LCC120
250V, 170mA 1-Form-C Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
250
170
20
Units
VP
mArms / mADC
Features
•
•
•
•
•
•
•
•
•
•
3750Vrms Input/Output Isolation
1-Form-C Solid State Relay
Low Drive Power Requirements
Greater Reliability than Electromechanical Relays
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Small 8-pin Package
Flammability Rating UL 94 V-0
Surface Mount Tape & Reel Version Available
Description
LCC120P is a 250V, 170mA, 20 1-Form-C relay. It
is ideal for applications focused on peak load current
handling capablilities.
This device is perfect for applications where a signal
needs to be switched between two different lines. The
small 8-lead package makes it an ideal space-saving
replacement for a 1-Form-C electromechanical relay
(EMR).
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Industrial Controls
Part #
LCC120
Description
8-Pin DIP (50/Tube)
LCC120S
8-Pin Surface Mount (50/Tube)
LCC120STR
8-Pin Surfact Mount Tape & Reel (1000/Reel)
Pin Configuration
Do Not Use
+ Control
– Control
Do Not Use
1
8
2
7
3
6
4
5
Normally Closed Pole
Normally Open Pole
Switching Characteristics for a
Form-C Device
IF
90%
10%
Form-A ILOAD
t on
Form-B ILOAD
t off
90%
10%
t off
DS-LCC120-R11
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t on
1
INTEGRATED CIRCUITS DIVISION
LCC120
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operating Temperature, Ambient
Storage Temperature
1
2
Min
3750
-40
-40
Max
250
5
50
1
150
800
+85
+125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Unit
VP
V
mA
A
mW
mW
Vrms
ºC
ºC
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Derate linearly 1.33mW / ºC.
Derate output power linearly 6.67mW / ºC.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Blocking Voltage
Load Current
Continuous
Peak
On-Resistance 1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
250
-
-
VP
t=10ms
IL=170mA
VL=250VP
IL
ILPK
RON
ILEAK
-
16
-
170
±400
20
1
mArms / mADC
mAP
VL=50V, f=1MHz
ton
toff
COUT
-
50
5
5
-
IL=170mA
IF=10mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.42
-
10
1.56
10
mA
mA
V
A
VIO=0V, f=1MHz
CIO
-
3
-
pF
IF=10mA, VL=10V
µA
ms
pF
1 Measurement taken within 1 second of on-time.
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INTEGRATED CIRCUITS DIVISION
LCC120
COMMON PERFORMANCE DATA*
20
15
10
5
0
1.416
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
1.8
0.016
1.7
0.014
1.6
Leakage (PA)
25
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
30
Typical LED Forward Voltage Drop
(N=50, IF=10mA)
IF=10mA
IF=5mA
IF=2mA
1.5
1.4
1.3
0.012
0.010
0.008
0.006
1.2
0.004
1.1
0.002
1.0
-50
1.418
1.420
1.422
1.424
LED Forward Voltage Drop (V)
-25
0
25
50
Temperature (ºC)
75
0
-40
100
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
1.2
Load Current (A)
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
FORM-A RELAY PERFORMANCE DATA*
25
15
10
5
0
1.35
1.65
1.95
Turn-On Time (ms)
15
10
5
2.25
20
25
15
10
5
0
1.75
2.45 3.15 3.85
LED Current (mA)
4.55
5.25
20
15
10
0
0.32
0.41
0.50
0.59
Turn-Off Time (ms)
0.68
8.5
8.8
9.1
9.4
9.7 10.0
On-Resistance (:)
10.3
Form-A
Typical Blocking Voltage Distribution
(N=50)
Form-A
Typical IF for Switch Dropout
(N=50, IL=170mADC)
35
30
20
15
10
5
25
20
15
10
5
0
1.05
25
5
0.23
Form-A
Typical IF for Switch Operation
(N=50, IL=170mADC)
Form-A
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=170mADC)
30
20
Device Count (N)
1.05
Device Count (N)
Device Count (N)
35
0
0.75
25
Form-A
Typical Turn-Off Time
(N=50, IF=10mA, IL=170mADC)
Device Count (N)
20
Device Count (N)
Device Count (N)
25
Form-A
Typical Turn-On Time
(N=50, IF=10mA, IL=170mADC)
0
1.05
1.75
2.45 3.15 3.85
LED Current (mA)
4.55
5.25
330
340
350 360 370 380
Blocking Voltage (VP)
390
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
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3
INTEGRATED CIRCUITS DIVISION
LCC120
FORM-A RELAY PERFORMANCE DATA*
Form-A
Typical Turn-On Time
vs. LED Forward Current
(IL=170mADC)
1.0
6
0.7
0.6
0.5
0.4
4
3
2
1
0.3
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
Form-A
Typical Turn-Off Time
vs. LED Forward Current
(IL=170mADC)
0.25
LED Current (mA)
0.15
0.10
0.05
-20
0
20
40
60
Temperature (ºC)
80
10 15 20 25 30 35 40
LED Forward Current (mA)
45
4
3
2
50
12
Load Current (mA)
8
6
4
2
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
80
100
0.6
0.5
0.4
0.3
0.2
-40
100
200
50
0
-50
100
-3
-2
-1
0
1
Load Voltage (V)
2
3
-20
0
20
40
60
Temperature (ºC)
Form-A
Maximum Load Current
vs. Temperature
250
-150
-40
100
Form-A
Typical Turn-Off Time
vs. Temperature
(IF=10mA, IL=170mADC)
150
-100
0
80
0
-20
Form-A
Typical Load Current vs. Load Voltage
(IF=10mA)
10
20
40
60
Temperature (ºC)
0.1
-40
Form-A
