MMO90-14io6
Thyristor
VRRM
=
1400 V
I TAV
=
50 A
VT
=
1.2 V
AC Controlling
1~ full-controlled
Part number
MMO90-14io6
Backside: isolated
2
3
1
4
Features / Advantages:
Applications:
Package: SOT-227B (minibloc)
● Thyristor for line frequency
● Planar passivated chip
● Long-term stability
● Line rectifying 50/60 Hz
● Softstart AC motor control
● DC Motor control
● Power converter
● AC power control
● Lighting and temperature control
● Isolation Voltage: 3000 V~
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
● Base plate: Copper
internally DCB isolated
● Advanced power cycling
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20200120c
MMO90-14io6
Ratings
Thyristor
Conditions
Symbol
VRSM/DSM
Definition
max. non-repetitive reverse/forward blocking voltage
TVJ = 25°C
VRRM/DRM
max. repetitive reverse/forward blocking voltage
TVJ = 25°C
1400
I R/D
reverse current, drain current
VT
forward voltage drop
min.
typ.
VR/D = 1400 V
TVJ = 25°C
100
µA
TVJ = 125°C
10
mA
IT =
TVJ = 25°C
1.27
V
1.53
V
1.20
V
IT =
50 A
TVJ = 150 °C
50 A
I T = 100 A
I TAV
average forward current
TC = 95 °C
I RMS
RMS forward current per phase
180° sine
VT0
threshold voltage
rT
slope resistance
R thJC
thermal resistance junction to case
for power loss calculation only
RthCH
thermal resistance case to heatsink
total power dissipation
I TSM
max. forward surge current
I²t
value for fusing
V
VR/D = 1400 V
I T = 100 A
Ptot
max. Unit
1500
V
1.50
V
T VJ = 150 °C
50
A
110
A
TVJ = 150 °C
0.88
V
6
mΩ
0.6 K/W
0.1
K/W
TC = 25°C
210
W
t = 10 ms; (50 Hz), sine
TVJ = 45°C
800
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
865
A
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
680
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
735
A
t = 10 ms; (50 Hz), sine
TVJ = 45°C
3.20 kA²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
3.12 kA²s
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
2.31 kA²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
CJ
junction capacitance
VR = 400 V f = 1 MHz
TVJ = 25°C
PGM
max. gate power dissipation
t P = 30 µs
T C = 150 °C
2.25 kA²s
32
t P = 300 µs
pF
10
W
5
W
0.5
W
PGAV
average gate power dissipation
(di/dt) cr
critical rate of rise of current
TVJ = 150 °C; f = 50 Hz
repetitive, IT = 150 A
t P = 200 µs; di G /dt = 0.3 A/µs;
(dv/dt)cr
critical rate of rise of voltage
V = ⅔ VDRM
VGT
gate trigger voltage
VD = 6 V
TVJ = 25 °C
TVJ = -40 °C
1.6
V
I GT
gate trigger current
VD = 6 V
TVJ = 25 °C
100
mA
TVJ = -40 °C
200
mA
VGD
gate non-trigger voltage
TVJ = 150°C
0.2
V
I GD
gate non-trigger current
5
mA
IL
latching current
TVJ = 25 °C
250
mA
IG =
0.3 A; V = ⅔ VDRM
non-repet., I T =
100 A/µs
50 A
500 A/µs
1000 V/µs
TVJ = 150°C
R GK = ∞; method 1 (linear voltage rise)
VD = ⅔ VDRM
tp =
10 µs
IG =
0.3 A; di G /dt =
1.5
V
0.3 A/µs
IH
holding current
VD = 6 V R GK = ∞
TVJ = 25 °C
100
mA
t gd
gate controlled delay time
VD = ½ VDRM
TVJ = 25 °C
2
µs
tq
turn-off time
IG =
0.3 A; di G /dt =
VR = 100 V; I T =
0.3 A/µs
50A; V = ⅔ VDRM TVJ =125 °C
di/dt = 10 A/µs dv/dt =
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
150
µs
15 V/µs t p = 200 µs
Data according to IEC 60747and per semiconductor unless otherwise specified
20200120c
MMO90-14io6
Package
Ratings
SOT-227B (minibloc)
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-40
typ.
max.
150
Unit
A
-40
150
°C
-40
125
°C
150
°C
30
Weight
g
MD
mounting torque
1.1
1.5
Nm
MT
terminal torque
1.1
1.5
Nm
d Spp/App
creepage distance on surface | striking distance through air
d Spb/Apb
VISOL
terminal to terminal
10.5
terminal to backside
8.6
t = 1 second
isolation voltage
t = 1 minute
50/60 Hz, RMS; IISOL ≤ 1 mA
3.2
mm
6.8
mm
3000
V
2500
V
Product Marking
Logo
XXXXX ®
yywwZ
1234
Date
Code
Location
Ordering
Standard
Part
Number
UL
Lot#
Ordering Number
MMO90-14io6
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
MMO90-14io6
* on die level
Delivery Mode
Tube
Code No.
485144
T VJ = 150°C
Thyristor
V 0 max
threshold voltage
0.88
V
R0 max
slope resistance *
4.2
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Quantity
10
Data according to IEC 60747and per semiconductor unless otherwise specified
20200120c
MMO90-14io6
Outlines SOT-227B (minibloc)
2
3
1
4
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20200120c
MMO90-14io6
Thyristor
120
700
3500
50 Hz, 80% VRRM
100
VR = 0 V
3000
600
80
2500
ITSM
IT
60
I2t
TVJ = 45°C
500
2000
[A]
[A]
[A s]
40
1500
400
125°C
150°C
20
0
0,4
TVJ = 25°C
0,8
1,2
TVJ = 125°C
500
2,0
0,01
0,1
1
1
5
2
2
TVJ = 25°C
typ.
1
80
Limit
IT(AV)M
60
[A]
[µs]
4
40
10
20
4: PGAV = 0.5 W
0,1
5: PGM = 5 W
6: PGM = 10 W
IGD, TVJ = 125°C
1
10
100
1000
dc =
1
0.5
0.4
0.33
0.17
0.08
100
tgd
6
4 5 6 7 8 910
t [ms]
100
3
3
Fig. 3 I t versus time (1-10 ms)
2: IGT, TVJ = 25°C
3: IGT, TVJ = -40°C
VG
2
Fig. 2 Surge overload current
1000
1: IGT, TVJ = 125°C
1
t [s]
VT [V]
10
TVJ = 125°C
1000
300
1,6
Fig. 1 Forward characteristics
[V]
TVJ = 45°C
2
0
1
10
10000
IG [mA]
Fig. 4 Gate trigger characteristics
100
0
1000
25
50
75
100 125 150
TC [°C]
IG [mA]
Fig. 5 Gate controlled delay time
Fig. 6 Max. forward current
at case temperature
0,8
dc =
1
0.5
0.4
0.33
0.17
0.08
80
60
P(AV)
RthHA
0.4
0.6
0.8
1.0
2.0
4.0
0,6
ZthJC
0,4
40
[K/W]
[W]
Rthi [K/W]
0.039
0.150
0.245
0.166
0,2
20
0
0
20
40
60
IT(AV) [A]
0
50
100
150
Tamb [°C]
© 2020 IXYS all rights reserved
101
102
103
104
t [ms]
Fig. 7a Power dissipation versus direct output current
Fig. 7b and ambient temperature
IXYS reserves the right to change limits, conditions and dimensions.
0,0
100
ti [s]
0.0006
0.017
0.104
0.450
Fig. 8 Transient thermal impedance junction to case
Data according to IEC 60747and per semiconductor unless otherwise specified
20200120c
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