OAA160

OAA160 250V, 50mA Dual Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 250 50 100 Units V mArms / mADC  Features • Fast Switching Times: 0.125ms • Low Off-State Leakage Current: 25nA • 3750Vrms Input/Output Isolation • Low Drive Power Requirements • Greater Reliability than Electromechanical Relays • No EMI/RFI Generation • Small 8-Pin Package • Surface Mount, Tape & Reel Versions Available • Flammability Rating UL 94 V-0 Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Description OAA160 is a 250V, 50mA, 100 dual normally-open (1-Form-A) relay. This high performance Solid State Relay provides one of the fastest (0.125ms) switching times available for two independent 1-Form-A relays in a single package. Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # OAA160 OAA160P OAA160PTR OAA160S OAA160STR Description 8-Pin DIP (50/tube) 8-Pin Flatpack (50/tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Pole #1 – Control - Pole #1 + Control - Pole #2 – Control - Pole #2 1 8 2 7 3 6 4 5 Normally Open - Pole #1 Normally Open - Pole #2 Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-OAA160-R11 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION OAA160 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current 1 Continuous Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 250 - - VP t=10ms IF=10mA, IL=50mA VL=250VP IL ILPK RON ILEAK - 50 - 50 ±100 100 0.025 mArms / mADC mAP  A IF=0mA, VL=50V, f=1MHz ton toff ton toff COUT - 5 125 125 150 150 - IL=50mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 6 1.5 10 IF=10mA, VL=10V IF=6mA, VL=10V VIO=0V, f=1MHz CIO 3 If both poles operate simultaneously, then load current must be derated in order not to exceed the package power dissipation value. s pF mA mA V A pF Measurement taken within one second of on-time. 2 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION OAA160 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 30 15 10 Device Count (N) Device Count (N) 20 15 10 5 5 0 0 1.364 0.05 Typical IF for Switch Operation (N=50, IL=50mADC) 25 Device Count (N) 15 10 5 0 0.07 0.09 0.11 0.13 Turn-On Time (ms) 2.075 2.525 2.975 3.425 LED Current (mA) 10 5 0.012 0.017 0.022 0.027 0.032 Turn-Off Time (ms) 0.037 Typical On-Resistance Distribution (N=50, IF=10mA, IL=50mADC) 35 30 20 15 10 5 25 20 15 10 5 0 1.625 15 0.15 Typical IF for Switch Dropout (N=50, IL=50mADC) 25 20 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Device Count (N) Device Count (N) 20 Typical Turn-Off Time (N=50, IF=10mA, IL=50mADC) 25 25 25 Device Count (N) Typical Turn-On Time (N=50, IF=10mA, IL=50mADC) 0 3.875 1.625 2.075 2.525 2.975 3.425 LED Current (mA) 3.875 42.5 43.5 44.5 45.5 46.5 On-Resistance (:) 47.5 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 367.5 0.16 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 Typical Turn-Off Time vs. LED Forward Current (IL=50mADC) 0.040 0.14 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 0.18 1.7 402.5 Typical Turn-On Time vs. LED Forward Current (IL=50mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 374.5 381.5 388.5 395.5 Blocking Voltage (VP) 0.12 0.10 0.08 0.06 0.04 0.035 0.030 0.025 0.020 0.02 0.015 0 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R11 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION OAA160 PERFORMANCE DATA* 1.25 Turn-Off Time (ms) 1.00 0.75 IF=10mA 0.50 IF=20mA 0.25 0 -40 0 20 40 60 Temperature (ºC) 80 100 Typical IF for Switch Operation vs. Temperature (IL=50mADC) -40 -20 0 20 40 60 Temperature (ºC) 80 -40 100 0 20 40 60 80 Temperature (ºC) 30 20 0 -20 0 20 40 60 Temperature (ºC) 80 100 -20 0 20 40 60 Temperature (ºC) 80 -40 100 100 -20 120 0 20 40 60 Temperature (ºC) 80 100 Typical Load Current vs. Load Voltage (IF=10mA) 50 40 30 20 10 0 -10 -20 -30 -40 -50 -3 -2 -1 0 1 Load Voltage (V) 2 3 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 400 0.014 395 0.012 390 0.010 385 380 375 370 0.008 0.006 0.004 0.002 365 -20 40 10 Leakage (PA) IF=30mA IF=20mA IF=10mA -40 50 Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) Load Current (mA) 60 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Maximum Load Current vs. Temperature 100 90 80 70 60 50 40 30 20 10 0 70 Typical On-Resistance vs. Temperature (IF=10mA, IL=50mADC) Typical IF for Switch Dropout vs. Temperature LED Current (mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 LED Current (mA) -20 0.050 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 0 -40 Load Current (mA) Turn-On Time (ms) 1.50 Typical Turn-Off Time vs. Temperature (IF=10mA, IL=50mADC) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=50mADC) -40 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 0.45 Load Current (A) 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION OAA160 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification OAA160S / OAA160P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles OAA160S OAA160P 250ºC 260ºC 30 seconds 30 seconds 3 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device OAA160 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R11 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION OAA160 Mechanical Dimensions OAA160 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) OAA160P 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 8.70 (0.3425) 1.55 (0.0610) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) PCB Land Pattern 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) OAA160S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 6 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION OAA160 OAA160PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm OAA160STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-OAA160-R11 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/4/2021