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=170mADC)
0
0.7
5
Load Current (mA)
5
-20
0.8
0
0
0.4
-40
1
0
0.6
100
Form-A
Typical IF for Switch Dropout
vs. Temperature
(IL=170mADC)
6
0.20
0.8
0
-40
Turn-Off Time (ms)
0
IF=10mA
IF=15mA
IF=20mA
1.0
0.2
0
0.2
Turn-Off Time (ms)
Turn-On Time (ms)
0.8
Form-A
Typical Turn-On Time
vs. Temperature
(IL=170mADC)
1.2
5
LED Current (mA)
Turn-On Time (ms)
0.9
On-Resistance (:)
Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=170mADC)
IF=30mA
IF=20mA
IF=10mA
150
100
50
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Form-A
Typical Blocking Voltage
vs. Temperature
350
Blocking Voltage (VP)
345
340
335
330
325
320
315
310
305
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
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INTEGRATED CIRCUITS DIVISION
LCC120
FORM-B RELAY PERFORMANCE DATA*
Form-B
Typical Turn-On Time
(N=50, IF=10mA, IL=170mADC)
30
30
15
10
15
10
0.45
0.55
0.65
Turn-On Time (ms)
0.6
Form-B
Typical IF for Switch Operation
(N=50, IL=170mADC)
30
Device Count (N)
20
15
10
5
1.0
1.4
1.8
2.2
Turn-Off Time (ms)
9.3
30
1.2
2.0
2.8
3.6
4.4
LED Current (mA)
5.2
15
10
5
Form-B
Typical Turn-On Time
vs.LED Forward Current
(IL=170mADC)
0.45
1.75
2.45 3.15 3.85
LED Current (mA)
4.55
0.25
Form-B
Typical IF for Switch Operation
vs. Temperature
(IL=170mADC)
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
4
3
2
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=170mADC)
1.6
-20
0
20
40
60
Temperature (ºC)
80
0.20
0.15
0.10
0.8
4
3
2
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
0
20
40
60
Temperature (ºC)
80
100
80
100
Form-B
Typical Turn-Off Time
vs. Temperature
(IL=170mADC)
IF=10mA
IF=15mA
IF=20mA
2.0
1.5
1.0
0.5
0
0
0.4
-20
2.5
1
0.6
0
-40
Turn-Off Time (ms)
LED Current (mA)
1.0
Form-B
Typical Turn-On Time
vs. Temperature
(IF=10mA, IL=170mADC)
0.25
100
5
1.2
365
0.30
Form-B
Typical IF for Switch Dropout
vs. Temperature
(IL=170mADC)
6
1.4
297 314 331 348
Blocking Voltage (VP)
0.05
-40
50
280
0.35
0
0
10
0.40
1
0.20
15
263
Turn-On Time (ms)
LED Current (mA)
0.30
Form-B
Typical Blocking Voltage Distribution
(N=50, IF=10mA)
20
5.25
5
0.35
14.7
0
6
0.40
11.1 12.0 12.9 13.8
On-Resistance (:)
5
1.05
6.0
10.2
25
20
0
0
10
2.6
Form-B
Typical IF for Switch Dropout
(N=50, IL=170mADC)
25
25
15
0
0.75
Device Count (N)
0.35
20
5
0
0.25
Device Count (N)
20
5
0
Form-B
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=170mADC)
25
Device Count (N)
20
5
Turn-On Time (ms)
30
25
Device Count (N)
Device Count (N)
25
Turn-Off Time (ms)
Form-B
Typical Turn-Off Time
(N=50, IF=10mA, IL=170mADC)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R11
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5
INTEGRATED CIRCUITS DIVISION
LCC120
FORM-B RELAY PERFORMANCE DATA*
150
50
Load Current (mA)
On-Resistance (:)
60
40
30
20
10
Form-B
Typical Load Current vs. Load Voltage
(IF=0mA)
100
50
0
-50
-100
0
-150
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Form B
Maximum Load Current
vs. Temperature
(IF=0mA)
250
Load Current (mA)
Form-B
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=170mADC)
200
150
100
50
0
-4
-3
-2
-1
0
1
Load Voltage (V)
2
3
4
80
100
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Form-B
Typical Blocking Voltage
vs. Temperature
(IF=10mA)
Blocking Voltage (VP)
320
310
300
290
280
270
260
250
240
-40
-20
0
20
40
60
Temperature (ºC)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
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INTEGRATED CIRCUITS DIVISION
LCC120
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
LCC120S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
LCC110S
250ºC
30 seconds
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
LCC120
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
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7
INTEGRATED CIRCUITS DIVISION
LCC120
Mechanical Dimensions
LCC120
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
8-0.762 DIA.
(8-0.030 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
3.302 ± 0.051
(0.130 ± 0.002)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LCC120S
PCB Land Pattern
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
2.54
(0.10)
9.525 ± 0.254
(0.375 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LCC120STR Tape & Reel
2.0
(0.08)
4.0
(0.16)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
7.5
(0.30)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
16.0±0.3
(0.63±0.012)
Ao=10.30
(0.406)
P1=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
3. Controlling dimension: mm
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
8
Specification: DS-LCC120-R11
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
11/4/2021
