LCC110
350V, 120mA 1-Form-C Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
350
120
35
Units
VP
mArms / mADC
Featurges
•
•
•
•
•
•
•
•
•
•
3750Vrms Input/Output Isolation
1-Form-C Solid State Relay
Low Drive Power Requirements
Greater Reliability than Electromechanical Relays
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Small 8-pin Packages
Flammability Rating UL 94 V-0
Surface Mount Tape & Reel Versions Available
Description
LCC110P is a 350V, 120mA, 35 1-Form-C relay.
This device is ideal for applications where a signal
needs to be switched between two different lines. The
small 8-lead package makes it an ideal space-saving
replacement for a 1-Form-C electromechanical relay
(EMR).
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part #
LCC110
Description
8-Pin DIP (50/Tube)
LCC110P
8-Pin Flatpack (50/Tube)
Applications
LCC110PTR
8-Pin Flatpack Tape & Reel (1000/Reel)
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Industrial Controls
LCC110S
8-Pin Surface Mount (50/Tube)
LCC110STR
8-Pin Surfact Mount Tape & Reel (1000/Reel)
Pin Configuration
Do Not Use
+ Control
– Control
Do Not Use
1
8
2
7
3
6
4
5
Normally Closed Pole
Normally Open Pole
Switching Characteristics for a
1-Form-C Device
IF
90%
10%
Form-A ILOAD
t on
Form-B ILOAD
t off
90%
10%
t off
DS-LCC110-R08
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t on
1
INTEGRATED CIRCUITS DIVISION
LCC110
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operating Temperature, Ambient
Storage Temperature
1
2
Min
3750
-40
-40
Max
350
5
50
1
150
800
+85
+125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Unit
VP
V
mA
A
mW
mW
Vrms
ºC
ºC
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Derate linearly 1.33mW / ºC.
Derate output power linearly 6.67mW / ºC.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Blocking Voltage
Load Current 1
Continuous
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
2
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
350
-
-
VP
t=10ms
IL=120mA
VL=350VP
IL
ILPK
RON
ILEAK
-
23
-
120
±350
35
1
mArms / mADC
mAP
VL=50V, f=1MHz
ton
toff
COUT
-
25
4
4
-
IL=120mA
IF=10mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.42
-
8
1.56
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=8mA, VL=10V
µA
ms
pF
If both poles operate simultaneously, then load current must be derated in order not to exceed package power dissipation value.
Measurement taken within one second of on-time.
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R08
INTEGRATED CIRCUITS DIVISION
LCC110
COMMON PERFORMANCE DATA*
20
15
10
5
0
1.416
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
1.8
1.7
1.6
Leakage (PA)
25
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
30
Typical LED Forward Voltage Drop
(N=50, IF=10mA)
IF=10mA
IF=5mA
IF=2mA
1.5
1.4
1.3
1.2
1.1
1.0
-50
1.418
1.420
1.422
1.424
LED Forward Voltage Drop (V)
-25
0
25
50
Temperature (ºC)
75
100
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
FORM-A RELAY PERFORMANCE DATA*
Form-A
Typical Turn-On Time
(N=50, IF=8mA, IL=120mADC)
25
15
10
5
0
15
10
5
5.2
20
25
15
10
5
0.14
0.23
0.32
0.41
Turn-Off Time (ms)
1.2
2.0
2.8
3.6
4.4
LED Current (mA)
5.2
15
10
0.50
19.5
20.5
21.5 22.5 23.5 24.5
On-Resistance (:)
25.5
Form-A
Typical Blocking Voltage Distribution
(N=50)
Form-A
Typical IF for Switch Dropout
(N=50, IL=120mADC)
35
30
20
15
10
5
25
20
15
10
5
0
0
20
0
0.05
Form-A
Typical IF for Switch Operation
(N=50, IL=120mADC)
25
5
Device Count (N)
2.8
3.6
4.4
Turn-On Time (ms)
Device Count (N)
Device Count (N)
2.0
Form-A
Typical On-Resistance Distribution
(N=50, IF=8mA, IL=120mADC)
30
20
0
1.2
25
35
Device Count (N)
20
Device Count (N)
Device Count (N)
25
Form-A
Typical Turn-Off Time
(N=50, IF=8mA, IL=120mADC)
0
1.2
2.0
2.8
3.6
4.4
LED Current (mA)
5.2
400
420
440 460 480 500
Blocking Voltage (VP)
520
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R08
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3
INTEGRATED CIRCUITS DIVISION
LCC110
FORM-A RELAY PERFORMANCE DATA*
Form-A
Typical Turn-On Time
vs. LED Forward Current
(IL=120mADC)
1.0
6
0.7
0.6
0.5
0.4
2
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
0.25
LED Current (mA)
0.15
0.10
0.05
-20
0
20
40
60
Temperature (ºC)
80
10 15 20 25 30 35 40
LED Forward Current (mA)
45
4
3
2
50
40
150
35
25
20
15
10
-20
0
20
40
60
Temperature (ºC)
80
-20
0
20
40
60
Temperature (ºC)
80
80
100
Form-A
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=120mADC)
0.25
0.20
0.15
0.10
50
0
-50
100
-20
0
20
40
60
Temperature (ºC)
180
160
140
120
100
IF=20mA
IF=10mA
IF=8mA
80
60
40
-150
-40
100
Form-A
Maximum Load Current
vs. Temperature
Form-A
Typical Load Current vs. Load Voltage
(IF=8mA)
-100
5
80
0.30
0
-40
100
100
Load Current (mA)
30
20
40
60
Temperature (ºC)
0.05
-40
Form-A
Typical On-Resistance
vs. Temperature
(IF=8mA, IL=120mADC)
0
0.35
5
Load Current (mA)
5
-20
0.40
0
0
0.4
-40
1
0
0.6
100
Form-A
Typical IF for Switch Dropout
vs. Temperature
(IL=120mADC)
6
0.20
0.8
0
-40
