
5
1.8
15
0.70
25
20
0
LED Forward Voltage Drop (V)
0.50
0.55
0.60
0.65
Turn-On Time (ms)
Typical Blocking Voltage Distribution
(N=50, IF=2mA)
30
20
0
0
0
Device Count (N)
20
Device Count (N)
Device Count (N)
25
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
25
Device Count (N)
30
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R03
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3
INTEGRATED CIRCUITS DIVISION
LCB717
PERFORMANCE DATA*
2.0
1.6
0.19
0.18
0.17
1.0
Load Current (A)
Load Current (A)
0.5
0.0
-0.5
-1.0
1.4
1.2
1.0
0.8
-1.5
-2.0
-0.3
0.15
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Typical On-Resistance vs. Temperature
DC-Only Configuration
(IF=0mA, IL=1.5A)
3.5
0.060
3.0
Load Current (A)
0.065
0.055
0.050
0.045
0.040
0.2
0.3
-20
0
20
40
60
Temperature (ºC)
80
2.0
1.5
1.0
Leakage Current (nA)
41
40
39
38
37
0
20
40
60
Temperature (ºC)
80
0.04 0.06 0.08 0.10
Load Voltage (V)
0.12
80
100
3.5
3.0
2.5
2.0
-40
0.14
800
35
30
25
20
15
10
5
100
20
40
60
Temperature (ºC)
1.0
0.02
-20
0
20
40
60
Temperature (ºC)
80
100
Output Capacitance vs. Load Voltage
(IF=2mA, f=1MHz)
700
600
500
400
300
200
100
0
-20
0
Maximum Load Current vs. Temperature
DC-Only Configuration
(IF=0mA)
Leakage Current vs. Temperature
Measured Across Pins 4 & 6
(IF=4mA, VL=30V)
40
42
-20
1.5
0.0
0.00
100
43
-40
-40
Typical Load Current vs. Load Voltage
DC-Only Configuration
(IF=0mA)
2.5
Typical Blocking Voltage
vs. Temperature
(IF=4mA)
44
-0.1
0.0
0.1
Load Voltage (V)
0.5
0.035
0.030
-40
0.6
-0.2
Load Current (A)
On-Resistance (:)
0.20
0.16
On-Resistance (:)
Maximum Load Current vs. Temperature
AC/DC Configuration
(IF=0mA)
1.5
0.21
Blocking Voltage (VP)
Typical Load Current vs. Load Voltage
AC/DC Configuration
(IF=0mA)
Output Capacitance (pF)
0.22
Typical On-Resistance vs. Temperature
AC/DC Configuration
(IF=0mA, IL=750mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
5
10
15
Load Voltage (V)
20
25
Energy Rating Curve
Load Current (A)
6
5
4
3
2
1
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R03
INTEGRATED CIRCUITS DIVISION
LCB717
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
LCB717S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
LCB717S
250ºC
30 seconds
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
LCB717
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
R03
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5
INTEGRATED CIRCUITS DIVISION
LCB717
Mechanical Dimensions
LCB717
8.382±0.381
(0.330±0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54±0.127
(0.100±0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144±0.508
(0.360±0.020)
6.350±0.127
(0.250±0.005)
1.524 TYP
(0.060 TYP)
Pin 1
1.651±0.254
(0.065±0.010)
2.540±0.127
(0.100±0.005)
7.620±0.127
(0.300±0.005)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
5.080±0.127
(0.200±0.005)
Controlling dimension: inches
3.302±0.051
(0.130±0.002)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457±0.076
(0.018±0.003)
LCB717S
8.382±0.381
(0.330±0.015)
9.524±0.508
(0.375±0.020)
Pin 1
0.635±0.127
(0.025±0.005)
2.54
(0.10)
6.350±0.127
(0.250±0.005)
0.457±0.076
(0.018±0.003)
1.651±0.254
(0.065±0.010)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302±0.051
(0.130±0.002)
4.445±0.254
(0.175±0.010)
Controlling dimension: inches
1.524 TYP
(0.060 TYP)
1.651±0.254
(0.065±0.010)
6
PCB Land Pattern
2.54±0.127
(0.100±0.005)
Dimensions
mm
(inches)
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R03
INTEGRATED CIRCUITS DIVISION
LCB717
LCB717S Tape & Reel
P1 = 12.00
(0.472)
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
A0 = 10.10
(0.398)
User Direction of Feed
Embossed
Carrier
Embossment
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
7
Specification: DS-LCB717-R03
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
11/3/2021