Form-A
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
1.0
0.2
Turn-Off Time (ms)
0
Turn-Off Time (ms)
3
0
0.2
On-Resistance (:)
4
1
0.3
IF=8mA
IF=10mA
IF=20mA
1.2
Turn-On Time (ms)
0.8
Form-A
Typical Turn-On Time
vs. Temperature
(IL=120mADC)
1.4
5
LED Current (mA)
Turn-On Time (ms)
0.9
0
Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=120mADC)
-3
-2
-1
0
1
Load Voltage (V)
2
3
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Form-A
Typical Blocking Voltage
vs. Temperature
420
Blocking Voltage (VP)
415
410
405
400
395
390
385
380
375
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R08
INTEGRATED CIRCUITS DIVISION
LCC110
FORM-B RELAY PERFORMANCE DATA*
Form-B
Typical Turn-On Time
(N=50, IF=8mA, IL=120mADC)
30
30
15
10
15
10
0.07
0.09
0.11
Turn-On Time (ms)
0.13
Form-B
Typical IF for Switch Operation
(N=50, IL=120mADC)
30
25
Device Count (N)
25
20
15
10
5
0.28
0.35
0.42
0.49
Turn-Off Time (ms)
1.2
2.0
4.4
2.8
3.6
LED Current (mA)
25.5
Form-B
Typical IF for Switch Dropout
(N=50, IL=120mADC)
30
15
10
5
0.075
2.8
3.6
4.4
LED Current (mA)
0.072
0.071
4
3
2
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
-40
50
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
0.40
-20
0
20
40
60
Temperature (ºC)
80
100
Form-B
Typical IF for Switch Dropout
vs. Temperature
(IL=120mADC)
6
LED Current (mA)
0.30
0.25
0.20
Turn-Off Time (ms)
5
0.35
4
3
2
1
0.15
0
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
-40
-20
0
20
40
60
Temperature (ºC)
80
375
100
385 395 405 415
Blocking Voltage (VP)
425
Form-B
Typical Turn-On Time
vs. Temperature
(IF=8mA, IL=120mADC)
0.20
0.15
0.10
0.05
0
-40
0
0
10
0.25
1
0.070
15
365
Turn-On Time (ms)
LED Current (mA)
0.073
Form-B
Typical Blocking Voltage Distribution
(N=50, IF=8mA)
20
5.2
5
0.074
31.5
0
2.0
Form-B
Typical IF for Switch Operation
vs. Temperature
(IL=120mADC)
6
27.5 28.5 29.5 30.5
On-Resistance (:)
5
1.2
Form-B
Typical Turn-On Time
vs. LED Forward Current
(IL=120mADC)
26.5
25
20
5.2
10
0.56
0
0
15
0
0.21
Device Count (N)
0.05
20
5
0
0.03
Device Count (N)
20
5
0
Form-B
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=120mADC)
25
Device Count (N)
20
5
Turn-On Time (ms)
30
25
Device Count (N)
Device Count (N)
25
Turn-Off Time (ms)
Form-B
Typical Turn-Off Time
(N=50, IF=8mA, IL=120mADC)
-20
0
20
40
60
Temperature (ºC)
80
100
80
100
Form-B
Typical Turn-Off Time
vs. Temperature
(IL=120mADC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
IF=8mA
IF=10mA
IF=20mA
-40
-20
0
20
40
60
Temperature (ºC)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R08
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5
INTEGRATED CIRCUITS DIVISION
LCC110
FORM-B RELAY PERFORMANCE DATA*
Form-B
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=120mADC)
150
40
30
20
10
160
100
50
0
-50
-100
0
-20
0
20
40
60
Temperature (ºC)
80
100
140
120
100
80
60
40
-150
-40
Form-B
Maximum Load Current
vs. Temperature
(IF=0mA)
180
Load Current (mA)
50
Load Current (mA)
On-Resistance (:)
60
Form-B
Typical Load Current vs. Load Voltage
(IF=0mA)
-4
-3
-2
-1
0
1
Load Voltage (V)
2
3
4
80
100
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Form-B
Typical Blocking Voltage
vs. Temperature
(IF=8mA)
Blocking Voltage (VP)
420
415
410
405
400
395
390
385
380
-40
-20
0
20
40
60
Temperature (ºC)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
6
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R08
INTEGRATED CIRCUITS DIVISION
LCC110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
LCC110S / LCC110P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
LCC110S
LCC110P
250ºC
260ºC
30 seconds
30 seconds
3
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
LCC110
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
R08
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7
INTEGRATED CIRCUITS DIVISION
LCC110
Mechanical Dimensions
LCC110
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.762 DIA.
(8-0.030 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LCC110S
PCB Land Pattern
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LCC110P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
8
PCB Land Pattern
Dimensions
mm
(inches)
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R08
INTEGRATED CIRCUITS DIVISION
LCC110
LCC110STR Tape & Reel
2.0
(0.08)
4.0
(0.16)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
7.5
(0.30)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
16.0±0.3
(0.63±0.012)
Ao=10.30
(0.406)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
P1=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
3. Controlling dimension: mm
LCC110PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
7.50
(0.295)
Embossment
W = 16.00
(0.63)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P1 = 12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
3. Controlling dimension: mm
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
9
Specification: DS-LCC110-R08
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
11/3/2021
